Adhesion in microelectronics:
Saved in:
| Other Authors: | , |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Hoboken, New Jersey ; Salem, Massachusetts
Scrivener Publishing Wiley
2014
|
| Series: | Adhesion and Adhesives: Fundamental and Applied Aspects
|
| Subjects: | |
| Item Description: | Description based on print version record |
| Physical Description: | 1 online resource (367 pages) illustrations |
| ISBN: | 9781118831335 9781118831359 |
Staff View
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV044185909 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 170220s2014 |||| o||u| ||||||eng d | ||
| 020 | |a 9781118831335 |c Print |9 978-1-118-83133-5 | ||
| 020 | |a 9781118831359 |c ebook |9 978-1-118-83135-9 | ||
| 035 | |a (ZDB-30-PAD)EBC1767917 | ||
| 035 | |a (ZDB-89-EBL)EBL1767917 | ||
| 035 | |a (ZDB-38-EBR)ebr10910126 | ||
| 035 | |a (OCoLC)904836532 | ||
| 035 | |a (DE-599)BVBBV044185909 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 082 | 0 | |a 621.381/046 |2 23 | |
| 245 | 1 | 0 | |a Adhesion in microelectronics |c edited by K. L. Mittal and Tanweer Ahsan |
| 264 | 1 | |a Hoboken, New Jersey ; Salem, Massachusetts |b Scrivener Publishing |b Wiley |c 2014 | |
| 264 | 4 | |c © 2014 | |
| 300 | |a 1 online resource (367 pages) |b illustrations | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Adhesion and Adhesives: Fundamental and Applied Aspects | |
| 500 | |a Description based on print version record | ||
| 650 | 4 | |a Microelectronic packaging |x Materials | |
| 650 | 4 | |a Adhesives | |
| 650 | 4 | |a Adhesive joints | |
| 700 | 1 | |a Mittal, K. L. |d 1945- |4 edt | |
| 700 | 1 | |a Ahsan, Tanweer |4 edt | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |a Adhesion in microelectronics |
| 912 | |a ZDB-30-PAD |a ZDB-38-ESG | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-029592700 | ||
Record in the Search Index
| _version_ | 1804177314189148160 |
|---|---|
| any_adam_object | |
| author2 | Mittal, K. L. 1945- Ahsan, Tanweer |
| author2_role | edt edt |
| author2_variant | k l m kl klm t a ta |
| author_facet | Mittal, K. L. 1945- Ahsan, Tanweer |
| building | Verbundindex |
| bvnumber | BV044185909 |
| collection | ZDB-30-PAD ZDB-38-ESG |
| ctrlnum | (ZDB-30-PAD)EBC1767917 (ZDB-89-EBL)EBL1767917 (ZDB-38-EBR)ebr10910126 (OCoLC)904836532 (DE-599)BVBBV044185909 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01413nmm a2200409zc 4500</leader><controlfield tag="001">BV044185909</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">170220s2014 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781118831335</subfield><subfield code="c">Print</subfield><subfield code="9">978-1-118-83133-5</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781118831359</subfield><subfield code="c">ebook</subfield><subfield code="9">978-1-118-83135-9</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-30-PAD)EBC1767917</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-89-EBL)EBL1767917</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-38-EBR)ebr10910126</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)904836532</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044185909</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/046</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Adhesion in microelectronics</subfield><subfield code="c">edited by K. L. Mittal and Tanweer Ahsan</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Hoboken, New Jersey ; Salem, Massachusetts</subfield><subfield code="b">Scrivener Publishing</subfield><subfield code="b">Wiley</subfield><subfield code="c">2014</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (367 pages)</subfield><subfield code="b">illustrations</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Adhesion and Adhesives: Fundamental and Applied Aspects</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Description based on print version record</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronic packaging</subfield><subfield code="x">Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Adhesives</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Adhesive joints</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Mittal, K. L.</subfield><subfield code="d">1945-</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ahsan, Tanweer</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="a">Adhesion in microelectronics</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-30-PAD</subfield><subfield code="a">ZDB-38-ESG</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029592700</subfield></datafield></record></collection> |
| id | DE-604.BV044185909 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:46:06Z |
| institution | BVB |
| isbn | 9781118831335 9781118831359 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029592700 |
| oclc_num | 904836532 |
| open_access_boolean | |
| physical | 1 online resource (367 pages) illustrations |
| psigel | ZDB-30-PAD ZDB-38-ESG |
| publishDate | 2014 |
| publishDateSearch | 2014 |
| publishDateSort | 2014 |
| publisher | Scrivener Publishing Wiley |
| record_format | marc |
| series2 | Adhesion and Adhesives: Fundamental and Applied Aspects |
| spelling | Adhesion in microelectronics edited by K. L. Mittal and Tanweer Ahsan Hoboken, New Jersey ; Salem, Massachusetts Scrivener Publishing Wiley 2014 © 2014 1 online resource (367 pages) illustrations txt rdacontent c rdamedia cr rdacarrier Adhesion and Adhesives: Fundamental and Applied Aspects Description based on print version record Microelectronic packaging Materials Adhesives Adhesive joints Mittal, K. L. 1945- edt Ahsan, Tanweer edt Erscheint auch als Druck-Ausgabe Adhesion in microelectronics |
| spellingShingle | Adhesion in microelectronics Microelectronic packaging Materials Adhesives Adhesive joints |
| title | Adhesion in microelectronics |
| title_auth | Adhesion in microelectronics |
| title_exact_search | Adhesion in microelectronics |
| title_full | Adhesion in microelectronics edited by K. L. Mittal and Tanweer Ahsan |
| title_fullStr | Adhesion in microelectronics edited by K. L. Mittal and Tanweer Ahsan |
| title_full_unstemmed | Adhesion in microelectronics edited by K. L. Mittal and Tanweer Ahsan |
| title_short | Adhesion in microelectronics |
| title_sort | adhesion in microelectronics |
| topic | Microelectronic packaging Materials Adhesives Adhesive joints |
| topic_facet | Microelectronic packaging Materials Adhesives Adhesive joints |
| work_keys_str_mv | AT mittalkl adhesioninmicroelectronics AT ahsantanweer adhesioninmicroelectronics |