ISTFA 2008 :: conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA /
Gespeichert in:
| Körperschaften: | , , |
|---|---|
| Format: | Elektronisch Tagungsbericht E-Book |
| Sprache: | English |
| Veröffentlicht: |
Materials Park, Ohio :
ASM International,
2008.
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | Some online versions lack accompanying media packaged with the printed version. |
| Beschreibung: | 1 online resource (xx, 528 pages) : illustrations |
| Bibliographie: | Includes bibliographical references and index. |
| ISBN: | 9781615030910 1615030913 |
Internformat
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| 111 | 2 | |a International Symposium for Testing and Failure Analysis |n (34th : |d 2008 : |c Portland, Or.) | |
| 245 | 1 | 0 | |a ISTFA 2008 : |b conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / |c sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International. |
| 246 | 3 | |a International Symposium for Testing and Failure Analysis 2008 | |
| 246 | 3 | 0 | |a Proceedings of the 34th International Symposium for Testing and Failure Analysis |
| 246 | 3 | 0 | |a 34th International Symposium for Testing and Failure Analysis |
| 246 | 3 | |a Thirty-fourth International Symposium for Testing and Failure Analysis | |
| 260 | |a Materials Park, Ohio : |b ASM International, |c 2008. | ||
| 300 | |a 1 online resource (xx, 528 pages) : |b illustrations | ||
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| 504 | |a Includes bibliographical references and index. | ||
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| 505 | 0 | |a Contents -- IPFA 07 Best Paper -- Session 1: Emerging Concepts -- Session 2: Packaging and Assembly Level FA I -- Session 3: Failure Analysis Process I -- Session 4: Package and Assembly Level FA II -- Session 5: Circuit-Edit -- Session 6: Sample Preparation I -- Session 7: Photon Based Techniques I -- Session 8: Scanned Probe Microscopy -- Session 9: Photon Based Techniques II -- Session 10: Posters -- Session 11: System Level Failure Analysis -- Session 12: Sample Preparation II -- Session 13: Test -- Session 14: Photon Based Techniques III | |
| 505 | 8 | |a Session 15: NanoprobingSession 16: Yield Enhancement -- Session 17: Failure Analysis Process II -- Session 18: Metrology -- Author Index | |
| 650 | 0 | |a Electronics |x Materials |x Testing |v Congresses. | |
| 650 | 0 | |a Electronic apparatus and appliances |x Testing |v Congresses. | |
| 650 | 6 | |a Appareils électroniques |x Essais |v Congrès. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Digital. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Microelectronics. |2 bisacsh | |
| 650 | 7 | |a Electronic apparatus and appliances |x Testing |2 fast | |
| 650 | 7 | |a Electronics |x Materials |x Testing |2 fast | |
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| 710 | 2 | |a Electronic Device Failure Analysis Society. |0 http://id.loc.gov/authorities/names/no99092286 | |
| 776 | 0 | 8 | |i Print version: |a International Symposium for Testing and Failure Analysis (34th : 2008 : Portland, Oregon.). |t ISTFA 2008. |d Materials Park, Ohio : ASM International, 2008 |z 9781615030910 |w (OCoLC)317955622 |
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| author_corporate | International Symposium for Testing and Failure Analysis Portland, Or. ASM International Electronic Device Failure Analysis Society |
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| contents | Contents -- IPFA 07 Best Paper -- Session 1: Emerging Concepts -- Session 2: Packaging and Assembly Level FA I -- Session 3: Failure Analysis Process I -- Session 4: Package and Assembly Level FA II -- Session 5: Circuit-Edit -- Session 6: Sample Preparation I -- Session 7: Photon Based Techniques I -- Session 8: Scanned Probe Microscopy -- Session 9: Photon Based Techniques II -- Session 10: Posters -- Session 11: System Level Failure Analysis -- Session 12: Sample Preparation II -- Session 13: Test -- Session 14: Photon Based Techniques III Session 15: NanoprobingSession 16: Yield Enhancement -- Session 17: Failure Analysis Process II -- Session 18: Metrology -- Author Index |
| ctrlnum | (OCoLC)854633376 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic Conference Proceeding eBook |
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| genre | Conference papers and proceedings fast |
| genre_facet | Conference papers and proceedings |
| id | ZDB-4-EBA-ocn854633376 |
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| indexdate | 2024-10-25T16:21:32Z |
| institution | BVB |
| institution_GND | http://id.loc.gov/authorities/names/n86066562 http://id.loc.gov/authorities/names/no99092286 |
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| spelling | International Symposium for Testing and Failure Analysis (34th : 2008 : Portland, Or.) ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International. International Symposium for Testing and Failure Analysis 2008 Proceedings of the 34th International Symposium for Testing and Failure Analysis 34th International Symposium for Testing and Failure Analysis Thirty-fourth International Symposium for Testing and Failure Analysis Materials Park, Ohio : ASM International, 2008. 1 online resource (xx, 528 pages) : illustrations text txt rdacontent computer c rdamedia online resource cr rdacarrier Some online versions lack accompanying media packaged with the printed version. Includes bibliographical references and index. Print version record. Contents -- IPFA 07 Best Paper -- Session 1: Emerging Concepts -- Session 2: Packaging and Assembly Level FA I -- Session 3: Failure Analysis Process I -- Session 4: Package and Assembly Level FA II -- Session 5: Circuit-Edit -- Session 6: Sample Preparation I -- Session 7: Photon Based Techniques I -- Session 8: Scanned Probe Microscopy -- Session 9: Photon Based Techniques II -- Session 10: Posters -- Session 11: System Level Failure Analysis -- Session 12: Sample Preparation II -- Session 13: Test -- Session 14: Photon Based Techniques III Session 15: NanoprobingSession 16: Yield Enhancement -- Session 17: Failure Analysis Process II -- Session 18: Metrology -- Author Index Electronics Materials Testing Congresses. Electronic apparatus and appliances Testing Congresses. Appareils électroniques Essais Congrès. TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh Electronic apparatus and appliances Testing fast Electronics Materials Testing fast Conference papers and proceedings fast ASM International. http://id.loc.gov/authorities/names/n86066562 Electronic Device Failure Analysis Society. http://id.loc.gov/authorities/names/no99092286 Print version: International Symposium for Testing and Failure Analysis (34th : 2008 : Portland, Oregon.). ISTFA 2008. Materials Park, Ohio : ASM International, 2008 9781615030910 (OCoLC)317955622 FWS01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395835 Volltext CBO01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395835 Volltext |
| spellingShingle | ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / Contents -- IPFA 07 Best Paper -- Session 1: Emerging Concepts -- Session 2: Packaging and Assembly Level FA I -- Session 3: Failure Analysis Process I -- Session 4: Package and Assembly Level FA II -- Session 5: Circuit-Edit -- Session 6: Sample Preparation I -- Session 7: Photon Based Techniques I -- Session 8: Scanned Probe Microscopy -- Session 9: Photon Based Techniques II -- Session 10: Posters -- Session 11: System Level Failure Analysis -- Session 12: Sample Preparation II -- Session 13: Test -- Session 14: Photon Based Techniques III Session 15: NanoprobingSession 16: Yield Enhancement -- Session 17: Failure Analysis Process II -- Session 18: Metrology -- Author Index Electronics Materials Testing Congresses. Electronic apparatus and appliances Testing Congresses. Appareils électroniques Essais Congrès. TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh Electronic apparatus and appliances Testing fast Electronics Materials Testing fast |
| title | ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / |
| title_alt | International Symposium for Testing and Failure Analysis 2008 Proceedings of the 34th International Symposium for Testing and Failure Analysis 34th International Symposium for Testing and Failure Analysis Thirty-fourth International Symposium for Testing and Failure Analysis |
| title_auth | ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / |
| title_exact_search | ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / |
| title_full | ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International. |
| title_fullStr | ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International. |
| title_full_unstemmed | ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International. |
| title_short | ISTFA 2008 : |
| title_sort | istfa 2008 conference proceedings of the 34th international symposium for testing and failure analysis november 2 6 2008 oregon convention center portland oregon usa |
| title_sub | conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA / |
| topic | Electronics Materials Testing Congresses. Electronic apparatus and appliances Testing Congresses. Appareils électroniques Essais Congrès. TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh Electronic apparatus and appliances Testing fast Electronics Materials Testing fast |
| topic_facet | Electronics Materials Testing Congresses. Electronic apparatus and appliances Testing Congresses. Appareils électroniques Essais Congrès. TECHNOLOGY & ENGINEERING Electronics Digital. TECHNOLOGY & ENGINEERING Electronics Microelectronics. Electronic apparatus and appliances Testing Electronics Materials Testing Conference papers and proceedings |
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