Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Cham
Springer
2018
|
| Schriftenreihe: | Springer Series in Advanced Manufacturing Ser
|
| Schlagworte: | |
| Online-Zugang: | HWR01 |
| Beschreibung: | Description based on publisher supplied metadata and other sources |
| Beschreibung: | 1 online resource (119 pages) |
| ISBN: | 9783319778723 |
Internformat
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Datensatz im Suchindex
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| dewey-full | 658.51 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 658 - General management |
| dewey-raw | 658.51 |
| dewey-search | 658.51 |
| dewey-sort | 3658.51 |
| dewey-tens | 650 - Management and auxiliary services |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik Wirtschaftswissenschaften |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik Wirtschaftswissenschaften |
| format | Electronic eBook |
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| id | DE-604.BV046689172 |
| illustrated | Not Illustrated |
| index_date | 2024-07-03T14:24:48Z |
| indexdate | 2024-07-10T08:51:12Z |
| institution | BVB |
| isbn | 9783319778723 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032099956 |
| oclc_num | 1034546870 |
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| owner_facet | DE-2070s |
| physical | 1 online resource (119 pages) |
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| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | Springer |
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| series2 | Springer Series in Advanced Manufacturing Ser |
| spelling | Seok, Seonho Verfasser aut Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method Cham Springer 2018 © 2018 1 online resource (119 pages) txt rdacontent c rdamedia cr rdacarrier Springer Series in Advanced Manufacturing Ser Description based on publisher supplied metadata and other sources Wafer level packaging (DE-588)1058582143 gnd rswk-swf MEMS (DE-588)4824724-8 gnd rswk-swf Benzocyclobutan (DE-588)4775842-9 gnd rswk-swf MEMS (DE-588)4824724-8 s Benzocyclobutan (DE-588)4775842-9 s Wafer level packaging (DE-588)1058582143 s DE-604 Erscheint auch als Druck-Ausgabe Seok, Seonho Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method Cham : Springer,c2018 9783319778716 |
| spellingShingle | Seok, Seonho Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method Wafer level packaging (DE-588)1058582143 gnd MEMS (DE-588)4824724-8 gnd Benzocyclobutan (DE-588)4775842-9 gnd |
| subject_GND | (DE-588)1058582143 (DE-588)4824724-8 (DE-588)4775842-9 |
| title | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_auth | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_exact_search | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_exact_search_txtP | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_full | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_fullStr | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_full_unstemmed | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_short | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering |
| title_sort | advanced packaging and manufacturing technology based on adhesion engineering wafer level transfer packaging and fabrication techniques using interface energy control method |
| title_sub | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| topic | Wafer level packaging (DE-588)1058582143 gnd MEMS (DE-588)4824724-8 gnd Benzocyclobutan (DE-588)4775842-9 gnd |
| topic_facet | Wafer level packaging MEMS Benzocyclobutan |
| work_keys_str_mv | AT seokseonho advancedpackagingandmanufacturingtechnologybasedonadhesionengineeringwaferleveltransferpackagingandfabricationtechniquesusinginterfaceenergycontrolmethod |