Wafer scale integration, II: proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987
Gespeichert in:
| Format: | Tagungsbericht Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Amsterdam u.a.
North-Holland
1988
|
| Schlagworte: | |
| Beschreibung: | Literaturangaben |
| Beschreibung: | IX, 249 S. Ill., graph. Darst. |
| ISBN: | 044470535X |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV001790107 | ||
| 003 | DE-604 | ||
| 005 | 20090212 | ||
| 007 | t| | ||
| 008 | 890821s1988 xx ad|| |||| 10||| eng d | ||
| 020 | |a 044470535X |9 0-444-70535-X | ||
| 035 | |a (OCoLC)18442084 | ||
| 035 | |a (DE-599)BVBBV001790107 | ||
| 040 | |a DE-604 |b ger |e rakwb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-739 |a DE-91 | ||
| 050 | 0 | |a TK7874 | |
| 082 | 0 | |a 621.395 |2 19 | |
| 084 | |a ELT 364f |2 stub | ||
| 245 | 1 | 0 | |a Wafer scale integration, II |b proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987 |c ed. by. R. M. Lea |
| 246 | 1 | 3 | |a Wafer scale integration, two |
| 264 | 1 | |a Amsterdam u.a. |b North-Holland |c 1988 | |
| 300 | |a IX, 249 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 500 | |a Literaturangaben | ||
| 650 | 4 | |a Integrated circuits |x Very large scale integration |x Congresses | |
| 650 | 4 | |a Semiconductor wafers |x Congresses | |
| 650 | 0 | 7 | |a Wafer-Integration |0 (DE-588)4226609-9 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |y 1987 |z Egham |2 gnd-content | |
| 689 | 0 | 0 | |a Wafer-Integration |0 (DE-588)4226609-9 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Lea, R. M. |e Sonstige |4 oth | |
| 710 | 2 | |a International Federation for Information Processing |b Working Group Very Large Scale Integration |e Sonstige |0 (DE-588)307182-0 |4 oth | |
| 711 | 2 | |a Workshop on Wafer Scale Integration |n 2 |d 1987 |c Egham |j Sonstige |0 (DE-588)5041553-0 |4 oth | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-001206300 | |
Datensatz im Suchindex
| _version_ | 1820868281531105280 |
|---|---|
| adam_text | |
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV001790107 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874 |
| callnumber-search | TK7874 |
| callnumber-sort | TK 47874 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | SS 1987 |
| classification_tum | ELT 364f |
| ctrlnum | (OCoLC)18442084 (DE-599)BVBBV001790107 |
| dewey-full | 621.395 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.395 |
| dewey-search | 621.395 |
| dewey-sort | 3621.395 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>00000nam a2200000 c 4500</leader><controlfield tag="001">BV001790107</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20090212</controlfield><controlfield tag="007">t|</controlfield><controlfield tag="008">890821s1988 xx ad|| |||| 10||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">044470535X</subfield><subfield code="9">0-444-70535-X</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)18442084</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV001790107</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-739</subfield><subfield code="a">DE-91</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7874</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.395</subfield><subfield code="2">19</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 364f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Wafer scale integration, II</subfield><subfield code="b">proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987</subfield><subfield code="c">ed. by. R. M. Lea</subfield></datafield><datafield tag="246" ind1="1" ind2="3"><subfield code="a">Wafer scale integration, two</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Amsterdam u.a.</subfield><subfield code="b">North-Holland</subfield><subfield code="c">1988</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">IX, 249 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Literaturangaben</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Very large scale integration</subfield><subfield code="x">Congresses</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductor wafers</subfield><subfield code="x">Congresses</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wafer-Integration</subfield><subfield code="0">(DE-588)4226609-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="y">1987</subfield><subfield code="z">Egham</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Wafer-Integration</subfield><subfield code="0">(DE-588)4226609-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lea, R. M.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">International Federation for Information Processing</subfield><subfield code="b">Working Group Very Large Scale Integration</subfield><subfield code="e">Sonstige</subfield><subfield code="0">(DE-588)307182-0</subfield><subfield code="4">oth</subfield></datafield><datafield tag="711" ind1="2" ind2=" "><subfield code="a">Workshop on Wafer Scale Integration</subfield><subfield code="n">2</subfield><subfield code="d">1987</subfield><subfield code="c">Egham</subfield><subfield code="j">Sonstige</subfield><subfield code="0">(DE-588)5041553-0</subfield><subfield code="4">oth</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-001206300</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift 1987 Egham gnd-content |
| genre_facet | Konferenzschrift 1987 Egham |
| id | DE-604.BV001790107 |
| illustrated | Illustrated |
| indexdate | 2025-01-10T13:21:53Z |
| institution | BVB |
| institution_GND | (DE-588)307182-0 (DE-588)5041553-0 |
| isbn | 044470535X |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-001206300 |
| oclc_num | 18442084 |
| open_access_boolean | |
| owner | DE-739 DE-91 DE-BY-TUM |
| owner_facet | DE-739 DE-91 DE-BY-TUM |
| physical | IX, 249 S. Ill., graph. Darst. |
| publishDate | 1988 |
| publishDateSearch | 1988 |
| publishDateSort | 1988 |
| publisher | North-Holland |
| record_format | marc |
| spelling | Wafer scale integration, II proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987 ed. by. R. M. Lea Wafer scale integration, two Amsterdam u.a. North-Holland 1988 IX, 249 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Literaturangaben Integrated circuits Very large scale integration Congresses Semiconductor wafers Congresses Wafer-Integration (DE-588)4226609-9 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1987 Egham gnd-content Wafer-Integration (DE-588)4226609-9 s DE-604 Lea, R. M. Sonstige oth International Federation for Information Processing Working Group Very Large Scale Integration Sonstige (DE-588)307182-0 oth Workshop on Wafer Scale Integration 2 1987 Egham Sonstige (DE-588)5041553-0 oth |
| spellingShingle | Wafer scale integration, II proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987 Integrated circuits Very large scale integration Congresses Semiconductor wafers Congresses Wafer-Integration (DE-588)4226609-9 gnd |
| subject_GND | (DE-588)4226609-9 (DE-588)1071861417 |
| title | Wafer scale integration, II proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987 |
| title_alt | Wafer scale integration, two |
| title_auth | Wafer scale integration, II proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987 |
| title_exact_search | Wafer scale integration, II proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987 |
| title_full | Wafer scale integration, II proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987 ed. by. R. M. Lea |
| title_fullStr | Wafer scale integration, II proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987 ed. by. R. M. Lea |
| title_full_unstemmed | Wafer scale integration, II proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987 ed. by. R. M. Lea |
| title_short | Wafer scale integration, II |
| title_sort | wafer scale integration ii proceedings of the second ifip wg 10 5 workshop on wafer scale integration egham england 23 25 september 1987 |
| title_sub | proceedings of the second IFIP WG 10.5 Workshop on Wafer Scale Integration Egham, England, 23 - 25 September 1987 |
| topic | Integrated circuits Very large scale integration Congresses Semiconductor wafers Congresses Wafer-Integration (DE-588)4226609-9 gnd |
| topic_facet | Integrated circuits Very large scale integration Congresses Semiconductor wafers Congresses Wafer-Integration Konferenzschrift 1987 Egham |
| work_keys_str_mv | AT learm waferscaleintegrationiiproceedingsofthesecondifipwg105workshoponwaferscaleintegrationeghamengland2325september1987 AT internationalfederationforinformationprocessingworkinggroupverylargescaleintegration waferscaleintegrationiiproceedingsofthesecondifipwg105workshoponwaferscaleintegrationeghamengland2325september1987 AT workshoponwaferscaleintegrationegham waferscaleintegrationiiproceedingsofthesecondifipwg105workshoponwaferscaleintegrationeghamengland2325september1987 AT learm waferscaleintegrationtwo AT internationalfederationforinformationprocessingworkinggroupverylargescaleintegration waferscaleintegrationtwo AT workshoponwaferscaleintegrationegham waferscaleintegrationtwo |