Adhesion in microelectronics:
Gespeichert in:
Weitere Verfasser: | , |
---|---|
Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Hoboken, New Jersey ; Salem, Massachusetts
Scrivener Publishing Wiley
2014
|
Schriftenreihe: | Adhesion and Adhesives: Fundamental and Applied Aspects
|
Schlagworte: | |
Beschreibung: | Description based on print version record |
Beschreibung: | 1 online resource (367 pages) illustrations |
ISBN: | 9781118831335 9781118831359 |
Internformat
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245 | 1 | 0 | |a Adhesion in microelectronics |c edited by K. L. Mittal and Tanweer Ahsan |
264 | 1 | |a Hoboken, New Jersey ; Salem, Massachusetts |b Scrivener Publishing |b Wiley |c 2014 | |
264 | 4 | |c © 2014 | |
300 | |a 1 online resource (367 pages) |b illustrations | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a Adhesion and Adhesives: Fundamental and Applied Aspects | |
500 | |a Description based on print version record | ||
650 | 4 | |a Microelectronic packaging |x Materials | |
650 | 4 | |a Adhesives | |
650 | 4 | |a Adhesive joints | |
700 | 1 | |a Mittal, K. L. |d 1945- |4 edt | |
700 | 1 | |a Ahsan, Tanweer |4 edt | |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |a Adhesion in microelectronics |
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Datensatz im Suchindex
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any_adam_object | |
author2 | Mittal, K. L. 1945- Ahsan, Tanweer |
author2_role | edt edt |
author2_variant | k l m kl klm t a ta |
author_facet | Mittal, K. L. 1945- Ahsan, Tanweer |
building | Verbundindex |
bvnumber | BV044185909 |
collection | ZDB-30-PAD ZDB-38-ESG |
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dewey-full | 621.381/046 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381/046 |
dewey-search | 621.381/046 |
dewey-sort | 3621.381 246 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic eBook |
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id | DE-604.BV044185909 |
illustrated | Illustrated |
indexdate | 2024-07-10T07:46:06Z |
institution | BVB |
isbn | 9781118831335 9781118831359 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029592700 |
oclc_num | 904836532 |
open_access_boolean | |
physical | 1 online resource (367 pages) illustrations |
psigel | ZDB-30-PAD ZDB-38-ESG |
publishDate | 2014 |
publishDateSearch | 2014 |
publishDateSort | 2014 |
publisher | Scrivener Publishing Wiley |
record_format | marc |
series2 | Adhesion and Adhesives: Fundamental and Applied Aspects |
spelling | Adhesion in microelectronics edited by K. L. Mittal and Tanweer Ahsan Hoboken, New Jersey ; Salem, Massachusetts Scrivener Publishing Wiley 2014 © 2014 1 online resource (367 pages) illustrations txt rdacontent c rdamedia cr rdacarrier Adhesion and Adhesives: Fundamental and Applied Aspects Description based on print version record Microelectronic packaging Materials Adhesives Adhesive joints Mittal, K. L. 1945- edt Ahsan, Tanweer edt Erscheint auch als Druck-Ausgabe Adhesion in microelectronics |
spellingShingle | Adhesion in microelectronics Microelectronic packaging Materials Adhesives Adhesive joints |
title | Adhesion in microelectronics |
title_auth | Adhesion in microelectronics |
title_exact_search | Adhesion in microelectronics |
title_full | Adhesion in microelectronics edited by K. L. Mittal and Tanweer Ahsan |
title_fullStr | Adhesion in microelectronics edited by K. L. Mittal and Tanweer Ahsan |
title_full_unstemmed | Adhesion in microelectronics edited by K. L. Mittal and Tanweer Ahsan |
title_short | Adhesion in microelectronics |
title_sort | adhesion in microelectronics |
topic | Microelectronic packaging Materials Adhesives Adhesive joints |
topic_facet | Microelectronic packaging Materials Adhesives Adhesive joints |
work_keys_str_mv | AT mittalkl adhesioninmicroelectronics AT ahsantanweer adhesioninmicroelectronics |