Advances in chemical mechanical planarization (CMP) /:
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...
Gespeichert in:
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Waltham, MA :
Woodhead Publishing,
[2016]
|
| Schriftenreihe: | Woodhead Publishing series in electronic and optical materials ;
no. 86. |
| Schlagworte: | |
| Online-Zugang: | DE-862 DE-863 DE-862 DE-863 |
| Zusammenfassung: | Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. |
| Beschreibung: | 1 online resource |
| Bibliographie: | Includes bibliographical references and index. |
| ISBN: | 9780081002186 0081002181 |
Internformat
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| 490 | 1 | |a Woodhead publishing series in electronic and optical materials ; |v number 86 | |
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| 504 | |a Includes bibliographical references and index. | ||
| 520 | |a Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. | ||
| 505 | 0 | 0 | |g Part One: |t CMP of dielectric and metal films: |g 1. |t Chemical and physical mechanisms of dielectric chemical mechanical polishing (CMP) / |r Y. Moon -- |g 2. |t Copper chemical mechanical planarization (Cu CMP) challenges in 22 nm back-end-of-line (BEOL) and beyond / |r M. Krishnan & M.F. Lofaro -- |g 3. |t Electrochemical techniques and their applications for chemical mechanical planarization (CMP) of metal films / |r D. Roy -- |g 4. |t Ultra low-k materials and chemical mechanical planarization (CMP) / |r J. Nalaskowski & S.S. Papa Rao -- |g 5. |t CMP processing of high mobility channel materials: alternatives to Si / |r P. Ong & L. Teugels -- |g 6. |t Multiscale modeling of chemical mechanical planarization (CMP) / |r W. Fan & D. Boning -- |g 7. |t Polishing of SiC films / |r U.R.K. Lagudu -- |g 8. |t Chemical and physical mechanisms of CMP of gallium nitride / |r H. Aida -- |g 9. |t Abrasive-free and ultra-low abrasive chemical mechanical polishing (CMP) processes / |r N.K. Penta -- |g 10. |t Environmental aspects of planarization processes / |r D.E. Speed. |
| 505 | 8 | 0 | |g Part Two: |t Consumables and process control for improved CMP: |g 11. |t Preparation and characterization of slurry for chemical mechanical planarization (CMP) / |r J. Seo & U. Pail -- |g 12. |t Chemical metrology methods for CMP quality / |r K. Pate & P. Safier -- |g 13. |t Diamond disc pad conditioning in chemical mechanical polishing / |r Z.C. Li, E.A. Baisie, X.H. Zhang & Q. Zhang -- |g 14. |t Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy / |r U. Künzelmann & H. Schumacher -- |g 15. |t A novel slurry injection system for CMP / |r L. Borucki -- |g 16. |t Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters / |r M. Tsujimura -- |g 17. |t Approaches to defect characterization, mitigation and reduction / |r W.-T. Tseng -- |g 18. |t Applications of chemical mechanical planarization (CMP) to more than Moore devices / |r G. Zwicker -- |g 19. |t CMP for phase change materials / |r Z. Song & L. Wang. |
| 650 | 0 | |a Chemical mechanical planarization. |0 http://id.loc.gov/authorities/subjects/sh2007002521 | |
| 650 | 0 | |a Nanoelectronics. |0 http://id.loc.gov/authorities/subjects/sh2006009047 | |
| 650 | 0 | |a Microelectronics. |0 http://id.loc.gov/authorities/subjects/sh85084822 | |
| 650 | 2 | |a Miniaturization |0 https://id.nlm.nih.gov/mesh/D008904 | |
| 650 | 6 | |a Planarisation chimicomécanique. | |
| 650 | 6 | |a Nanoélectronique. | |
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Datensatz im Suchindex
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| adam_text | |
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| author2 | Babu, S. V. |
| author2_role | edt |
| author2_variant | s v b sv svb |
| author_GND | http://id.loc.gov/authorities/names/n99253915 |
| author_additional | Y. Moon -- M. Krishnan & M.F. Lofaro -- D. Roy -- J. Nalaskowski & S.S. Papa Rao -- P. Ong & L. Teugels -- W. Fan & D. Boning -- U.R.K. Lagudu -- H. Aida -- N.K. Penta -- D.E. Speed. J. Seo & U. Pail -- K. Pate & P. Safier -- Z.C. Li, E.A. Baisie, X.H. Zhang & Q. Zhang -- U. Künzelmann & H. Schumacher -- L. Borucki -- M. Tsujimura -- W.-T. Tseng -- G. Zwicker -- Z. Song & L. Wang. |
| author_facet | Babu, S. V. |
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| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874.84 |
| callnumber-search | TK7874.84 |
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| callnumber-subject | TK - Electrical and Nuclear Engineering |
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| contents | CMP of dielectric and metal films: Chemical and physical mechanisms of dielectric chemical mechanical polishing (CMP) / Copper chemical mechanical planarization (Cu CMP) challenges in 22 nm back-end-of-line (BEOL) and beyond / Electrochemical techniques and their applications for chemical mechanical planarization (CMP) of metal films / Ultra low-k materials and chemical mechanical planarization (CMP) / CMP processing of high mobility channel materials: alternatives to Si / Multiscale modeling of chemical mechanical planarization (CMP) / Polishing of SiC films / Chemical and physical mechanisms of CMP of gallium nitride / Abrasive-free and ultra-low abrasive chemical mechanical polishing (CMP) processes / Environmental aspects of planarization processes / Consumables and process control for improved CMP: Preparation and characterization of slurry for chemical mechanical planarization (CMP) / Chemical metrology methods for CMP quality / Diamond disc pad conditioning in chemical mechanical polishing / Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy / A novel slurry injection system for CMP / Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters / Approaches to defect characterization, mitigation and reduction / Applications of chemical mechanical planarization (CMP) to more than Moore devices / CMP for phase change materials / |
| ctrlnum | (OCoLC)934626626 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| genre | Electronic book. |
| genre_facet | Electronic book. |
| id | ZDB-4-EBA-ocn934626626 |
| illustrated | Not Illustrated |
| indexdate | 2025-03-18T14:22:41Z |
| institution | BVB |
| isbn | 9780081002186 0081002181 |
| language | English |
| oclc_num | 934626626 |
| open_access_boolean | |
| owner | MAIN DE-862 DE-BY-FWS DE-863 DE-BY-FWS |
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| physical | 1 online resource |
| psigel | ZDB-4-EBA FWS_PDA_EBA ZDB-4-EBA |
| publishDate | 2016 |
| publishDateSearch | 2016 |
| publishDateSort | 2016 |
| publisher | Woodhead Publishing, |
| record_format | marc |
| series | Woodhead Publishing series in electronic and optical materials ; |
| series2 | Woodhead publishing series in electronic and optical materials ; |
| spelling | Advances in chemical mechanical planarization (CMP) / edited by Suryadevara Babu. Waltham, MA : Woodhead Publishing, [2016] ©2016 1 online resource text txt rdacontent computer c rdamedia online resource cr rdacarrier Woodhead publishing series in electronic and optical materials ; number 86 Online resource; title from PDF title page (EBSCO, viewed January 14, 2016). Includes bibliographical references and index. Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Part One: CMP of dielectric and metal films: 1. Chemical and physical mechanisms of dielectric chemical mechanical polishing (CMP) / Y. Moon -- 2. Copper chemical mechanical planarization (Cu CMP) challenges in 22 nm back-end-of-line (BEOL) and beyond / M. Krishnan & M.F. Lofaro -- 3. Electrochemical techniques and their applications for chemical mechanical planarization (CMP) of metal films / D. Roy -- 4. Ultra low-k materials and chemical mechanical planarization (CMP) / J. Nalaskowski & S.S. Papa Rao -- 5. CMP processing of high mobility channel materials: alternatives to Si / P. Ong & L. Teugels -- 6. Multiscale modeling of chemical mechanical planarization (CMP) / W. Fan & D. Boning -- 7. Polishing of SiC films / U.R.K. Lagudu -- 8. Chemical and physical mechanisms of CMP of gallium nitride / H. Aida -- 9. Abrasive-free and ultra-low abrasive chemical mechanical polishing (CMP) processes / N.K. Penta -- 10. Environmental aspects of planarization processes / D.E. Speed. Part Two: Consumables and process control for improved CMP: 11. Preparation and characterization of slurry for chemical mechanical planarization (CMP) / J. Seo & U. Pail -- 12. Chemical metrology methods for CMP quality / K. Pate & P. Safier -- 13. Diamond disc pad conditioning in chemical mechanical polishing / Z.C. Li, E.A. Baisie, X.H. Zhang & Q. Zhang -- 14. Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy / U. Künzelmann & H. Schumacher -- 15. A novel slurry injection system for CMP / L. Borucki -- 16. Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters / M. Tsujimura -- 17. Approaches to defect characterization, mitigation and reduction / W.-T. Tseng -- 18. Applications of chemical mechanical planarization (CMP) to more than Moore devices / G. Zwicker -- 19. CMP for phase change materials / Z. Song & L. Wang. Chemical mechanical planarization. http://id.loc.gov/authorities/subjects/sh2007002521 Nanoelectronics. http://id.loc.gov/authorities/subjects/sh2006009047 Microelectronics. http://id.loc.gov/authorities/subjects/sh85084822 Miniaturization https://id.nlm.nih.gov/mesh/D008904 Planarisation chimicomécanique. Nanoélectronique. Microélectronique. microelectronics. aat TECHNOLOGY & ENGINEERING Mechanical. bisacsh Chemical mechanical planarization fast Microelectronics fast Nanoelectronics fast Electronic book. Babu, S. V., editor. http://id.loc.gov/authorities/names/n99253915 has work: Advances in chemical mechanical planarization (CMP) (Text) https://id.oclc.org/worldcat/entity/E39PCGjG6qvwcp4HFKbfHjJQRq https://id.oclc.org/worldcat/ontology/hasWork Woodhead Publishing series in electronic and optical materials ; no. 86. http://id.loc.gov/authorities/names/no2013009353 |
| spellingShingle | Advances in chemical mechanical planarization (CMP) / Woodhead Publishing series in electronic and optical materials ; CMP of dielectric and metal films: Chemical and physical mechanisms of dielectric chemical mechanical polishing (CMP) / Copper chemical mechanical planarization (Cu CMP) challenges in 22 nm back-end-of-line (BEOL) and beyond / Electrochemical techniques and their applications for chemical mechanical planarization (CMP) of metal films / Ultra low-k materials and chemical mechanical planarization (CMP) / CMP processing of high mobility channel materials: alternatives to Si / Multiscale modeling of chemical mechanical planarization (CMP) / Polishing of SiC films / Chemical and physical mechanisms of CMP of gallium nitride / Abrasive-free and ultra-low abrasive chemical mechanical polishing (CMP) processes / Environmental aspects of planarization processes / Consumables and process control for improved CMP: Preparation and characterization of slurry for chemical mechanical planarization (CMP) / Chemical metrology methods for CMP quality / Diamond disc pad conditioning in chemical mechanical polishing / Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy / A novel slurry injection system for CMP / Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters / Approaches to defect characterization, mitigation and reduction / Applications of chemical mechanical planarization (CMP) to more than Moore devices / CMP for phase change materials / Chemical mechanical planarization. http://id.loc.gov/authorities/subjects/sh2007002521 Nanoelectronics. http://id.loc.gov/authorities/subjects/sh2006009047 Microelectronics. http://id.loc.gov/authorities/subjects/sh85084822 Miniaturization https://id.nlm.nih.gov/mesh/D008904 Planarisation chimicomécanique. Nanoélectronique. Microélectronique. microelectronics. aat TECHNOLOGY & ENGINEERING Mechanical. bisacsh Chemical mechanical planarization fast Microelectronics fast Nanoelectronics fast |
| subject_GND | http://id.loc.gov/authorities/subjects/sh2007002521 http://id.loc.gov/authorities/subjects/sh2006009047 http://id.loc.gov/authorities/subjects/sh85084822 https://id.nlm.nih.gov/mesh/D008904 |
| title | Advances in chemical mechanical planarization (CMP) / |
| title_alt | CMP of dielectric and metal films: Chemical and physical mechanisms of dielectric chemical mechanical polishing (CMP) / Copper chemical mechanical planarization (Cu CMP) challenges in 22 nm back-end-of-line (BEOL) and beyond / Electrochemical techniques and their applications for chemical mechanical planarization (CMP) of metal films / Ultra low-k materials and chemical mechanical planarization (CMP) / CMP processing of high mobility channel materials: alternatives to Si / Multiscale modeling of chemical mechanical planarization (CMP) / Polishing of SiC films / Chemical and physical mechanisms of CMP of gallium nitride / Abrasive-free and ultra-low abrasive chemical mechanical polishing (CMP) processes / Environmental aspects of planarization processes / Consumables and process control for improved CMP: Preparation and characterization of slurry for chemical mechanical planarization (CMP) / Chemical metrology methods for CMP quality / Diamond disc pad conditioning in chemical mechanical polishing / Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy / A novel slurry injection system for CMP / Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters / Approaches to defect characterization, mitigation and reduction / Applications of chemical mechanical planarization (CMP) to more than Moore devices / CMP for phase change materials / |
| title_auth | Advances in chemical mechanical planarization (CMP) / |
| title_exact_search | Advances in chemical mechanical planarization (CMP) / |
| title_full | Advances in chemical mechanical planarization (CMP) / edited by Suryadevara Babu. |
| title_fullStr | Advances in chemical mechanical planarization (CMP) / edited by Suryadevara Babu. |
| title_full_unstemmed | Advances in chemical mechanical planarization (CMP) / edited by Suryadevara Babu. |
| title_short | Advances in chemical mechanical planarization (CMP) / |
| title_sort | advances in chemical mechanical planarization cmp |
| topic | Chemical mechanical planarization. http://id.loc.gov/authorities/subjects/sh2007002521 Nanoelectronics. http://id.loc.gov/authorities/subjects/sh2006009047 Microelectronics. http://id.loc.gov/authorities/subjects/sh85084822 Miniaturization https://id.nlm.nih.gov/mesh/D008904 Planarisation chimicomécanique. Nanoélectronique. Microélectronique. microelectronics. aat TECHNOLOGY & ENGINEERING Mechanical. bisacsh Chemical mechanical planarization fast Microelectronics fast Nanoelectronics fast |
| topic_facet | Chemical mechanical planarization. Nanoelectronics. Microelectronics. Miniaturization Planarisation chimicomécanique. Nanoélectronique. Microélectronique. microelectronics. TECHNOLOGY & ENGINEERING Mechanical. Chemical mechanical planarization Microelectronics Nanoelectronics Electronic book. |
| work_keys_str_mv | AT babusv advancesinchemicalmechanicalplanarizationcmp |