Advanced micro-device engineering VI :: selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan /
This special issue is the proceedings of the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014) organized by the Human Resource Cultivation Center, Gunma University, held on 5 December 2014 in Kiryu, Japan. Scopes of this proceedings are advanced materials, nanomaterials a...
Gespeichert in:
| Körperschaft: | |
|---|---|
| Weitere Verfasser: | |
| Format: | Elektronisch Tagungsbericht E-Book |
| Sprache: | English |
| Veröffentlicht: |
Pfaffikon, Switzerland :
Trans Tech Publications Ltd.,
[2016]
|
| Schriftenreihe: | Key engineering materials ;
v. 698. |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Zusammenfassung: | This special issue is the proceedings of the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014) organized by the Human Resource Cultivation Center, Gunma University, held on 5 December 2014 in Kiryu, Japan. Scopes of this proceedings are advanced materials, nanomaterials and technologies, electronics, microelectronics, photonics, biomedical engineering and some technologies of measurements in engineering. Materials Science, Nanomaterials, Nanotechnologies, Microelectronics, Electronics, Photonics, Measurement, Biomedical Engineering Materials Science. |
| Beschreibung: | 1 online resource (viii, 180 pages) : illustrations |
| Bibliographie: | Includes bibliographical references and indexes. |
| ISBN: | 9783035701869 3035701865 |
| ISSN: | 1013-9826 ; |
Internformat
MARC
| LEADER | 00000cam a2200000 i 4500 | ||
|---|---|---|---|
| 001 | ZDB-4-EBA-ocn978351974 | ||
| 003 | OCoLC | ||
| 005 | 20241004212047.0 | ||
| 006 | m o d | ||
| 007 | cr cnu---unuuu | ||
| 008 | 170324s2016 sz a ob 101 0 eng d | ||
| 040 | |a N$T |b eng |e rda |e pn |c N$T |d CUS |d SNK |d DKU |d AUW |d INTCL |d IGB |d D6H |d VTS |d AGLDB |d G3B |d S8J |d S9I |d STF |d OCLCQ |d TTECH |d OCL |d OCLCO |d OCLCQ |d OCLCO |d OCLCQ |d OCLCO |d OCLCL | ||
| 019 | |a 1162206157 |a 1241895571 |a 1300576712 | ||
| 020 | |a 9783035701869 |q (electronic bk.) | ||
| 020 | |a 3035701865 |q (electronic bk.) | ||
| 020 | |z 3038356980 | ||
| 020 | |z 9783038356981 | ||
| 035 | |a (OCoLC)978351974 |z (OCoLC)1162206157 |z (OCoLC)1241895571 |z (OCoLC)1300576712 | ||
| 050 | 4 | |a T174.7 |b .I58 2014eb | |
| 072 | 7 | |a TEC |x 009000 |2 bisacsh | |
| 072 | 7 | |a TEC |x 035000 |2 bisacsh | |
| 082 | 7 | |a 620/.5 |2 23 | |
| 049 | |a MAIN | ||
| 111 | 2 | |a International Conference on Advanced Micro-Device Engineering |n (6th : |d 2014 : |c Kiryū-shi, Japan), |j issuing body. |0 http://id.loc.gov/authorities/names/no2016137525 | |
| 245 | 1 | 0 | |a Advanced micro-device engineering VI : |b selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan / |c edited by Ken-ichi Kasuya. |
| 264 | 1 | |a Pfaffikon, Switzerland : |b Trans Tech Publications Ltd., |c [2016] | |
| 264 | 2 | |a Pfaffikon, Switzerland ; |a Enfield, NH USA : |b Trans Tech Publications Ltd., |c [2016] | |
| 264 | 4 | |c ©2016 | |
| 300 | |a 1 online resource (viii, 180 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Key Engineering Materials, |x 1013-9826 ; |v volume 698 | |
| 504 | |a Includes bibliographical references and indexes. | ||
| 588 | 0 | |a Print version record. | |
| 520 | |a This special issue is the proceedings of the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014) organized by the Human Resource Cultivation Center, Gunma University, held on 5 December 2014 in Kiryu, Japan. Scopes of this proceedings are advanced materials, nanomaterials and technologies, electronics, microelectronics, photonics, biomedical engineering and some technologies of measurements in engineering. Materials Science, Nanomaterials, Nanotechnologies, Microelectronics, Electronics, Photonics, Measurement, Biomedical Engineering Materials Science. | ||
| 650 | 0 | |a Nanotechnology |x Research |v Congresses. | |
| 650 | 0 | |a Microelectromechanical systems |x Research |v Congresses. | |
| 650 | 0 | |a Miniature electronic equipment |x Technological innovations |v Congresses. | |
| 650 | 0 | |a Microelectronics |x Technological innovations |v Congresses. | |
| 650 | 0 | |a Mechatronics |x Technological innovations |v Congresses. | |
| 650 | 6 | |a Microsystèmes électromécaniques |x Recherche |v Congrès. | |
| 650 | 6 | |a Équipement électronique miniaturisé |x Innovations |v Congrès. | |
| 650 | 6 | |a Microélectronique |x Innovations |v Congrès. | |
| 650 | 6 | |a Mécatronique |x Innovations |v Congrès. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Engineering (General) |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Reference. |2 bisacsh | |
| 650 | 7 | |a Nanotechnology |x Research |2 fast | |
| 650 | 7 | |a Microelectronics |x Technological innovations |2 fast | |
| 650 | 7 | |a Nanotechnology |2 fast | |
| 655 | 7 | |a Conference papers and proceedings |2 fast | |
| 700 | 1 | |a Kasuya, Ken-ichi |c (Of Gunma University), |e editor. |1 https://id.oclc.org/worldcat/entity/E39PCjFDTQgH3jFDXpccxTMxCP |0 http://id.loc.gov/authorities/names/no2016139832 | |
| 758 | |i has work: |a Advanced micro-device engineering VI (Text) |1 https://id.oclc.org/worldcat/entity/E39PCFCvKCq4dJk7hTD3GJMr4q |4 https://id.oclc.org/worldcat/ontology/hasWork | ||
| 776 | 0 | 8 | |i Print version: |a International Conference on Advanced Micro-Device Engineering (6th : 2014 : Kiryū-shi, Japan), issuing body. |t Advanced micro-device engineering VI. |d Pfaffikon, Switzerland : Trans Tech Publications Ltd., [2016] |z 3038356980 |w (OCoLC)956739269 |
| 830 | 0 | |a Key engineering materials ; |v v. 698. |0 http://id.loc.gov/authorities/names/no99072054 | |
| 856 | 4 | 0 | |l FWS01 |p ZDB-4-EBA |q FWS_PDA_EBA |u https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=1331674 |3 Volltext |
| 938 | |a EBSCOhost |b EBSC |n 1331674 | ||
| 938 | |a Trans Tech Publications, Ltd |b TRAN |n 10.4028/www.scientific.net/KEM.698 | ||
| 994 | |a 92 |b GEBAY | ||
| 912 | |a ZDB-4-EBA | ||
| 049 | |a DE-863 | ||
Datensatz im Suchindex
| DE-BY-FWS_katkey | ZDB-4-EBA-ocn978351974 |
|---|---|
| _version_ | 1816882383281979392 |
| adam_text | |
| any_adam_object | |
| author2 | Kasuya, Ken-ichi (Of Gunma University) |
| author2_role | edt |
| author2_variant | k i k kik |
| author_GND | http://id.loc.gov/authorities/names/no2016139832 |
| author_corporate | International Conference on Advanced Micro-Device Engineering Kiryū-shi, Japan |
| author_corporate_role | |
| author_facet | Kasuya, Ken-ichi (Of Gunma University) International Conference on Advanced Micro-Device Engineering Kiryū-shi, Japan |
| author_sort | International Conference on Advanced Micro-Device Engineering Kiryū-shi, Japan |
| building | Verbundindex |
| bvnumber | localFWS |
| callnumber-first | T - Technology |
| callnumber-label | T174 |
| callnumber-raw | T174.7 .I58 2014eb |
| callnumber-search | T174.7 .I58 2014eb |
| callnumber-sort | T 3174.7 I58 42014EB |
| callnumber-subject | T - General Technology |
| collection | ZDB-4-EBA |
| ctrlnum | (OCoLC)978351974 |
| dewey-full | 620/.5 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 620 - Engineering and allied operations |
| dewey-raw | 620/.5 |
| dewey-search | 620/.5 |
| dewey-sort | 3620 15 |
| dewey-tens | 620 - Engineering and allied operations |
| format | Electronic Conference Proceeding eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>04373cam a2200673 i 4500</leader><controlfield tag="001">ZDB-4-EBA-ocn978351974</controlfield><controlfield tag="003">OCoLC</controlfield><controlfield tag="005">20241004212047.0</controlfield><controlfield tag="006">m o d </controlfield><controlfield tag="007">cr cnu---unuuu</controlfield><controlfield tag="008">170324s2016 sz a ob 101 0 eng d</controlfield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">N$T</subfield><subfield code="b">eng</subfield><subfield code="e">rda</subfield><subfield code="e">pn</subfield><subfield code="c">N$T</subfield><subfield code="d">CUS</subfield><subfield code="d">SNK</subfield><subfield code="d">DKU</subfield><subfield code="d">AUW</subfield><subfield code="d">INTCL</subfield><subfield code="d">IGB</subfield><subfield code="d">D6H</subfield><subfield code="d">VTS</subfield><subfield code="d">AGLDB</subfield><subfield code="d">G3B</subfield><subfield code="d">S8J</subfield><subfield code="d">S9I</subfield><subfield code="d">STF</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">TTECH</subfield><subfield code="d">OCL</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCL</subfield></datafield><datafield tag="019" ind1=" " ind2=" "><subfield code="a">1162206157</subfield><subfield code="a">1241895571</subfield><subfield code="a">1300576712</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783035701869</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3035701865</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">3038356980</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9783038356981</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)978351974</subfield><subfield code="z">(OCoLC)1162206157</subfield><subfield code="z">(OCoLC)1241895571</subfield><subfield code="z">(OCoLC)1300576712</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">T174.7</subfield><subfield code="b">.I58 2014eb</subfield></datafield><datafield tag="072" ind1=" " ind2="7"><subfield code="a">TEC</subfield><subfield code="x">009000</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="072" ind1=" " ind2="7"><subfield code="a">TEC</subfield><subfield code="x">035000</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="082" ind1="7" ind2=" "><subfield code="a">620/.5</subfield><subfield code="2">23</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">MAIN</subfield></datafield><datafield tag="111" ind1="2" ind2=" "><subfield code="a">International Conference on Advanced Micro-Device Engineering</subfield><subfield code="n">(6th :</subfield><subfield code="d">2014 :</subfield><subfield code="c">Kiryū-shi, Japan),</subfield><subfield code="j">issuing body.</subfield><subfield code="0">http://id.loc.gov/authorities/names/no2016137525</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advanced micro-device engineering VI :</subfield><subfield code="b">selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan /</subfield><subfield code="c">edited by Ken-ichi Kasuya.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Pfaffikon, Switzerland :</subfield><subfield code="b">Trans Tech Publications Ltd.,</subfield><subfield code="c">[2016]</subfield></datafield><datafield tag="264" ind1=" " ind2="2"><subfield code="a">Pfaffikon, Switzerland ;</subfield><subfield code="a">Enfield, NH USA :</subfield><subfield code="b">Trans Tech Publications Ltd.,</subfield><subfield code="c">[2016]</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">©2016</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (viii, 180 pages) :</subfield><subfield code="b">illustrations</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Key Engineering Materials,</subfield><subfield code="x">1013-9826 ;</subfield><subfield code="v">volume 698</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and indexes.</subfield></datafield><datafield tag="588" ind1="0" ind2=" "><subfield code="a">Print version record.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This special issue is the proceedings of the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014) organized by the Human Resource Cultivation Center, Gunma University, held on 5 December 2014 in Kiryu, Japan. Scopes of this proceedings are advanced materials, nanomaterials and technologies, electronics, microelectronics, photonics, biomedical engineering and some technologies of measurements in engineering. Materials Science, Nanomaterials, Nanotechnologies, Microelectronics, Electronics, Photonics, Measurement, Biomedical Engineering Materials Science.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Nanotechnology</subfield><subfield code="x">Research</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Microelectromechanical systems</subfield><subfield code="x">Research</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Miniature electronic equipment</subfield><subfield code="x">Technological innovations</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Microelectronics</subfield><subfield code="x">Technological innovations</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Mechatronics</subfield><subfield code="x">Technological innovations</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Microsystèmes électromécaniques</subfield><subfield code="x">Recherche</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Équipement électronique miniaturisé</subfield><subfield code="x">Innovations</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Microélectronique</subfield><subfield code="x">Innovations</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Mécatronique</subfield><subfield code="x">Innovations</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING</subfield><subfield code="x">Engineering (General)</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING</subfield><subfield code="x">Reference.</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Nanotechnology</subfield><subfield code="x">Research</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microelectronics</subfield><subfield code="x">Technological innovations</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Nanotechnology</subfield><subfield code="2">fast</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="a">Conference papers and proceedings</subfield><subfield code="2">fast</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kasuya, Ken-ichi</subfield><subfield code="c">(Of Gunma University),</subfield><subfield code="e">editor.</subfield><subfield code="1">https://id.oclc.org/worldcat/entity/E39PCjFDTQgH3jFDXpccxTMxCP</subfield><subfield code="0">http://id.loc.gov/authorities/names/no2016139832</subfield></datafield><datafield tag="758" ind1=" " ind2=" "><subfield code="i">has work:</subfield><subfield code="a">Advanced micro-device engineering VI (Text)</subfield><subfield code="1">https://id.oclc.org/worldcat/entity/E39PCFCvKCq4dJk7hTD3GJMr4q</subfield><subfield code="4">https://id.oclc.org/worldcat/ontology/hasWork</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Print version:</subfield><subfield code="a">International Conference on Advanced Micro-Device Engineering (6th : 2014 : Kiryū-shi, Japan), issuing body.</subfield><subfield code="t">Advanced micro-device engineering VI.</subfield><subfield code="d">Pfaffikon, Switzerland : Trans Tech Publications Ltd., [2016]</subfield><subfield code="z">3038356980</subfield><subfield code="w">(OCoLC)956739269</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Key engineering materials ;</subfield><subfield code="v">v. 698.</subfield><subfield code="0">http://id.loc.gov/authorities/names/no99072054</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="l">FWS01</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FWS_PDA_EBA</subfield><subfield code="u">https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=1331674</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">EBSCOhost</subfield><subfield code="b">EBSC</subfield><subfield code="n">1331674</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">Trans Tech Publications, Ltd</subfield><subfield code="b">TRAN</subfield><subfield code="n">10.4028/www.scientific.net/KEM.698</subfield></datafield><datafield tag="994" ind1=" " ind2=" "><subfield code="a">92</subfield><subfield code="b">GEBAY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-EBA</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-863</subfield></datafield></record></collection> |
| genre | Conference papers and proceedings fast |
| genre_facet | Conference papers and proceedings |
| id | ZDB-4-EBA-ocn978351974 |
| illustrated | Illustrated |
| indexdate | 2024-11-27T13:27:44Z |
| institution | BVB |
| institution_GND | http://id.loc.gov/authorities/names/no2016137525 |
| isbn | 9783035701869 3035701865 |
| issn | 1013-9826 ; |
| language | English |
| oclc_num | 978351974 |
| open_access_boolean | |
| owner | MAIN DE-863 DE-BY-FWS |
| owner_facet | MAIN DE-863 DE-BY-FWS |
| physical | 1 online resource (viii, 180 pages) : illustrations |
| psigel | ZDB-4-EBA |
| publishDate | 2016 |
| publishDateSearch | 2016 |
| publishDateSort | 2016 |
| publisher | Trans Tech Publications Ltd., |
| record_format | marc |
| series | Key engineering materials ; |
| series2 | Key Engineering Materials, |
| spelling | International Conference on Advanced Micro-Device Engineering (6th : 2014 : Kiryū-shi, Japan), issuing body. http://id.loc.gov/authorities/names/no2016137525 Advanced micro-device engineering VI : selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan / edited by Ken-ichi Kasuya. Pfaffikon, Switzerland : Trans Tech Publications Ltd., [2016] Pfaffikon, Switzerland ; Enfield, NH USA : Trans Tech Publications Ltd., [2016] ©2016 1 online resource (viii, 180 pages) : illustrations text txt rdacontent computer c rdamedia online resource cr rdacarrier Key Engineering Materials, 1013-9826 ; volume 698 Includes bibliographical references and indexes. Print version record. This special issue is the proceedings of the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014) organized by the Human Resource Cultivation Center, Gunma University, held on 5 December 2014 in Kiryu, Japan. Scopes of this proceedings are advanced materials, nanomaterials and technologies, electronics, microelectronics, photonics, biomedical engineering and some technologies of measurements in engineering. Materials Science, Nanomaterials, Nanotechnologies, Microelectronics, Electronics, Photonics, Measurement, Biomedical Engineering Materials Science. Nanotechnology Research Congresses. Microelectromechanical systems Research Congresses. Miniature electronic equipment Technological innovations Congresses. Microelectronics Technological innovations Congresses. Mechatronics Technological innovations Congresses. Microsystèmes électromécaniques Recherche Congrès. Équipement électronique miniaturisé Innovations Congrès. Microélectronique Innovations Congrès. Mécatronique Innovations Congrès. TECHNOLOGY & ENGINEERING Engineering (General) bisacsh TECHNOLOGY & ENGINEERING Reference. bisacsh Nanotechnology Research fast Microelectronics Technological innovations fast Nanotechnology fast Conference papers and proceedings fast Kasuya, Ken-ichi (Of Gunma University), editor. https://id.oclc.org/worldcat/entity/E39PCjFDTQgH3jFDXpccxTMxCP http://id.loc.gov/authorities/names/no2016139832 has work: Advanced micro-device engineering VI (Text) https://id.oclc.org/worldcat/entity/E39PCFCvKCq4dJk7hTD3GJMr4q https://id.oclc.org/worldcat/ontology/hasWork Print version: International Conference on Advanced Micro-Device Engineering (6th : 2014 : Kiryū-shi, Japan), issuing body. Advanced micro-device engineering VI. Pfaffikon, Switzerland : Trans Tech Publications Ltd., [2016] 3038356980 (OCoLC)956739269 Key engineering materials ; v. 698. http://id.loc.gov/authorities/names/no99072054 FWS01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=1331674 Volltext |
| spellingShingle | Advanced micro-device engineering VI : selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan / Key engineering materials ; Nanotechnology Research Congresses. Microelectromechanical systems Research Congresses. Miniature electronic equipment Technological innovations Congresses. Microelectronics Technological innovations Congresses. Mechatronics Technological innovations Congresses. Microsystèmes électromécaniques Recherche Congrès. Équipement électronique miniaturisé Innovations Congrès. Microélectronique Innovations Congrès. Mécatronique Innovations Congrès. TECHNOLOGY & ENGINEERING Engineering (General) bisacsh TECHNOLOGY & ENGINEERING Reference. bisacsh Nanotechnology Research fast Microelectronics Technological innovations fast Nanotechnology fast |
| title | Advanced micro-device engineering VI : selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan / |
| title_auth | Advanced micro-device engineering VI : selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan / |
| title_exact_search | Advanced micro-device engineering VI : selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan / |
| title_full | Advanced micro-device engineering VI : selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan / edited by Ken-ichi Kasuya. |
| title_fullStr | Advanced micro-device engineering VI : selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan / edited by Ken-ichi Kasuya. |
| title_full_unstemmed | Advanced micro-device engineering VI : selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan / edited by Ken-ichi Kasuya. |
| title_short | Advanced micro-device engineering VI : |
| title_sort | advanced micro device engineering vi selected peer reviewed papers from the 6th international conference on advanced micro device engineering amde 2014 december 5 2014 kiryu japan |
| title_sub | selected, peer reviewed papers from the 6th International Conference on Advanced Micro-Device Engineering (AMDE 2014), December 5, 2014, Kiryu, Japan / |
| topic | Nanotechnology Research Congresses. Microelectromechanical systems Research Congresses. Miniature electronic equipment Technological innovations Congresses. Microelectronics Technological innovations Congresses. Mechatronics Technological innovations Congresses. Microsystèmes électromécaniques Recherche Congrès. Équipement électronique miniaturisé Innovations Congrès. Microélectronique Innovations Congrès. Mécatronique Innovations Congrès. TECHNOLOGY & ENGINEERING Engineering (General) bisacsh TECHNOLOGY & ENGINEERING Reference. bisacsh Nanotechnology Research fast Microelectronics Technological innovations fast Nanotechnology fast |
| topic_facet | Nanotechnology Research Congresses. Microelectromechanical systems Research Congresses. Miniature electronic equipment Technological innovations Congresses. Microelectronics Technological innovations Congresses. Mechatronics Technological innovations Congresses. Microsystèmes électromécaniques Recherche Congrès. Équipement électronique miniaturisé Innovations Congrès. Microélectronique Innovations Congrès. Mécatronique Innovations Congrès. TECHNOLOGY & ENGINEERING Engineering (General) TECHNOLOGY & ENGINEERING Reference. Nanotechnology Research Microelectronics Technological innovations Nanotechnology Conference papers and proceedings |
| url | https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=1331674 |
| work_keys_str_mv | AT internationalconferenceonadvancedmicrodeviceengineeringkiryushijapan advancedmicrodeviceengineeringviselectedpeerreviewedpapersfromthe6thinternationalconferenceonadvancedmicrodeviceengineeringamde2014december52014kiryujapan AT kasuyakenichi advancedmicrodeviceengineeringviselectedpeerreviewedpapersfromthe6thinternationalconferenceonadvancedmicrodeviceengineeringamde2014december52014kiryujapan |