Special issue on advances in materials science of IC interconnects and packaging:
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Warrendale, PA
TMS
2001
|
| Subjects: | |
| Item Description: | Literaturangaben. - In: Journal of electronic materials ; 30 (2001),4 |
| Physical Description: | S. 283 - 445 Ill., graph. Darst. |
Staff View
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Record in the Search Index
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| genre_facet | Konferenzschrift |
| id | DE-604.BV021965975 |
| illustrated | Illustrated |
| index_date | 2024-07-02T16:08:54Z |
| indexdate | 2024-07-09T20:48:24Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015181125 |
| oclc_num | 633949644 |
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| physical | S. 283 - 445 Ill., graph. Darst. |
| publishDate | 2001 |
| publishDateSearch | 2001 |
| publishDateSort | 2001 |
| publisher | TMS |
| record_format | marc |
| spelling | Special issue on advances in materials science of IC interconnects and packaging Warrendale, PA TMS 2001 S. 283 - 445 Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Literaturangaben. - In: Journal of electronic materials ; 30 (2001),4 Halbleiterwerkstoff (DE-588)4158817-4 gnd rswk-swf Verdrahtung (DE-588)4187633-7 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf (DE-588)1071861417 Konferenzschrift gnd-content Integrierte Schaltung (DE-588)4027242-4 s DE-604 Halbleiterwerkstoff (DE-588)4158817-4 s Verdrahtung (DE-588)4187633-7 s |
| spellingShingle | Special issue on advances in materials science of IC interconnects and packaging Halbleiterwerkstoff (DE-588)4158817-4 gnd Verdrahtung (DE-588)4187633-7 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| subject_GND | (DE-588)4158817-4 (DE-588)4187633-7 (DE-588)4027242-4 (DE-588)1071861417 |
| title | Special issue on advances in materials science of IC interconnects and packaging |
| title_auth | Special issue on advances in materials science of IC interconnects and packaging |
| title_exact_search | Special issue on advances in materials science of IC interconnects and packaging |
| title_exact_search_txtP | Special issue on advances in materials science of IC interconnects and packaging |
| title_full | Special issue on advances in materials science of IC interconnects and packaging |
| title_fullStr | Special issue on advances in materials science of IC interconnects and packaging |
| title_full_unstemmed | Special issue on advances in materials science of IC interconnects and packaging |
| title_short | Special issue on advances in materials science of IC interconnects and packaging |
| title_sort | special issue on advances in materials science of ic interconnects and packaging |
| topic | Halbleiterwerkstoff (DE-588)4158817-4 gnd Verdrahtung (DE-588)4187633-7 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| topic_facet | Halbleiterwerkstoff Verdrahtung Integrierte Schaltung Konferenzschrift |