PCB design guide to via and trace currents and temperatures /:
A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston :
Artech House,
[2021]
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Zusammenfassung: | A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered. |
| Beschreibung: | 1 online resource |
| ISBN: | 9781630818616 1630818615 |
Internformat
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| 245 | 1 | 0 | |a PCB design guide to via and trace currents and temperatures / |c Douglas Brooks with Johannes Adam. |
| 264 | 1 | |a Boston : |b Artech House, |c [2021] | |
| 300 | |a 1 online resource | ||
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| 505 | 0 | 0 | |g 1. |t Introduction and Historical Background -- |g 2. |t Materials Used in PCBs -- |g 3. |t Resistivity and Resistance -- |g 4. |t Trace Heating and Cooling -- |g 5. |t IPC Curves -- |g 6. |t Thermal Simulations -- |g 7. |t Thermal Simulations -- |g 7. |t Via Temperatures -- |g 9. |t Current Densities in Vias -- |g 10. |t Thinking Outside the Boxes -- |g 11. |t Fusing Currents: Background -- |g 12. |t Fusing Currents: Analyses -- |g 13. |t Do Traces Heat Uniformly? -- |g 14. |t Stop Thinking about Current Density -- |g 15. |t AC Currents -- |g 16. |t Industrial CT (X-Ray) Scanning -- |g Appendix A. |t Measuring Thermal Conductivity -- |g Appendix B. |t Measuring Resistivity -- |g Appendix C. |t IPC Internal and Vacuum Curves Fitted wi -- |g Appendix E. |t Current/Temperature Curves, 0.25 to 5.0 -- |g Appendix F. |t Current Density in Vias -- |g Appendix G. |t Derivation of Onderdonk's Equation -- |g Appendix H. |t Results of All Six Fusing Configuration -- |g Appendix I. |t Nonuniform Heating Patterns. |
| 520 | |a A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered. | ||
| 588 | 0 | |a Title details screen. | |
| 650 | 0 | |a Printed circuits |x Design and construction. | |
| 650 | 7 | |a Printed circuits |x Design and construction |2 fast | |
| 700 | 1 | |a Adam, Johannes, |e author. | |
| 758 | |i has work: |a PCB design guide to via and trace currents and temperatures (Text) |1 https://id.oclc.org/worldcat/entity/E39PCGTTBqpBqFCwpHyKmYCDC3 |4 https://id.oclc.org/worldcat/ontology/hasWork | ||
| 776 | 0 | 8 | |i Print version: |z 9781630818609 |
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Datensatz im Suchindex
| DE-BY-FWS_katkey | ZDB-4-EBA-on1245493806 |
|---|---|
| _version_ | 1816882541818281986 |
| adam_text | |
| any_adam_object | |
| author | Brooks, Douglas, 1940- Adam, Johannes |
| author_GND | http://id.loc.gov/authorities/names/n2003011054 |
| author_facet | Brooks, Douglas, 1940- Adam, Johannes |
| author_role | aut aut |
| author_sort | Brooks, Douglas, 1940- |
| author_variant | d b db j a ja |
| building | Verbundindex |
| bvnumber | localFWS |
| callnumber-first | T - Technology |
| callnumber-label | TK7868 |
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| callnumber-subject | TK - Electrical and Nuclear Engineering |
| collection | ZDB-4-EBA |
| contents | Introduction and Historical Background -- Materials Used in PCBs -- Resistivity and Resistance -- Trace Heating and Cooling -- IPC Curves -- Thermal Simulations -- Via Temperatures -- Current Densities in Vias -- Thinking Outside the Boxes -- Fusing Currents: Background -- Fusing Currents: Analyses -- Do Traces Heat Uniformly? -- Stop Thinking about Current Density -- AC Currents -- Industrial CT (X-Ray) Scanning -- Measuring Thermal Conductivity -- Measuring Resistivity -- IPC Internal and Vacuum Curves Fitted wi -- Current/Temperature Curves, 0.25 to 5.0 -- Current Density in Vias -- Derivation of Onderdonk's Equation -- Results of All Six Fusing Configuration -- Nonuniform Heating Patterns. |
| ctrlnum | (OCoLC)1245493806 |
| dewey-full | 621.3815/31 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815/31 |
| dewey-search | 621.3815/31 |
| dewey-sort | 3621.3815 231 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | ZDB-4-EBA-on1245493806 |
| illustrated | Not Illustrated |
| indexdate | 2024-11-27T13:30:15Z |
| institution | BVB |
| isbn | 9781630818616 1630818615 |
| language | English |
| oclc_num | 1245493806 |
| open_access_boolean | |
| owner | MAIN DE-863 DE-BY-FWS |
| owner_facet | MAIN DE-863 DE-BY-FWS |
| physical | 1 online resource |
| psigel | ZDB-4-EBA |
| publishDate | 2021 |
| publishDateSearch | 2021 |
| publishDateSort | 2021 |
| publisher | Artech House, |
| record_format | marc |
| spelling | Brooks, Douglas, 1940- author. https://id.oclc.org/worldcat/entity/E39PCjGvHMYjHXF8CYgyjQDpKb http://id.loc.gov/authorities/names/n2003011054 PCB design guide to via and trace currents and temperatures / Douglas Brooks with Johannes Adam. Boston : Artech House, [2021] 1 online resource text txt rdacontent computer c rdamedia online resource cr rdacarrier 1. Introduction and Historical Background -- 2. Materials Used in PCBs -- 3. Resistivity and Resistance -- 4. Trace Heating and Cooling -- 5. IPC Curves -- 6. Thermal Simulations -- 7. Thermal Simulations -- 7. Via Temperatures -- 9. Current Densities in Vias -- 10. Thinking Outside the Boxes -- 11. Fusing Currents: Background -- 12. Fusing Currents: Analyses -- 13. Do Traces Heat Uniformly? -- 14. Stop Thinking about Current Density -- 15. AC Currents -- 16. Industrial CT (X-Ray) Scanning -- Appendix A. Measuring Thermal Conductivity -- Appendix B. Measuring Resistivity -- Appendix C. IPC Internal and Vacuum Curves Fitted wi -- Appendix E. Current/Temperature Curves, 0.25 to 5.0 -- Appendix F. Current Density in Vias -- Appendix G. Derivation of Onderdonk's Equation -- Appendix H. Results of All Six Fusing Configuration -- Appendix I. Nonuniform Heating Patterns. A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered. Title details screen. Printed circuits Design and construction. Printed circuits Design and construction fast Adam, Johannes, author. has work: PCB design guide to via and trace currents and temperatures (Text) https://id.oclc.org/worldcat/entity/E39PCGTTBqpBqFCwpHyKmYCDC3 https://id.oclc.org/worldcat/ontology/hasWork Print version: 9781630818609 FWS01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=2945408 Volltext |
| spellingShingle | Brooks, Douglas, 1940- Adam, Johannes PCB design guide to via and trace currents and temperatures / Introduction and Historical Background -- Materials Used in PCBs -- Resistivity and Resistance -- Trace Heating and Cooling -- IPC Curves -- Thermal Simulations -- Via Temperatures -- Current Densities in Vias -- Thinking Outside the Boxes -- Fusing Currents: Background -- Fusing Currents: Analyses -- Do Traces Heat Uniformly? -- Stop Thinking about Current Density -- AC Currents -- Industrial CT (X-Ray) Scanning -- Measuring Thermal Conductivity -- Measuring Resistivity -- IPC Internal and Vacuum Curves Fitted wi -- Current/Temperature Curves, 0.25 to 5.0 -- Current Density in Vias -- Derivation of Onderdonk's Equation -- Results of All Six Fusing Configuration -- Nonuniform Heating Patterns. Printed circuits Design and construction. Printed circuits Design and construction fast |
| title | PCB design guide to via and trace currents and temperatures / |
| title_alt | Introduction and Historical Background -- Materials Used in PCBs -- Resistivity and Resistance -- Trace Heating and Cooling -- IPC Curves -- Thermal Simulations -- Via Temperatures -- Current Densities in Vias -- Thinking Outside the Boxes -- Fusing Currents: Background -- Fusing Currents: Analyses -- Do Traces Heat Uniformly? -- Stop Thinking about Current Density -- AC Currents -- Industrial CT (X-Ray) Scanning -- Measuring Thermal Conductivity -- Measuring Resistivity -- IPC Internal and Vacuum Curves Fitted wi -- Current/Temperature Curves, 0.25 to 5.0 -- Current Density in Vias -- Derivation of Onderdonk's Equation -- Results of All Six Fusing Configuration -- Nonuniform Heating Patterns. |
| title_auth | PCB design guide to via and trace currents and temperatures / |
| title_exact_search | PCB design guide to via and trace currents and temperatures / |
| title_full | PCB design guide to via and trace currents and temperatures / Douglas Brooks with Johannes Adam. |
| title_fullStr | PCB design guide to via and trace currents and temperatures / Douglas Brooks with Johannes Adam. |
| title_full_unstemmed | PCB design guide to via and trace currents and temperatures / Douglas Brooks with Johannes Adam. |
| title_short | PCB design guide to via and trace currents and temperatures / |
| title_sort | pcb design guide to via and trace currents and temperatures |
| topic | Printed circuits Design and construction. Printed circuits Design and construction fast |
| topic_facet | Printed circuits Design and construction. Printed circuits Design and construction |
| url | https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=2945408 |
| work_keys_str_mv | AT brooksdouglas pcbdesignguidetoviaandtracecurrentsandtemperatures AT adamjohannes pcbdesignguidetoviaandtracecurrentsandtemperatures |