Advanced functional materials :: selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China /
Collection of selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. The 127 papers are grouped as follows: Symposium E: Materials in Microelectronic and Optoelectronic Industry; Symposium G: Multiferroic Materials; Symposium H: Smart Mate...
Gespeichert in:
Körperschaft: | |
---|---|
Weitere Verfasser: | , , |
Format: | Elektronisch Tagungsbericht E-Book |
Sprache: | English |
Veröffentlicht: |
Pfäffikon, Switzerland :
Trans Tech Publications Ltd,
2015.
|
Schriftenreihe: | Materials science forum ;
v. 815. |
Schlagworte: | |
Online-Zugang: | DE-862 DE-863 |
Zusammenfassung: | Collection of selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. The 127 papers are grouped as follows: Symposium E: Materials in Microelectronic and Optoelectronic Industry; Symposium G: Multiferroic Materials; Symposium H: Smart Materials; Symposium I: Vanadium-Titanium And Rare Earth Functional Materials; Symposium J: Biomedical Materials; Symposium K: High Performance And Functional Polymer and Composite Materials. |
Beschreibung: | 1 online resource (712 pages) : illustrations |
Bibliographie: | Includes bibliographical references at the end of each chapters and indexes. |
ISBN: | 3038267805 9783038267805 |
ISSN: | 1662-9752 ; 1662-9752 |
Internformat
MARC
LEADER | 00000cam a2200000 i 4500 | ||
---|---|---|---|
001 | ZDB-4-EBA-ocn909898007 | ||
003 | OCoLC | ||
005 | 20250103110447.0 | ||
006 | m o d | ||
007 | cr cn||||||||| | ||
008 | 150425t20152015sz a ob 101 0 eng d | ||
040 | |a E7B |b eng |e rda |e pn |c E7B |d EBLCP |d CUS |d OCLCO |d OCLCQ |d OCLCO |d YDXCP |d OCLCQ |d WAU |d LLB |d OCLCF |d OCLCQ |d TTECH |d N$T |d OCLCO |d OCLCQ |d OCLCO |d OCLCL |d OCLCQ | ||
019 | |a 908100909 |a 913798003 |a 927293351 | ||
020 | |a 3038267805 |q (e-book) | ||
020 | |a 9783038267805 |q (electronic bk.) | ||
020 | |z 9783038353942 | ||
035 | |a (OCoLC)909898007 |z (OCoLC)908100909 |z (OCoLC)913798003 |z (OCoLC)927293351 | ||
050 | 4 | |a TK7871 |b .C456 2015eb | |
082 | 7 | |a 621.381 |2 23 | |
049 | |a MAIN | ||
111 | 2 | |a Chinese Materials Congress |d (2014 : |c Chengdu, China) |0 http://id.loc.gov/authorities/names/no2015060543 | |
245 | 1 | 0 | |a Advanced functional materials : |b selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China / |c edited by Yafang Han, Zhongwei Gu and Qiang Fu. |
264 | 1 | |a Pfäffikon, Switzerland : |b Trans Tech Publications Ltd, |c 2015. | |
264 | 4 | |c ©2015 | |
300 | |a 1 online resource (712 pages) : |b illustrations | ||
336 | |a text |b txt |2 rdacontent | ||
337 | |a computer |b c |2 rdamedia | ||
338 | |a online resource |b cr |2 rdacarrier | ||
490 | 1 | |a Materials Science Forum, |x 1662-9752 ; |v Volume 815 | |
504 | |a Includes bibliographical references at the end of each chapters and indexes. | ||
588 | 0 | |a Online resource; title from PDF title page (ebrary, viewed April 25, 2015). | |
505 | 0 | |a Advanced Functional Materials; Preface; Table of Contents; Symposium E: Materials in Microelectronic and Optoelectronic Industry; Process Control of Buried Layer Epitaxy by Barrel Type Furnace; Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing; Research on Surface Roughness of Acid Etched Silicon Wafers; Investigation of Chemical Vapor Deposited Graphene Film on Oxide Substrate; Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects; Property of an AlGaN/GaN MIS Diode with Si3N4/Al2O3 Bilayer Gate Dielectric Films. | |
505 | 8 | |a A New Type of Self-Aligned Technology for RF and Microwave Graphene Field-Effect TransistorsElectron Beam Annealing for Component Optimization in Si-Sb-Te Material; Structures and Electronic Properties of a Si55 Cluster on DFTB Calculations; Surface Plasmon Enhanced Photoluminescence of the Rubrene Film by Silver Nanoparticles; Development of Precious Metal and its Alloy Sputtering Targets with High Performance; Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites; Study of Black Center in Silicon Wafer for Solar Cell. | |
505 | 8 | |a Impurity Detection Method for High-Purity BCl3First-Principles Study on Electronic and Optical Properties of Kesterite and Stannite Cu2ZnSnS4 Photovoltaic Absorbers; Effect of Acetic Acid/Water Ratio on the Microstructure and Properties of LaNiO3 Thin Films by Metal Organic Solution Deposition; Symposium F: Electronic Materials; Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn-3.0Ag-0.5Cu Solder during Thermal Cycling. | |
505 | 8 | |a Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu SubstrateEffect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder; Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn; Microstructure and Dielectric Properties of (Ba, Ta) Co-Doped Sr2Nb2O7 Ceramics; Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate. | |
505 | 8 | |a Ferroelectric and Photovoltaic Properties of Mn-Doped Bismuth Ferrite Thin FilmsMagnetic Properties and Unusual Morphologies of Barium Ferrites Prepared by Electrospinning and Sol-Gel Auto-Combustion Method; Symposium G: Multiferroic Materials; Effects of Sm and Mn Co-Doping on Structural and Optical Properties of BiFeO3 Thin Films Prepared by Sol-Gel Technique; Effects of Ba and Ti Codoping on Stoichiometric and Nonstoichiometric BiFeO3 Multiferroic Ceramics; A Review on the Characteristics of the New Multiferroic Three-Ply Structure Ferroelectric-Ferromagnetic Nanocomposite. | |
520 | |a Collection of selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. The 127 papers are grouped as follows: Symposium E: Materials in Microelectronic and Optoelectronic Industry; Symposium G: Multiferroic Materials; Symposium H: Smart Materials; Symposium I: Vanadium-Titanium And Rare Earth Functional Materials; Symposium J: Biomedical Materials; Symposium K: High Performance And Functional Polymer and Composite Materials. | ||
650 | 0 | |a Electronics |x Materials |v Congresses. | |
650 | 0 | |a Smart materials |x Research |v Congresses. | |
650 | 0 | |a Rare earths |x Research |v Congresses. | |
650 | 0 | |a Biomedical materials |x Research |v Congresses. | |
650 | 0 | |a Composite materials |x Research |v Congresses. | |
650 | 0 | |a Polymers |x Research |v Congresses. | |
650 | 6 | |a Électronique |x Matériaux |v Congrès. | |
650 | 6 | |a Matériaux intelligents |x Recherche |v Congrès. | |
650 | 6 | |a Terres rares |x Recherche |v Congrès. | |
650 | 6 | |a Composites |x Recherche |v Congrès. | |
650 | 6 | |a Polymères |x Recherche |v Congrès. | |
650 | 7 | |a Biomedical materials |x Research |2 fast | |
650 | 7 | |a Composite materials |x Research |2 fast | |
650 | 7 | |a Electronics |x Materials |2 fast | |
650 | 7 | |a Polymers |x Research |2 fast | |
650 | 7 | |a Smart materials |x Research |2 fast | |
655 | 7 | |a Conference papers and proceedings |2 fast | |
700 | 1 | |a Han, Yafang, |e editor. |0 http://id.loc.gov/authorities/names/n90726779 | |
700 | 1 | |a Gu, Zhongwei, |e editor. |0 http://id.loc.gov/authorities/names/nb2009009832 | |
700 | 1 | |a Fu, Qiang, |d 1963- |e editor. |1 https://id.oclc.org/worldcat/entity/E39PCjKh9bjyRCHjdkkrPkjmYd |0 http://id.loc.gov/authorities/names/no2008176836 | |
758 | |i has work: |a Advanced functional materials (Text) |1 https://id.oclc.org/worldcat/entity/E39PCH3wFtqYhvcgw8xkYDmbFq |4 https://id.oclc.org/worldcat/ontology/hasWork | ||
776 | 0 | 8 | |i Print version: |a Chinese Materials Congress (2014 : Chengdu, China). |t Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. |d Pfäffikon, Switzerland : Trans Tech Publications Ltd, ©2015 |h 712 pages |k Materials science forum ; Volume 815 |x 1662-9752 |z 9783038353942 |
830 | 0 | |a Materials science forum ; |v v. 815. |0 http://id.loc.gov/authorities/names/no94007967 | |
966 | 4 | 0 | |l DE-862 |p ZDB-4-EBA |q FWS_PDA_EBA |u https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=975672 |3 Volltext |
966 | 4 | 0 | |l DE-863 |p ZDB-4-EBA |q FWS_PDA_EBA |u https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=975672 |3 Volltext |
938 | |a Trans Tech Publications, Ltd |b TRAN |n 10.4028/www.scientific.net/MSF.815 | ||
938 | |a ProQuest Ebook Central |b EBLB |n EBL2008335 | ||
938 | |a ebrary |b EBRY |n ebr11042417 | ||
938 | |a YBP Library Services |b YANK |n 12375751 | ||
938 | |a EBSCOhost |b EBSC |n 975672 | ||
994 | |a 92 |b GEBAY | ||
912 | |a ZDB-4-EBA | ||
049 | |a DE-862 | ||
049 | |a DE-863 |
Datensatz im Suchindex
DE-BY-FWS_katkey | ZDB-4-EBA-ocn909898007 |
---|---|
_version_ | 1829095035211087872 |
adam_text | |
any_adam_object | |
author2 | Han, Yafang Gu, Zhongwei Fu, Qiang, 1963- |
author2_role | edt edt edt |
author2_variant | y h yh z g zg q f qf |
author_GND | http://id.loc.gov/authorities/names/n90726779 http://id.loc.gov/authorities/names/nb2009009832 http://id.loc.gov/authorities/names/no2008176836 |
author_corporate | Chinese Materials Congress Chengdu, China |
author_corporate_role | |
author_facet | Han, Yafang Gu, Zhongwei Fu, Qiang, 1963- Chinese Materials Congress Chengdu, China |
author_sort | Chinese Materials Congress Chengdu, China |
building | Verbundindex |
bvnumber | localFWS |
callnumber-first | T - Technology |
callnumber-label | TK7871 |
callnumber-raw | TK7871 .C456 2015eb |
callnumber-search | TK7871 .C456 2015eb |
callnumber-sort | TK 47871 C456 42015EB |
callnumber-subject | TK - Electrical and Nuclear Engineering |
collection | ZDB-4-EBA |
contents | Advanced Functional Materials; Preface; Table of Contents; Symposium E: Materials in Microelectronic and Optoelectronic Industry; Process Control of Buried Layer Epitaxy by Barrel Type Furnace; Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing; Research on Surface Roughness of Acid Etched Silicon Wafers; Investigation of Chemical Vapor Deposited Graphene Film on Oxide Substrate; Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects; Property of an AlGaN/GaN MIS Diode with Si3N4/Al2O3 Bilayer Gate Dielectric Films. A New Type of Self-Aligned Technology for RF and Microwave Graphene Field-Effect TransistorsElectron Beam Annealing for Component Optimization in Si-Sb-Te Material; Structures and Electronic Properties of a Si55 Cluster on DFTB Calculations; Surface Plasmon Enhanced Photoluminescence of the Rubrene Film by Silver Nanoparticles; Development of Precious Metal and its Alloy Sputtering Targets with High Performance; Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites; Study of Black Center in Silicon Wafer for Solar Cell. Impurity Detection Method for High-Purity BCl3First-Principles Study on Electronic and Optical Properties of Kesterite and Stannite Cu2ZnSnS4 Photovoltaic Absorbers; Effect of Acetic Acid/Water Ratio on the Microstructure and Properties of LaNiO3 Thin Films by Metal Organic Solution Deposition; Symposium F: Electronic Materials; Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn-3.0Ag-0.5Cu Solder during Thermal Cycling. Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu SubstrateEffect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder; Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn; Microstructure and Dielectric Properties of (Ba, Ta) Co-Doped Sr2Nb2O7 Ceramics; Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate. Ferroelectric and Photovoltaic Properties of Mn-Doped Bismuth Ferrite Thin FilmsMagnetic Properties and Unusual Morphologies of Barium Ferrites Prepared by Electrospinning and Sol-Gel Auto-Combustion Method; Symposium G: Multiferroic Materials; Effects of Sm and Mn Co-Doping on Structural and Optical Properties of BiFeO3 Thin Films Prepared by Sol-Gel Technique; Effects of Ba and Ti Codoping on Stoichiometric and Nonstoichiometric BiFeO3 Multiferroic Ceramics; A Review on the Characteristics of the New Multiferroic Three-Ply Structure Ferroelectric-Ferromagnetic Nanocomposite. |
ctrlnum | (OCoLC)909898007 |
dewey-full | 621.381 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381 |
dewey-search | 621.381 |
dewey-sort | 3621.381 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic Conference Proceeding eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>07189cam a2200769 i 4500</leader><controlfield tag="001">ZDB-4-EBA-ocn909898007</controlfield><controlfield tag="003">OCoLC</controlfield><controlfield tag="005">20250103110447.0</controlfield><controlfield tag="006">m o d </controlfield><controlfield tag="007">cr cn|||||||||</controlfield><controlfield tag="008">150425t20152015sz a ob 101 0 eng d</controlfield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">E7B</subfield><subfield code="b">eng</subfield><subfield code="e">rda</subfield><subfield code="e">pn</subfield><subfield code="c">E7B</subfield><subfield code="d">EBLCP</subfield><subfield code="d">CUS</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">YDXCP</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">WAU</subfield><subfield code="d">LLB</subfield><subfield code="d">OCLCF</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">TTECH</subfield><subfield code="d">N$T</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCL</subfield><subfield code="d">OCLCQ</subfield></datafield><datafield tag="019" ind1=" " ind2=" "><subfield code="a">908100909</subfield><subfield code="a">913798003</subfield><subfield code="a">927293351</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3038267805</subfield><subfield code="q">(e-book)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038267805</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9783038353942</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)909898007</subfield><subfield code="z">(OCoLC)908100909</subfield><subfield code="z">(OCoLC)913798003</subfield><subfield code="z">(OCoLC)927293351</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">TK7871</subfield><subfield code="b">.C456 2015eb</subfield></datafield><datafield tag="082" ind1="7" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">MAIN</subfield></datafield><datafield tag="111" ind1="2" ind2=" "><subfield code="a">Chinese Materials Congress</subfield><subfield code="d">(2014 :</subfield><subfield code="c">Chengdu, China)</subfield><subfield code="0">http://id.loc.gov/authorities/names/no2015060543</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advanced functional materials :</subfield><subfield code="b">selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China /</subfield><subfield code="c">edited by Yafang Han, Zhongwei Gu and Qiang Fu.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Pfäffikon, Switzerland :</subfield><subfield code="b">Trans Tech Publications Ltd,</subfield><subfield code="c">2015.</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">©2015</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (712 pages) :</subfield><subfield code="b">illustrations</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Materials Science Forum,</subfield><subfield code="x">1662-9752 ;</subfield><subfield code="v">Volume 815</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references at the end of each chapters and indexes.</subfield></datafield><datafield tag="588" ind1="0" ind2=" "><subfield code="a">Online resource; title from PDF title page (ebrary, viewed April 25, 2015).</subfield></datafield><datafield tag="505" ind1="0" ind2=" "><subfield code="a">Advanced Functional Materials; Preface; Table of Contents; Symposium E: Materials in Microelectronic and Optoelectronic Industry; Process Control of Buried Layer Epitaxy by Barrel Type Furnace; Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing; Research on Surface Roughness of Acid Etched Silicon Wafers; Investigation of Chemical Vapor Deposited Graphene Film on Oxide Substrate; Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects; Property of an AlGaN/GaN MIS Diode with Si3N4/Al2O3 Bilayer Gate Dielectric Films.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">A New Type of Self-Aligned Technology for RF and Microwave Graphene Field-Effect TransistorsElectron Beam Annealing for Component Optimization in Si-Sb-Te Material; Structures and Electronic Properties of a Si55 Cluster on DFTB Calculations; Surface Plasmon Enhanced Photoluminescence of the Rubrene Film by Silver Nanoparticles; Development of Precious Metal and its Alloy Sputtering Targets with High Performance; Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites; Study of Black Center in Silicon Wafer for Solar Cell.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Impurity Detection Method for High-Purity BCl3First-Principles Study on Electronic and Optical Properties of Kesterite and Stannite Cu2ZnSnS4 Photovoltaic Absorbers; Effect of Acetic Acid/Water Ratio on the Microstructure and Properties of LaNiO3 Thin Films by Metal Organic Solution Deposition; Symposium F: Electronic Materials; Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn-3.0Ag-0.5Cu Solder during Thermal Cycling.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu SubstrateEffect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder; Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn; Microstructure and Dielectric Properties of (Ba, Ta) Co-Doped Sr2Nb2O7 Ceramics; Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Ferroelectric and Photovoltaic Properties of Mn-Doped Bismuth Ferrite Thin FilmsMagnetic Properties and Unusual Morphologies of Barium Ferrites Prepared by Electrospinning and Sol-Gel Auto-Combustion Method; Symposium G: Multiferroic Materials; Effects of Sm and Mn Co-Doping on Structural and Optical Properties of BiFeO3 Thin Films Prepared by Sol-Gel Technique; Effects of Ba and Ti Codoping on Stoichiometric and Nonstoichiometric BiFeO3 Multiferroic Ceramics; A Review on the Characteristics of the New Multiferroic Three-Ply Structure Ferroelectric-Ferromagnetic Nanocomposite.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Collection of selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. The 127 papers are grouped as follows: Symposium E: Materials in Microelectronic and Optoelectronic Industry; Symposium G: Multiferroic Materials; Symposium H: Smart Materials; Symposium I: Vanadium-Titanium And Rare Earth Functional Materials; Symposium J: Biomedical Materials; Symposium K: High Performance And Functional Polymer and Composite Materials.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Electronics</subfield><subfield code="x">Materials</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Smart materials</subfield><subfield code="x">Research</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Rare earths</subfield><subfield code="x">Research</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Biomedical materials</subfield><subfield code="x">Research</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Composite materials</subfield><subfield code="x">Research</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Polymers</subfield><subfield code="x">Research</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Électronique</subfield><subfield code="x">Matériaux</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Matériaux intelligents</subfield><subfield code="x">Recherche</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Terres rares</subfield><subfield code="x">Recherche</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Composites</subfield><subfield code="x">Recherche</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Polymères</subfield><subfield code="x">Recherche</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Biomedical materials</subfield><subfield code="x">Research</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Composite materials</subfield><subfield code="x">Research</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronics</subfield><subfield code="x">Materials</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Polymers</subfield><subfield code="x">Research</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Smart materials</subfield><subfield code="x">Research</subfield><subfield code="2">fast</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="a">Conference papers and proceedings</subfield><subfield code="2">fast</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Han, Yafang,</subfield><subfield code="e">editor.</subfield><subfield code="0">http://id.loc.gov/authorities/names/n90726779</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gu, Zhongwei,</subfield><subfield code="e">editor.</subfield><subfield code="0">http://id.loc.gov/authorities/names/nb2009009832</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Fu, Qiang,</subfield><subfield code="d">1963-</subfield><subfield code="e">editor.</subfield><subfield code="1">https://id.oclc.org/worldcat/entity/E39PCjKh9bjyRCHjdkkrPkjmYd</subfield><subfield code="0">http://id.loc.gov/authorities/names/no2008176836</subfield></datafield><datafield tag="758" ind1=" " ind2=" "><subfield code="i">has work:</subfield><subfield code="a">Advanced functional materials (Text)</subfield><subfield code="1">https://id.oclc.org/worldcat/entity/E39PCH3wFtqYhvcgw8xkYDmbFq</subfield><subfield code="4">https://id.oclc.org/worldcat/ontology/hasWork</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Print version:</subfield><subfield code="a">Chinese Materials Congress (2014 : Chengdu, China).</subfield><subfield code="t">Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China.</subfield><subfield code="d">Pfäffikon, Switzerland : Trans Tech Publications Ltd, ©2015</subfield><subfield code="h">712 pages</subfield><subfield code="k">Materials science forum ; Volume 815</subfield><subfield code="x">1662-9752</subfield><subfield code="z">9783038353942</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Materials science forum ;</subfield><subfield code="v">v. 815.</subfield><subfield code="0">http://id.loc.gov/authorities/names/no94007967</subfield></datafield><datafield tag="966" ind1="4" ind2="0"><subfield code="l">DE-862</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FWS_PDA_EBA</subfield><subfield code="u">https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=975672</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="4" ind2="0"><subfield code="l">DE-863</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FWS_PDA_EBA</subfield><subfield code="u">https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=975672</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">Trans Tech Publications, Ltd</subfield><subfield code="b">TRAN</subfield><subfield code="n">10.4028/www.scientific.net/MSF.815</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">ProQuest Ebook Central</subfield><subfield code="b">EBLB</subfield><subfield code="n">EBL2008335</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">ebrary</subfield><subfield code="b">EBRY</subfield><subfield code="n">ebr11042417</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">YBP Library Services</subfield><subfield code="b">YANK</subfield><subfield code="n">12375751</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">EBSCOhost</subfield><subfield code="b">EBSC</subfield><subfield code="n">975672</subfield></datafield><datafield tag="994" ind1=" " ind2=" "><subfield code="a">92</subfield><subfield code="b">GEBAY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-EBA</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-862</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-863</subfield></datafield></record></collection> |
genre | Conference papers and proceedings fast |
genre_facet | Conference papers and proceedings |
id | ZDB-4-EBA-ocn909898007 |
illustrated | Illustrated |
indexdate | 2025-04-11T08:42:37Z |
institution | BVB |
institution_GND | http://id.loc.gov/authorities/names/no2015060543 |
isbn | 3038267805 9783038267805 |
issn | 1662-9752 ; 1662-9752 |
language | English |
oclc_num | 909898007 |
open_access_boolean | |
owner | MAIN DE-862 DE-BY-FWS DE-863 DE-BY-FWS |
owner_facet | MAIN DE-862 DE-BY-FWS DE-863 DE-BY-FWS |
physical | 1 online resource (712 pages) : illustrations |
psigel | ZDB-4-EBA FWS_PDA_EBA ZDB-4-EBA |
publishDate | 2015 |
publishDateSearch | 2015 |
publishDateSort | 2015 |
publisher | Trans Tech Publications Ltd, |
record_format | marc |
series | Materials science forum ; |
series2 | Materials Science Forum, |
spelling | Chinese Materials Congress (2014 : Chengdu, China) http://id.loc.gov/authorities/names/no2015060543 Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China / edited by Yafang Han, Zhongwei Gu and Qiang Fu. Pfäffikon, Switzerland : Trans Tech Publications Ltd, 2015. ©2015 1 online resource (712 pages) : illustrations text txt rdacontent computer c rdamedia online resource cr rdacarrier Materials Science Forum, 1662-9752 ; Volume 815 Includes bibliographical references at the end of each chapters and indexes. Online resource; title from PDF title page (ebrary, viewed April 25, 2015). Advanced Functional Materials; Preface; Table of Contents; Symposium E: Materials in Microelectronic and Optoelectronic Industry; Process Control of Buried Layer Epitaxy by Barrel Type Furnace; Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing; Research on Surface Roughness of Acid Etched Silicon Wafers; Investigation of Chemical Vapor Deposited Graphene Film on Oxide Substrate; Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects; Property of an AlGaN/GaN MIS Diode with Si3N4/Al2O3 Bilayer Gate Dielectric Films. A New Type of Self-Aligned Technology for RF and Microwave Graphene Field-Effect TransistorsElectron Beam Annealing for Component Optimization in Si-Sb-Te Material; Structures and Electronic Properties of a Si55 Cluster on DFTB Calculations; Surface Plasmon Enhanced Photoluminescence of the Rubrene Film by Silver Nanoparticles; Development of Precious Metal and its Alloy Sputtering Targets with High Performance; Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites; Study of Black Center in Silicon Wafer for Solar Cell. Impurity Detection Method for High-Purity BCl3First-Principles Study on Electronic and Optical Properties of Kesterite and Stannite Cu2ZnSnS4 Photovoltaic Absorbers; Effect of Acetic Acid/Water Ratio on the Microstructure and Properties of LaNiO3 Thin Films by Metal Organic Solution Deposition; Symposium F: Electronic Materials; Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn-3.0Ag-0.5Cu Solder during Thermal Cycling. Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu SubstrateEffect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder; Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn; Microstructure and Dielectric Properties of (Ba, Ta) Co-Doped Sr2Nb2O7 Ceramics; Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate. Ferroelectric and Photovoltaic Properties of Mn-Doped Bismuth Ferrite Thin FilmsMagnetic Properties and Unusual Morphologies of Barium Ferrites Prepared by Electrospinning and Sol-Gel Auto-Combustion Method; Symposium G: Multiferroic Materials; Effects of Sm and Mn Co-Doping on Structural and Optical Properties of BiFeO3 Thin Films Prepared by Sol-Gel Technique; Effects of Ba and Ti Codoping on Stoichiometric and Nonstoichiometric BiFeO3 Multiferroic Ceramics; A Review on the Characteristics of the New Multiferroic Three-Ply Structure Ferroelectric-Ferromagnetic Nanocomposite. Collection of selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. The 127 papers are grouped as follows: Symposium E: Materials in Microelectronic and Optoelectronic Industry; Symposium G: Multiferroic Materials; Symposium H: Smart Materials; Symposium I: Vanadium-Titanium And Rare Earth Functional Materials; Symposium J: Biomedical Materials; Symposium K: High Performance And Functional Polymer and Composite Materials. Electronics Materials Congresses. Smart materials Research Congresses. Rare earths Research Congresses. Biomedical materials Research Congresses. Composite materials Research Congresses. Polymers Research Congresses. Électronique Matériaux Congrès. Matériaux intelligents Recherche Congrès. Terres rares Recherche Congrès. Composites Recherche Congrès. Polymères Recherche Congrès. Biomedical materials Research fast Composite materials Research fast Electronics Materials fast Polymers Research fast Smart materials Research fast Conference papers and proceedings fast Han, Yafang, editor. http://id.loc.gov/authorities/names/n90726779 Gu, Zhongwei, editor. http://id.loc.gov/authorities/names/nb2009009832 Fu, Qiang, 1963- editor. https://id.oclc.org/worldcat/entity/E39PCjKh9bjyRCHjdkkrPkjmYd http://id.loc.gov/authorities/names/no2008176836 has work: Advanced functional materials (Text) https://id.oclc.org/worldcat/entity/E39PCH3wFtqYhvcgw8xkYDmbFq https://id.oclc.org/worldcat/ontology/hasWork Print version: Chinese Materials Congress (2014 : Chengdu, China). Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. Pfäffikon, Switzerland : Trans Tech Publications Ltd, ©2015 712 pages Materials science forum ; Volume 815 1662-9752 9783038353942 Materials science forum ; v. 815. http://id.loc.gov/authorities/names/no94007967 |
spellingShingle | Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China / Materials science forum ; Advanced Functional Materials; Preface; Table of Contents; Symposium E: Materials in Microelectronic and Optoelectronic Industry; Process Control of Buried Layer Epitaxy by Barrel Type Furnace; Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing; Research on Surface Roughness of Acid Etched Silicon Wafers; Investigation of Chemical Vapor Deposited Graphene Film on Oxide Substrate; Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects; Property of an AlGaN/GaN MIS Diode with Si3N4/Al2O3 Bilayer Gate Dielectric Films. A New Type of Self-Aligned Technology for RF and Microwave Graphene Field-Effect TransistorsElectron Beam Annealing for Component Optimization in Si-Sb-Te Material; Structures and Electronic Properties of a Si55 Cluster on DFTB Calculations; Surface Plasmon Enhanced Photoluminescence of the Rubrene Film by Silver Nanoparticles; Development of Precious Metal and its Alloy Sputtering Targets with High Performance; Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites; Study of Black Center in Silicon Wafer for Solar Cell. Impurity Detection Method for High-Purity BCl3First-Principles Study on Electronic and Optical Properties of Kesterite and Stannite Cu2ZnSnS4 Photovoltaic Absorbers; Effect of Acetic Acid/Water Ratio on the Microstructure and Properties of LaNiO3 Thin Films by Metal Organic Solution Deposition; Symposium F: Electronic Materials; Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn-3.0Ag-0.5Cu Solder during Thermal Cycling. Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu SubstrateEffect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder; Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn; Microstructure and Dielectric Properties of (Ba, Ta) Co-Doped Sr2Nb2O7 Ceramics; Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate. Ferroelectric and Photovoltaic Properties of Mn-Doped Bismuth Ferrite Thin FilmsMagnetic Properties and Unusual Morphologies of Barium Ferrites Prepared by Electrospinning and Sol-Gel Auto-Combustion Method; Symposium G: Multiferroic Materials; Effects of Sm and Mn Co-Doping on Structural and Optical Properties of BiFeO3 Thin Films Prepared by Sol-Gel Technique; Effects of Ba and Ti Codoping on Stoichiometric and Nonstoichiometric BiFeO3 Multiferroic Ceramics; A Review on the Characteristics of the New Multiferroic Three-Ply Structure Ferroelectric-Ferromagnetic Nanocomposite. Electronics Materials Congresses. Smart materials Research Congresses. Rare earths Research Congresses. Biomedical materials Research Congresses. Composite materials Research Congresses. Polymers Research Congresses. Électronique Matériaux Congrès. Matériaux intelligents Recherche Congrès. Terres rares Recherche Congrès. Composites Recherche Congrès. Polymères Recherche Congrès. Biomedical materials Research fast Composite materials Research fast Electronics Materials fast Polymers Research fast Smart materials Research fast |
title | Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China / |
title_auth | Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China / |
title_exact_search | Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China / |
title_full | Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China / edited by Yafang Han, Zhongwei Gu and Qiang Fu. |
title_fullStr | Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China / edited by Yafang Han, Zhongwei Gu and Qiang Fu. |
title_full_unstemmed | Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China / edited by Yafang Han, Zhongwei Gu and Qiang Fu. |
title_short | Advanced functional materials : |
title_sort | advanced functional materials selected peer reviewed papers from the chinese materials congress 2014 cmc 2014 july 4 7 2014 chengdu china |
title_sub | selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China / |
topic | Electronics Materials Congresses. Smart materials Research Congresses. Rare earths Research Congresses. Biomedical materials Research Congresses. Composite materials Research Congresses. Polymers Research Congresses. Électronique Matériaux Congrès. Matériaux intelligents Recherche Congrès. Terres rares Recherche Congrès. Composites Recherche Congrès. Polymères Recherche Congrès. Biomedical materials Research fast Composite materials Research fast Electronics Materials fast Polymers Research fast Smart materials Research fast |
topic_facet | Electronics Materials Congresses. Smart materials Research Congresses. Rare earths Research Congresses. Biomedical materials Research Congresses. Composite materials Research Congresses. Polymers Research Congresses. Électronique Matériaux Congrès. Matériaux intelligents Recherche Congrès. Terres rares Recherche Congrès. Composites Recherche Congrès. Polymères Recherche Congrès. Biomedical materials Research Composite materials Research Electronics Materials Polymers Research Smart materials Research Conference papers and proceedings |
work_keys_str_mv | AT chinesematerialscongresschengduchina advancedfunctionalmaterialsselectedpeerreviewedpapersfromthechinesematerialscongress2014cmc2014july472014chengduchina AT hanyafang advancedfunctionalmaterialsselectedpeerreviewedpapersfromthechinesematerialscongress2014cmc2014july472014chengduchina AT guzhongwei advancedfunctionalmaterialsselectedpeerreviewedpapersfromthechinesematerialscongress2014cmc2014july472014chengduchina AT fuqiang advancedfunctionalmaterialsselectedpeerreviewedpapersfromthechinesematerialscongress2014cmc2014july472014chengduchina |