Ultra Clean Processing of Semiconductor Surfaces XV:
Selected peer-reviewed full text papers from the 15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) Selected, peer-reviewed papers from the 15-th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), April 12-15, 2021, Mechelen, Be...
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| Format: | Elektronisch E-Book |
| Sprache: | English |
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Zurich :
Trans Tech Publications, Limited,
2021.
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| Schriftenreihe: | Solid State Phenomena Ser.
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| Schlagworte: | |
| Online-Zugang: | Volltext |
| Zusammenfassung: | Selected peer-reviewed full text papers from the 15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) Selected, peer-reviewed papers from the 15-th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), April 12-15, 2021, Mechelen, Belgium. |
| Beschreibung: | 1 online resource (325 pages) |
| ISBN: | 3035738017 9783035738018 |
Internformat
MARC
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| 520 | |a Selected peer-reviewed full text papers from the 15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) Selected, peer-reviewed papers from the 15-th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), April 12-15, 2021, Mechelen, Belgium. | ||
| 505 | 0 | |a Intro -- Ultra Clean Processing of Semiconductor Surfaces XV -- Preface -- Table of Contents -- Chapter 1: Contamination and Contamination Control -- Surface Cleaning Challenges for Organic Light Emitting Diodes -- Characterization and Removal of Metallic Contamination in H2O and H2O2 Using Single Particle Inductively Coupled Plasma Mass Spectrometry -- Direct Analysis of Ultra Trace Metallic Particles in NH3 and HCl Gases by Gas Exchange Device (GED)-ICP-MS -- Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol | |
| 505 | 8 | |a Cl-Containing Microplastics from the Environment -- Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines -- Wafer Container Monitoring Concerning Airborne Molecular Contaminations along a 300 mm Power Semiconductor Production Flow -- Chapter 2: FEOL: Surface Chemistry and Etching of Group IV Semiconductors -- Towards Si-Cap-Free SiGe Passivation: Impact of Surface Preparation on Low-Pressure Oxidation of SiGe -- Wet Chemical Cleaning of Organosilane Monolayers -- Reaction Kinetics of Poly-Si Etching in TMAH Solution | |
| 505 | 8 | |a Surface Chemistry and Nanoscale Wet Etching of Group IV Semiconductors in Acidic H2O2 Solutions -- Si1-XGeX Selective Etchant for Gate-All-Around Transistors -- Chapter 3: FEOL: Surface Chemistry and Etching of III-V Compound Semiconductors -- GaN MOS Structures with Low Interface Trap Density -- Analysis of Surface Reaction for Group III-V Compound Semiconductors in Functional Water -- Effect of Surface Oxidation on the Material Loss of InGaAs in Acidic Solutions -- Characterization of Wet Chemical Atomic Layer Etching of InGaAs | |
| 505 | 8 | |a Chapter 4: FEOL: Etch Dielectric Films and Removal of Masking Films -- Highly Selective Etching between Different Oxide Films by Vapor Phase Cleaning -- Silicon Corrosion during Selective Silicon Nitride Etch with Hot Diluted Hydrofluoric Acid -- Kinetic Study on the Si3N4 Etching in Superheated Water -- Challenges and Solutions of Replacement Metal Gate Patterning to Enable Gate-all-Around Device Scaling -- Removal of SOC Hard Mask for Patterning of Work Function Metal by Thermally Activated Ozone Gas | |
| 505 | 8 | |a High Performance, Eco-Friendly SPM Cleaning Technology Using Integrated Bench-Single Wafer Cleaning System -- Chapter 5: Wet Processing in Narrow Spaces and Pattern Collapse -- Polydimethylsiloxane Micro-Channels Application for the Study of Dynamic Wetting of Nano-Etched Silicon Surfaces Based on Acoustic Characterization Method -- Characterization of Wetting of Deep Silica Nanoholes by Aqueous Solutions Using ATR-FTIR -- Effect of Hydrophobicity and Surface Potential of Silicon on SiO2 Etching in Nanometer-Sized Narrow Spaces | |
| 650 | 0 | |a Semiconductors |x Surfaces |v Congresses. | |
| 650 | 6 | |a Semi-conducteurs |x Surfaces |v Congrès. | |
| 650 | 7 | |a Semiconductors |x Surfaces |2 fast | |
| 655 | 7 | |a Conference papers and proceedings |2 fast | |
| 700 | 1 | |a Wostyn, Kurt. | |
| 700 | 1 | |a Meuris, Marc. |0 http://id.loc.gov/authorities/names/nr2002012448 | |
| 700 | 1 | |a Heyns, Marc. |0 http://id.loc.gov/authorities/names/nr2002012446 | |
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| contents | Intro -- Ultra Clean Processing of Semiconductor Surfaces XV -- Preface -- Table of Contents -- Chapter 1: Contamination and Contamination Control -- Surface Cleaning Challenges for Organic Light Emitting Diodes -- Characterization and Removal of Metallic Contamination in H2O and H2O2 Using Single Particle Inductively Coupled Plasma Mass Spectrometry -- Direct Analysis of Ultra Trace Metallic Particles in NH3 and HCl Gases by Gas Exchange Device (GED)-ICP-MS -- Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol Cl-Containing Microplastics from the Environment -- Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines -- Wafer Container Monitoring Concerning Airborne Molecular Contaminations along a 300 mm Power Semiconductor Production Flow -- Chapter 2: FEOL: Surface Chemistry and Etching of Group IV Semiconductors -- Towards Si-Cap-Free SiGe Passivation: Impact of Surface Preparation on Low-Pressure Oxidation of SiGe -- Wet Chemical Cleaning of Organosilane Monolayers -- Reaction Kinetics of Poly-Si Etching in TMAH Solution Surface Chemistry and Nanoscale Wet Etching of Group IV Semiconductors in Acidic H2O2 Solutions -- Si1-XGeX Selective Etchant for Gate-All-Around Transistors -- Chapter 3: FEOL: Surface Chemistry and Etching of III-V Compound Semiconductors -- GaN MOS Structures with Low Interface Trap Density -- Analysis of Surface Reaction for Group III-V Compound Semiconductors in Functional Water -- Effect of Surface Oxidation on the Material Loss of InGaAs in Acidic Solutions -- Characterization of Wet Chemical Atomic Layer Etching of InGaAs Chapter 4: FEOL: Etch Dielectric Films and Removal of Masking Films -- Highly Selective Etching between Different Oxide Films by Vapor Phase Cleaning -- Silicon Corrosion during Selective Silicon Nitride Etch with Hot Diluted Hydrofluoric Acid -- Kinetic Study on the Si3N4 Etching in Superheated Water -- Challenges and Solutions of Replacement Metal Gate Patterning to Enable Gate-all-Around Device Scaling -- Removal of SOC Hard Mask for Patterning of Work Function Metal by Thermally Activated Ozone Gas High Performance, Eco-Friendly SPM Cleaning Technology Using Integrated Bench-Single Wafer Cleaning System -- Chapter 5: Wet Processing in Narrow Spaces and Pattern Collapse -- Polydimethylsiloxane Micro-Channels Application for the Study of Dynamic Wetting of Nano-Etched Silicon Surfaces Based on Acoustic Characterization Method -- Characterization of Wetting of Deep Silica Nanoholes by Aqueous Solutions Using ATR-FTIR -- Effect of Hydrophobicity and Surface Potential of Silicon on SiO2 Etching in Nanometer-Sized Narrow Spaces |
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| indexdate | 2024-11-27T13:30:08Z |
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| spelling | Mertens, Paul W. Ultra Clean Processing of Semiconductor Surfaces XV Zurich : Trans Tech Publications, Limited, 2021. 1 online resource (325 pages) text txt rdacontent computer c rdamedia online resource cr rdacarrier Solid State Phenomena Ser. ; v. Volume 314 Print version record. Selected peer-reviewed full text papers from the 15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) Selected, peer-reviewed papers from the 15-th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), April 12-15, 2021, Mechelen, Belgium. Intro -- Ultra Clean Processing of Semiconductor Surfaces XV -- Preface -- Table of Contents -- Chapter 1: Contamination and Contamination Control -- Surface Cleaning Challenges for Organic Light Emitting Diodes -- Characterization and Removal of Metallic Contamination in H2O and H2O2 Using Single Particle Inductively Coupled Plasma Mass Spectrometry -- Direct Analysis of Ultra Trace Metallic Particles in NH3 and HCl Gases by Gas Exchange Device (GED)-ICP-MS -- Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol Cl-Containing Microplastics from the Environment -- Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines -- Wafer Container Monitoring Concerning Airborne Molecular Contaminations along a 300 mm Power Semiconductor Production Flow -- Chapter 2: FEOL: Surface Chemistry and Etching of Group IV Semiconductors -- Towards Si-Cap-Free SiGe Passivation: Impact of Surface Preparation on Low-Pressure Oxidation of SiGe -- Wet Chemical Cleaning of Organosilane Monolayers -- Reaction Kinetics of Poly-Si Etching in TMAH Solution Surface Chemistry and Nanoscale Wet Etching of Group IV Semiconductors in Acidic H2O2 Solutions -- Si1-XGeX Selective Etchant for Gate-All-Around Transistors -- Chapter 3: FEOL: Surface Chemistry and Etching of III-V Compound Semiconductors -- GaN MOS Structures with Low Interface Trap Density -- Analysis of Surface Reaction for Group III-V Compound Semiconductors in Functional Water -- Effect of Surface Oxidation on the Material Loss of InGaAs in Acidic Solutions -- Characterization of Wet Chemical Atomic Layer Etching of InGaAs Chapter 4: FEOL: Etch Dielectric Films and Removal of Masking Films -- Highly Selective Etching between Different Oxide Films by Vapor Phase Cleaning -- Silicon Corrosion during Selective Silicon Nitride Etch with Hot Diluted Hydrofluoric Acid -- Kinetic Study on the Si3N4 Etching in Superheated Water -- Challenges and Solutions of Replacement Metal Gate Patterning to Enable Gate-all-Around Device Scaling -- Removal of SOC Hard Mask for Patterning of Work Function Metal by Thermally Activated Ozone Gas High Performance, Eco-Friendly SPM Cleaning Technology Using Integrated Bench-Single Wafer Cleaning System -- Chapter 5: Wet Processing in Narrow Spaces and Pattern Collapse -- Polydimethylsiloxane Micro-Channels Application for the Study of Dynamic Wetting of Nano-Etched Silicon Surfaces Based on Acoustic Characterization Method -- Characterization of Wetting of Deep Silica Nanoholes by Aqueous Solutions Using ATR-FTIR -- Effect of Hydrophobicity and Surface Potential of Silicon on SiO2 Etching in Nanometer-Sized Narrow Spaces Semiconductors Surfaces Congresses. Semi-conducteurs Surfaces Congrès. Semiconductors Surfaces fast Conference papers and proceedings fast Wostyn, Kurt. Meuris, Marc. http://id.loc.gov/authorities/names/nr2002012448 Heyns, Marc. http://id.loc.gov/authorities/names/nr2002012446 has work: Ultra Clean Processing of Semiconductor Surfaces XV (Text) https://id.oclc.org/worldcat/entity/E39PCFxMrK4Bjjf97kCKhVJXbd https://id.oclc.org/worldcat/ontology/hasWork Print version: Mertens, Paul W. Ultra Clean Processing of Semiconductor Surfaces XV. Zurich : Trans Tech Publications, Limited, ©2021 Solid State Phenomena Ser. FWS01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=2683123 Volltext |
| spellingShingle | Mertens, Paul W. Ultra Clean Processing of Semiconductor Surfaces XV Solid State Phenomena Ser. Intro -- Ultra Clean Processing of Semiconductor Surfaces XV -- Preface -- Table of Contents -- Chapter 1: Contamination and Contamination Control -- Surface Cleaning Challenges for Organic Light Emitting Diodes -- Characterization and Removal of Metallic Contamination in H2O and H2O2 Using Single Particle Inductively Coupled Plasma Mass Spectrometry -- Direct Analysis of Ultra Trace Metallic Particles in NH3 and HCl Gases by Gas Exchange Device (GED)-ICP-MS -- Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol Cl-Containing Microplastics from the Environment -- Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines -- Wafer Container Monitoring Concerning Airborne Molecular Contaminations along a 300 mm Power Semiconductor Production Flow -- Chapter 2: FEOL: Surface Chemistry and Etching of Group IV Semiconductors -- Towards Si-Cap-Free SiGe Passivation: Impact of Surface Preparation on Low-Pressure Oxidation of SiGe -- Wet Chemical Cleaning of Organosilane Monolayers -- Reaction Kinetics of Poly-Si Etching in TMAH Solution Surface Chemistry and Nanoscale Wet Etching of Group IV Semiconductors in Acidic H2O2 Solutions -- Si1-XGeX Selective Etchant for Gate-All-Around Transistors -- Chapter 3: FEOL: Surface Chemistry and Etching of III-V Compound Semiconductors -- GaN MOS Structures with Low Interface Trap Density -- Analysis of Surface Reaction for Group III-V Compound Semiconductors in Functional Water -- Effect of Surface Oxidation on the Material Loss of InGaAs in Acidic Solutions -- Characterization of Wet Chemical Atomic Layer Etching of InGaAs Chapter 4: FEOL: Etch Dielectric Films and Removal of Masking Films -- Highly Selective Etching between Different Oxide Films by Vapor Phase Cleaning -- Silicon Corrosion during Selective Silicon Nitride Etch with Hot Diluted Hydrofluoric Acid -- Kinetic Study on the Si3N4 Etching in Superheated Water -- Challenges and Solutions of Replacement Metal Gate Patterning to Enable Gate-all-Around Device Scaling -- Removal of SOC Hard Mask for Patterning of Work Function Metal by Thermally Activated Ozone Gas High Performance, Eco-Friendly SPM Cleaning Technology Using Integrated Bench-Single Wafer Cleaning System -- Chapter 5: Wet Processing in Narrow Spaces and Pattern Collapse -- Polydimethylsiloxane Micro-Channels Application for the Study of Dynamic Wetting of Nano-Etched Silicon Surfaces Based on Acoustic Characterization Method -- Characterization of Wetting of Deep Silica Nanoholes by Aqueous Solutions Using ATR-FTIR -- Effect of Hydrophobicity and Surface Potential of Silicon on SiO2 Etching in Nanometer-Sized Narrow Spaces Semiconductors Surfaces Congresses. Semi-conducteurs Surfaces Congrès. Semiconductors Surfaces fast |
| title | Ultra Clean Processing of Semiconductor Surfaces XV |
| title_auth | Ultra Clean Processing of Semiconductor Surfaces XV |
| title_exact_search | Ultra Clean Processing of Semiconductor Surfaces XV |
| title_full | Ultra Clean Processing of Semiconductor Surfaces XV |
| title_fullStr | Ultra Clean Processing of Semiconductor Surfaces XV |
| title_full_unstemmed | Ultra Clean Processing of Semiconductor Surfaces XV |
| title_short | Ultra Clean Processing of Semiconductor Surfaces XV |
| title_sort | ultra clean processing of semiconductor surfaces xv |
| topic | Semiconductors Surfaces Congresses. Semi-conducteurs Surfaces Congrès. Semiconductors Surfaces fast |
| topic_facet | Semiconductors Surfaces Congresses. Semi-conducteurs Surfaces Congrès. Semiconductors Surfaces Conference papers and proceedings |
| url | https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=2683123 |
| work_keys_str_mv | AT mertenspaulw ultracleanprocessingofsemiconductorsurfacesxv AT wostynkurt ultracleanprocessingofsemiconductorsurfacesxv AT meurismarc ultracleanprocessingofsemiconductorsurfacesxv AT heynsmarc ultracleanprocessingofsemiconductorsurfacesxv |