Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Saved in:
| Main Author: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Cham
Springer
2018
|
| Series: | Springer Series in Advanced Manufacturing Ser
|
| Subjects: | |
| Online Access: | HWR01 |
| Item Description: | Description based on publisher supplied metadata and other sources |
| Physical Description: | 1 online resource (119 pages) |
| ISBN: | 9783319778723 |
Staff View
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV046689172 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 200423s2018 |||| o||u| ||||||eng d | ||
| 020 | |a 9783319778723 |9 978-3-319-77872-3 | ||
| 035 | |a (ZDB-30-PQE)EBC5376068 | ||
| 035 | |a (ZDB-89-EBL)EBL5376068 | ||
| 035 | |a (ZDB-38-EBR)ebr11552488 | ||
| 035 | |a (OCoLC)1034546870 | ||
| 035 | |a (DE-599)BVBBV046689172 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-2070s | ||
| 082 | 0 | |a 658.51 | |
| 084 | |a ZN 3620 |0 (DE-625)157329: |2 rvk | ||
| 100 | 1 | |a Seok, Seonho |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering |b Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| 264 | 1 | |a Cham |b Springer |c 2018 | |
| 264 | 4 | |c © 2018 | |
| 300 | |a 1 online resource (119 pages) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Springer Series in Advanced Manufacturing Ser | |
| 500 | |a Description based on publisher supplied metadata and other sources | ||
| 650 | 0 | 7 | |a Wafer level packaging |0 (DE-588)1058582143 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a MEMS |0 (DE-588)4824724-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Benzocyclobutan |0 (DE-588)4775842-9 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a MEMS |0 (DE-588)4824724-8 |D s |
| 689 | 0 | 1 | |a Benzocyclobutan |0 (DE-588)4775842-9 |D s |
| 689 | 0 | 2 | |a Wafer level packaging |0 (DE-588)1058582143 |D s |
| 689 | 0 | |5 DE-604 | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |a Seok, Seonho |t Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |d Cham : Springer,c2018 |z 9783319778716 |
| 912 | |a ZDB-30-PQE | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-032099956 | ||
| 966 | e | |u https://ebookcentral.proquest.com/lib/hwr/detail.action?docID=5376068 |l HWR01 |p ZDB-30-PQE |q HWR_PDA_PQE |x Aggregator |3 Volltext | |
Record in the Search Index
| _version_ | 1804181409416347649 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author | Seok, Seonho |
| author_facet | Seok, Seonho |
| author_role | aut |
| author_sort | Seok, Seonho |
| author_variant | s s ss |
| building | Verbundindex |
| bvnumber | BV046689172 |
| classification_rvk | ZN 3620 |
| collection | ZDB-30-PQE |
| ctrlnum | (ZDB-30-PQE)EBC5376068 (ZDB-89-EBL)EBL5376068 (ZDB-38-EBR)ebr11552488 (OCoLC)1034546870 (DE-599)BVBBV046689172 |
| dewey-full | 658.51 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 658 - General management |
| dewey-raw | 658.51 |
| dewey-search | 658.51 |
| dewey-sort | 3658.51 |
| dewey-tens | 650 - Management and auxiliary services |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik Wirtschaftswissenschaften |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik Wirtschaftswissenschaften |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02018nmm a2200469zc 4500</leader><controlfield tag="001">BV046689172</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">200423s2018 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783319778723</subfield><subfield code="9">978-3-319-77872-3</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-30-PQE)EBC5376068</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-89-EBL)EBL5376068</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-38-EBR)ebr11552488</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1034546870</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046689172</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-2070s</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">658.51</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 3620</subfield><subfield code="0">(DE-625)157329:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Seok, Seonho</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering</subfield><subfield code="b">Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cham</subfield><subfield code="b">Springer</subfield><subfield code="c">2018</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2018</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (119 pages)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Springer Series in Advanced Manufacturing Ser</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Description based on publisher supplied metadata and other sources</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wafer level packaging</subfield><subfield code="0">(DE-588)1058582143</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">MEMS</subfield><subfield code="0">(DE-588)4824724-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Benzocyclobutan</subfield><subfield code="0">(DE-588)4775842-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">MEMS</subfield><subfield code="0">(DE-588)4824724-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Benzocyclobutan</subfield><subfield code="0">(DE-588)4775842-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Wafer level packaging</subfield><subfield code="0">(DE-588)1058582143</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="a">Seok, Seonho</subfield><subfield code="t">Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method</subfield><subfield code="d">Cham : Springer,c2018</subfield><subfield code="z">9783319778716</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-30-PQE</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032099956</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://ebookcentral.proquest.com/lib/hwr/detail.action?docID=5376068</subfield><subfield code="l">HWR01</subfield><subfield code="p">ZDB-30-PQE</subfield><subfield code="q">HWR_PDA_PQE</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV046689172 |
| illustrated | Not Illustrated |
| index_date | 2024-07-03T14:24:48Z |
| indexdate | 2024-07-10T08:51:12Z |
| institution | BVB |
| isbn | 9783319778723 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032099956 |
| oclc_num | 1034546870 |
| open_access_boolean | |
| owner | DE-2070s |
| owner_facet | DE-2070s |
| physical | 1 online resource (119 pages) |
| psigel | ZDB-30-PQE ZDB-30-PQE HWR_PDA_PQE |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | Springer |
| record_format | marc |
| series2 | Springer Series in Advanced Manufacturing Ser |
| spelling | Seok, Seonho Verfasser aut Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method Cham Springer 2018 © 2018 1 online resource (119 pages) txt rdacontent c rdamedia cr rdacarrier Springer Series in Advanced Manufacturing Ser Description based on publisher supplied metadata and other sources Wafer level packaging (DE-588)1058582143 gnd rswk-swf MEMS (DE-588)4824724-8 gnd rswk-swf Benzocyclobutan (DE-588)4775842-9 gnd rswk-swf MEMS (DE-588)4824724-8 s Benzocyclobutan (DE-588)4775842-9 s Wafer level packaging (DE-588)1058582143 s DE-604 Erscheint auch als Druck-Ausgabe Seok, Seonho Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method Cham : Springer,c2018 9783319778716 |
| spellingShingle | Seok, Seonho Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method Wafer level packaging (DE-588)1058582143 gnd MEMS (DE-588)4824724-8 gnd Benzocyclobutan (DE-588)4775842-9 gnd |
| subject_GND | (DE-588)1058582143 (DE-588)4824724-8 (DE-588)4775842-9 |
| title | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_auth | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_exact_search | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_exact_search_txtP | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_full | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_fullStr | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_full_unstemmed | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_short | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering |
| title_sort | advanced packaging and manufacturing technology based on adhesion engineering wafer level transfer packaging and fabrication techniques using interface energy control method |
| title_sub | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| topic | Wafer level packaging (DE-588)1058582143 gnd MEMS (DE-588)4824724-8 gnd Benzocyclobutan (DE-588)4775842-9 gnd |
| topic_facet | Wafer level packaging MEMS Benzocyclobutan |
| work_keys_str_mv | AT seokseonho advancedpackagingandmanufacturingtechnologybasedonadhesionengineeringwaferleveltransferpackagingandfabricationtechniquesusinginterfaceenergycontrolmethod |