Special issue on advances in materials science of IC interconnects and packaging:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Warrendale, PA
TMS
2001
|
| Schlagworte: | |
| Beschreibung: | Literaturangaben. - In: Journal of electronic materials ; 30 (2001),4 |
| Beschreibung: | S. 283 - 445 Ill., graph. Darst. |
Internformat
MARC
| LEADER | 00000nam a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV021965975 | ||
| 003 | DE-604 | ||
| 005 | 20040302000000.0 | ||
| 007 | t | ||
| 008 | 020723s2001 ad|| |||| 10||| eng d | ||
| 035 | |a (OCoLC)633949644 | ||
| 035 | |a (DE-599)BVBBV021965975 | ||
| 040 | |a DE-604 |b ger | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-706 | ||
| 245 | 1 | 0 | |a Special issue on advances in materials science of IC interconnects and packaging |
| 264 | 1 | |a Warrendale, PA |b TMS |c 2001 | |
| 300 | |a S. 283 - 445 |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 500 | |a Literaturangaben. - In: Journal of electronic materials ; 30 (2001),4 | ||
| 650 | 0 | 7 | |a Halbleiterwerkstoff |0 (DE-588)4158817-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verdrahtung |0 (DE-588)4187633-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Halbleiterwerkstoff |0 (DE-588)4158817-4 |D s |
| 689 | 1 | |5 DE-604 | |
| 689 | 2 | 0 | |a Verdrahtung |0 (DE-588)4187633-7 |D s |
| 689 | 2 | |5 DE-604 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-015181125 | ||
Datensatz im Suchindex
| _version_ | 1804135935311347712 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| building | Verbundindex |
| bvnumber | BV021965975 |
| ctrlnum | (OCoLC)633949644 (DE-599)BVBBV021965975 |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01234nam a2200361zc 4500</leader><controlfield tag="001">BV021965975</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20040302000000.0</controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">020723s2001 ad|| |||| 10||| eng d</controlfield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)633949644</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV021965975</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-706</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Special issue on advances in materials science of IC interconnects and packaging</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Warrendale, PA</subfield><subfield code="b">TMS</subfield><subfield code="c">2001</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">S. 283 - 445</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Literaturangaben. - In: Journal of electronic materials ; 30 (2001),4</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Halbleiterwerkstoff</subfield><subfield code="0">(DE-588)4158817-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Verdrahtung</subfield><subfield code="0">(DE-588)4187633-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Halbleiterwerkstoff</subfield><subfield code="0">(DE-588)4158817-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="2" ind2="0"><subfield code="a">Verdrahtung</subfield><subfield code="0">(DE-588)4187633-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-015181125</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV021965975 |
| illustrated | Illustrated |
| index_date | 2024-07-02T16:08:54Z |
| indexdate | 2024-07-09T20:48:24Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015181125 |
| oclc_num | 633949644 |
| open_access_boolean | |
| owner | DE-706 |
| owner_facet | DE-706 |
| physical | S. 283 - 445 Ill., graph. Darst. |
| publishDate | 2001 |
| publishDateSearch | 2001 |
| publishDateSort | 2001 |
| publisher | TMS |
| record_format | marc |
| spelling | Special issue on advances in materials science of IC interconnects and packaging Warrendale, PA TMS 2001 S. 283 - 445 Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Literaturangaben. - In: Journal of electronic materials ; 30 (2001),4 Halbleiterwerkstoff (DE-588)4158817-4 gnd rswk-swf Verdrahtung (DE-588)4187633-7 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf (DE-588)1071861417 Konferenzschrift gnd-content Integrierte Schaltung (DE-588)4027242-4 s DE-604 Halbleiterwerkstoff (DE-588)4158817-4 s Verdrahtung (DE-588)4187633-7 s |
| spellingShingle | Special issue on advances in materials science of IC interconnects and packaging Halbleiterwerkstoff (DE-588)4158817-4 gnd Verdrahtung (DE-588)4187633-7 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| subject_GND | (DE-588)4158817-4 (DE-588)4187633-7 (DE-588)4027242-4 (DE-588)1071861417 |
| title | Special issue on advances in materials science of IC interconnects and packaging |
| title_auth | Special issue on advances in materials science of IC interconnects and packaging |
| title_exact_search | Special issue on advances in materials science of IC interconnects and packaging |
| title_exact_search_txtP | Special issue on advances in materials science of IC interconnects and packaging |
| title_full | Special issue on advances in materials science of IC interconnects and packaging |
| title_fullStr | Special issue on advances in materials science of IC interconnects and packaging |
| title_full_unstemmed | Special issue on advances in materials science of IC interconnects and packaging |
| title_short | Special issue on advances in materials science of IC interconnects and packaging |
| title_sort | special issue on advances in materials science of ic interconnects and packaging |
| topic | Halbleiterwerkstoff (DE-588)4158817-4 gnd Verdrahtung (DE-588)4187633-7 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| topic_facet | Halbleiterwerkstoff Verdrahtung Integrierte Schaltung Konferenzschrift |