Encyclopedia of thermal packaging.: Set 1, Thermal packaging techniques /
Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electro...
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Singapore :
World Scientific,
©2013.
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| Schlagworte: | |
| Online-Zugang: | Volltext |
| Zusammenfassung: | Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic prod. |
| Beschreibung: | 1 online resource |
| Bibliographie: | Includes bibliographical references and indexes. |
| ISBN: | 9789814313797 9814313793 9781283971713 1283971712 |
Internformat
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| 245 | 0 | 0 | |a Encyclopedia of thermal packaging. |n Set 1, |p Thermal packaging techniques / |c edited-in-chief, Avram Bar-Cohen. |
| 260 | |a Singapore : |b World Scientific, |c ©2013. | ||
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| 504 | |a Includes bibliographical references and indexes. | ||
| 505 | 0 | 0 | |g Vol. 1. |t Microchannel heat sinks for electronics cooling / |r Suresh V. Garimella, Tannaz Harirchian -- |g v. 2. |t Air- and liquid-cooled cold plates / |r Allan Kraus -- |g v. 3. |t Dielectric liquid cooling of immersed components / |r Karl J.L. Geisler. Avram Bar-Cohen -- |g v. 4. |t Thermoelectric microcoolers / |r Bao Yang, Peng Wang -- |g v. 5. |t Energy efficienct solid state lighting / |r Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang -- |g v. 6. |t Experimental thermofluid characterization of electronic components / |r Gary L. Solbrekken. |
| 505 | 0 | |a Foreword to the Encyclopedia of Thermal Packaging by Wataru Nakayama; Preface; Contents; Chapter 1 Introduction; 1.1. Physics and Applications of Microchannels; 1.2. Use of Microchannels in Electronics Cooling; References; Chapter 2 Design and Optimization of Single-Phase Microchannel Heat Sinks; 2.1. Prediction of Heat Transfer Coefficient; 2.1.1. Experiments and comparison to correlations; 2.1.2. Numerical analyses; 2.1.3. Correlations; 2.2. Prediction of Pressure Drop; 2.3. Optimization of Heat Transfer Performance; 2.4. Importance of Inlet Manifold Design; 2.5. Hot-Spot Thermal Management. | |
| 505 | 8 | |a 2.6. System-Level Design and OptimizationReferences; Chapter 3 Two-Phase Operation of Microchannel Heat Sinks; 3.1. Fundamentals of Two-Phase Transport in Microchannels; 3.2. Macroscale versus Microscale Boiling; 3.3. Flow Regime Maps; References; Chapter 4 Boiling Heat Transfer at Small Scales; 4.1. Saturated Boiling in Microchannels; 4.2. Heat Transfer in Boiling and Two-Phase Flow; 4.3. Effect of Geometrical and Flow Parameters; 4.3.1. Effect of channel dimensions; 4.3.2. Effect of mass flow rate; 4.3.3. Effect of surface roughness; 4.4. Empirical Predictions of Thermal Performance. | |
| 505 | 8 | |a 4.4.1. Subcooled boiling regime4.4.2. Saturated boiling regime; 4.4.3. Saturated flow boiling correlation; 4.5. Physics-Based Modeling of Boiling Heat Transfer; 4.5.1. Annular flow; 4.5.1.1. Solution procedure; 4.5.1.2. Model assessment; 4.5.2. Annular/Wispy-annular flow; 4.5.3. Slug flow; References; Chapter 5 Pressure Drop in Two-Phase Flow; 5.1. Two-Phase Flow Pressure Drop; 5.2. Empirical Prediction of Two-Phase Pressure Drop; 5.3. Regime-Based Modeling of Two-Phase Pressure Drop; 5.3.1. Confined flow; 5.3.2. Unconfined flow; 5.3.3. Model assessment; References. | |
| 505 | 8 | |a Chapter 6 Micropumps and Pumping Requirements6.1. Microscale Pumping Technologies; 6.2. Mechanical Displacement Micropumping Techniques; 6.2.1. Diaphragm displacement pumps; 6.2.2. Fluid displacement pumps; 6.2.3. Rotary pumps; 6.3. Electro- and Magneto-Kinetic Micropumping Techniques; 6.3.1. Electrohydrodynamic pumps; 6.3.1.1. Induction-type EHD; 6.3.1.2. Injection-type EHD; 6.3.1.3. Polarization-type EHD; 6.3.1.4. Ion-drag; 6.3.2. Electroosmotic pumps; 6.3.2.1. DC electroosmotic; 6.3.2.2. AC electroosmotic; 6.3.3. Magnetohydrodynamic pumps; 6.3.4. Electrowetting pumps; 6.3.5. Other. | |
| 505 | 8 | |a 6.4. Pump Selection6.4.1. Materials and construction; 6.4.2. Selection guidelines; References; Chapter 7 Challenges in Implementation; 7.1. Effect of Dissolved Air on System Performance; 7.1.1. Degassing scheme; 7.2. System Instabilities for Boiling in Microchannels; 7.3. Critical Heat Flux; References; Chapter 8 Measurement Techniques; 8.1. Conventional Techniques; 8.2. Microscale Temperature Measurement; 8.3. Optical Flow Measurements; 8.4. Micro-PIV and IR Micro-PIV; 8.5. Laser-Induced Fluorescence Thermometry; References; Author Index; Subject Index; About the Authors. | |
| 520 | |a Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic prod. | ||
| 650 | 0 | |a Electronic packaging. |0 http://id.loc.gov/authorities/subjects/sh85042366 | |
| 650 | 0 | |a Insulation (Heat) |0 http://id.loc.gov/authorities/subjects/sh85066793 | |
| 650 | 6 | |a Mise sous boîtier (Électronique) | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Digital. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Microelectronics. |2 bisacsh | |
| 650 | 7 | |a Electronic packaging |2 fast | |
| 650 | 7 | |a Insulation (Heat) |2 fast | |
| 700 | 1 | |a Bar-Cohen, Avram, |d 1946- |1 https://id.oclc.org/worldcat/entity/E39PCjJQdpfMQhc6VwQ3DdHpyd |0 http://id.loc.gov/authorities/names/n82130716 | |
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| author_GND | http://id.loc.gov/authorities/names/n82130716 |
| author_additional | Suresh V. Garimella, Tannaz Harirchian -- Allan Kraus -- Karl J.L. Geisler. Avram Bar-Cohen -- Bao Yang, Peng Wang -- Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang -- Gary L. Solbrekken. |
| author_facet | Bar-Cohen, Avram, 1946- |
| author_sort | Bar-Cohen, Avram, 1946- |
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| collection | ZDB-4-EBA |
| contents | Foreword to the Encyclopedia of Thermal Packaging by Wataru Nakayama; Preface; Contents; Chapter 1 Introduction; 1.1. Physics and Applications of Microchannels; 1.2. Use of Microchannels in Electronics Cooling; References; Chapter 2 Design and Optimization of Single-Phase Microchannel Heat Sinks; 2.1. Prediction of Heat Transfer Coefficient; 2.1.1. Experiments and comparison to correlations; 2.1.2. Numerical analyses; 2.1.3. Correlations; 2.2. Prediction of Pressure Drop; 2.3. Optimization of Heat Transfer Performance; 2.4. Importance of Inlet Manifold Design; 2.5. Hot-Spot Thermal Management. 2.6. System-Level Design and OptimizationReferences; Chapter 3 Two-Phase Operation of Microchannel Heat Sinks; 3.1. Fundamentals of Two-Phase Transport in Microchannels; 3.2. Macroscale versus Microscale Boiling; 3.3. Flow Regime Maps; References; Chapter 4 Boiling Heat Transfer at Small Scales; 4.1. Saturated Boiling in Microchannels; 4.2. Heat Transfer in Boiling and Two-Phase Flow; 4.3. Effect of Geometrical and Flow Parameters; 4.3.1. Effect of channel dimensions; 4.3.2. Effect of mass flow rate; 4.3.3. Effect of surface roughness; 4.4. Empirical Predictions of Thermal Performance. 4.4.1. Subcooled boiling regime4.4.2. Saturated boiling regime; 4.4.3. Saturated flow boiling correlation; 4.5. Physics-Based Modeling of Boiling Heat Transfer; 4.5.1. Annular flow; 4.5.1.1. Solution procedure; 4.5.1.2. Model assessment; 4.5.2. Annular/Wispy-annular flow; 4.5.3. Slug flow; References; Chapter 5 Pressure Drop in Two-Phase Flow; 5.1. Two-Phase Flow Pressure Drop; 5.2. Empirical Prediction of Two-Phase Pressure Drop; 5.3. Regime-Based Modeling of Two-Phase Pressure Drop; 5.3.1. Confined flow; 5.3.2. Unconfined flow; 5.3.3. Model assessment; References. Chapter 6 Micropumps and Pumping Requirements6.1. Microscale Pumping Technologies; 6.2. Mechanical Displacement Micropumping Techniques; 6.2.1. Diaphragm displacement pumps; 6.2.2. Fluid displacement pumps; 6.2.3. Rotary pumps; 6.3. Electro- and Magneto-Kinetic Micropumping Techniques; 6.3.1. Electrohydrodynamic pumps; 6.3.1.1. Induction-type EHD; 6.3.1.2. Injection-type EHD; 6.3.1.3. Polarization-type EHD; 6.3.1.4. Ion-drag; 6.3.2. Electroosmotic pumps; 6.3.2.1. DC electroosmotic; 6.3.2.2. AC electroosmotic; 6.3.3. Magnetohydrodynamic pumps; 6.3.4. Electrowetting pumps; 6.3.5. Other. 6.4. Pump Selection6.4.1. Materials and construction; 6.4.2. Selection guidelines; References; Chapter 7 Challenges in Implementation; 7.1. Effect of Dissolved Air on System Performance; 7.1.1. Degassing scheme; 7.2. System Instabilities for Boiling in Microchannels; 7.3. Critical Heat Flux; References; Chapter 8 Measurement Techniques; 8.1. Conventional Techniques; 8.2. Microscale Temperature Measurement; 8.3. Optical Flow Measurements; 8.4. Micro-PIV and IR Micro-PIV; 8.5. Laser-Induced Fluorescence Thermometry; References; Author Index; Subject Index; About the Authors. Microchannel heat sinks for electronics cooling / Air- and liquid-cooled cold plates / Dielectric liquid cooling of immersed components / Thermoelectric microcoolers / Energy efficienct solid state lighting / Experimental thermofluid characterization of electronic components / |
| ctrlnum | (OCoLC)824516333 |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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Garimella, Tannaz Harirchian --</subfield><subfield code="g">v. 2.</subfield><subfield code="t">Air- and liquid-cooled cold plates /</subfield><subfield code="r">Allan Kraus --</subfield><subfield code="g">v. 3.</subfield><subfield code="t">Dielectric liquid cooling of immersed components /</subfield><subfield code="r">Karl J.L. Geisler. Avram Bar-Cohen --</subfield><subfield code="g">v. 4.</subfield><subfield code="t">Thermoelectric microcoolers /</subfield><subfield code="r">Bao Yang, Peng Wang --</subfield><subfield code="g">v. 5.</subfield><subfield code="t">Energy efficienct solid state lighting /</subfield><subfield code="r">Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang --</subfield><subfield code="g">v. 6.</subfield><subfield code="t">Experimental thermofluid characterization of electronic components /</subfield><subfield code="r">Gary L. Solbrekken.</subfield></datafield><datafield tag="505" ind1="0" ind2=" "><subfield code="a">Foreword to the Encyclopedia of Thermal Packaging by Wataru Nakayama; Preface; Contents; Chapter 1 Introduction; 1.1. Physics and Applications of Microchannels; 1.2. Use of Microchannels in Electronics Cooling; References; Chapter 2 Design and Optimization of Single-Phase Microchannel Heat Sinks; 2.1. Prediction of Heat Transfer Coefficient; 2.1.1. Experiments and comparison to correlations; 2.1.2. Numerical analyses; 2.1.3. Correlations; 2.2. Prediction of Pressure Drop; 2.3. Optimization of Heat Transfer Performance; 2.4. Importance of Inlet Manifold Design; 2.5. Hot-Spot Thermal Management.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">2.6. System-Level Design and OptimizationReferences; Chapter 3 Two-Phase Operation of Microchannel Heat Sinks; 3.1. Fundamentals of Two-Phase Transport in Microchannels; 3.2. Macroscale versus Microscale Boiling; 3.3. Flow Regime Maps; References; Chapter 4 Boiling Heat Transfer at Small Scales; 4.1. Saturated Boiling in Microchannels; 4.2. Heat Transfer in Boiling and Two-Phase Flow; 4.3. Effect of Geometrical and Flow Parameters; 4.3.1. Effect of channel dimensions; 4.3.2. Effect of mass flow rate; 4.3.3. Effect of surface roughness; 4.4. Empirical Predictions of Thermal Performance.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">4.4.1. Subcooled boiling regime4.4.2. Saturated boiling regime; 4.4.3. Saturated flow boiling correlation; 4.5. Physics-Based Modeling of Boiling Heat Transfer; 4.5.1. Annular flow; 4.5.1.1. Solution procedure; 4.5.1.2. Model assessment; 4.5.2. Annular/Wispy-annular flow; 4.5.3. Slug flow; References; Chapter 5 Pressure Drop in Two-Phase Flow; 5.1. Two-Phase Flow Pressure Drop; 5.2. Empirical Prediction of Two-Phase Pressure Drop; 5.3. Regime-Based Modeling of Two-Phase Pressure Drop; 5.3.1. Confined flow; 5.3.2. Unconfined flow; 5.3.3. Model assessment; References.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Chapter 6 Micropumps and Pumping Requirements6.1. Microscale Pumping Technologies; 6.2. Mechanical Displacement Micropumping Techniques; 6.2.1. Diaphragm displacement pumps; 6.2.2. Fluid displacement pumps; 6.2.3. Rotary pumps; 6.3. Electro- and Magneto-Kinetic Micropumping Techniques; 6.3.1. Electrohydrodynamic pumps; 6.3.1.1. Induction-type EHD; 6.3.1.2. Injection-type EHD; 6.3.1.3. Polarization-type EHD; 6.3.1.4. Ion-drag; 6.3.2. Electroosmotic pumps; 6.3.2.1. DC electroosmotic; 6.3.2.2. AC electroosmotic; 6.3.3. Magnetohydrodynamic pumps; 6.3.4. Electrowetting pumps; 6.3.5. Other.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">6.4. Pump Selection6.4.1. Materials and construction; 6.4.2. Selection guidelines; References; Chapter 7 Challenges in Implementation; 7.1. Effect of Dissolved Air on System Performance; 7.1.1. Degassing scheme; 7.2. System Instabilities for Boiling in Microchannels; 7.3. Critical Heat Flux; References; Chapter 8 Measurement Techniques; 8.1. Conventional Techniques; 8.2. Microscale Temperature Measurement; 8.3. Optical Flow Measurements; 8.4. Micro-PIV and IR Micro-PIV; 8.5. Laser-Induced Fluorescence Thermometry; References; Author Index; Subject Index; About the Authors.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. 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| id | ZDB-4-EBA-ocn824516333 |
| illustrated | Illustrated |
| indexdate | 2024-11-27T13:25:08Z |
| institution | BVB |
| isbn | 9789814313797 9814313793 9781283971713 1283971712 |
| language | English |
| oclc_num | 824516333 |
| open_access_boolean | |
| owner | MAIN DE-863 DE-BY-FWS |
| owner_facet | MAIN DE-863 DE-BY-FWS |
| physical | 1 online resource |
| psigel | ZDB-4-EBA |
| publishDate | 2013 |
| publishDateSearch | 2013 |
| publishDateSort | 2013 |
| publisher | World Scientific, |
| record_format | marc |
| spelling | Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques / edited-in-chief, Avram Bar-Cohen. Singapore : World Scientific, ©2013. 1 online resource text txt rdacontent computer c rdamedia online resource cr rdacarrier Includes bibliographical references and indexes. Vol. 1. Microchannel heat sinks for electronics cooling / Suresh V. Garimella, Tannaz Harirchian -- v. 2. Air- and liquid-cooled cold plates / Allan Kraus -- v. 3. Dielectric liquid cooling of immersed components / Karl J.L. Geisler. Avram Bar-Cohen -- v. 4. Thermoelectric microcoolers / Bao Yang, Peng Wang -- v. 5. Energy efficienct solid state lighting / Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang -- v. 6. Experimental thermofluid characterization of electronic components / Gary L. Solbrekken. Foreword to the Encyclopedia of Thermal Packaging by Wataru Nakayama; Preface; Contents; Chapter 1 Introduction; 1.1. Physics and Applications of Microchannels; 1.2. Use of Microchannels in Electronics Cooling; References; Chapter 2 Design and Optimization of Single-Phase Microchannel Heat Sinks; 2.1. Prediction of Heat Transfer Coefficient; 2.1.1. Experiments and comparison to correlations; 2.1.2. Numerical analyses; 2.1.3. Correlations; 2.2. Prediction of Pressure Drop; 2.3. Optimization of Heat Transfer Performance; 2.4. Importance of Inlet Manifold Design; 2.5. Hot-Spot Thermal Management. 2.6. System-Level Design and OptimizationReferences; Chapter 3 Two-Phase Operation of Microchannel Heat Sinks; 3.1. Fundamentals of Two-Phase Transport in Microchannels; 3.2. Macroscale versus Microscale Boiling; 3.3. Flow Regime Maps; References; Chapter 4 Boiling Heat Transfer at Small Scales; 4.1. Saturated Boiling in Microchannels; 4.2. Heat Transfer in Boiling and Two-Phase Flow; 4.3. Effect of Geometrical and Flow Parameters; 4.3.1. Effect of channel dimensions; 4.3.2. Effect of mass flow rate; 4.3.3. Effect of surface roughness; 4.4. Empirical Predictions of Thermal Performance. 4.4.1. Subcooled boiling regime4.4.2. Saturated boiling regime; 4.4.3. Saturated flow boiling correlation; 4.5. Physics-Based Modeling of Boiling Heat Transfer; 4.5.1. Annular flow; 4.5.1.1. Solution procedure; 4.5.1.2. Model assessment; 4.5.2. Annular/Wispy-annular flow; 4.5.3. Slug flow; References; Chapter 5 Pressure Drop in Two-Phase Flow; 5.1. Two-Phase Flow Pressure Drop; 5.2. Empirical Prediction of Two-Phase Pressure Drop; 5.3. Regime-Based Modeling of Two-Phase Pressure Drop; 5.3.1. Confined flow; 5.3.2. Unconfined flow; 5.3.3. Model assessment; References. Chapter 6 Micropumps and Pumping Requirements6.1. Microscale Pumping Technologies; 6.2. Mechanical Displacement Micropumping Techniques; 6.2.1. Diaphragm displacement pumps; 6.2.2. Fluid displacement pumps; 6.2.3. Rotary pumps; 6.3. Electro- and Magneto-Kinetic Micropumping Techniques; 6.3.1. Electrohydrodynamic pumps; 6.3.1.1. Induction-type EHD; 6.3.1.2. Injection-type EHD; 6.3.1.3. Polarization-type EHD; 6.3.1.4. Ion-drag; 6.3.2. Electroosmotic pumps; 6.3.2.1. DC electroosmotic; 6.3.2.2. AC electroosmotic; 6.3.3. Magnetohydrodynamic pumps; 6.3.4. Electrowetting pumps; 6.3.5. Other. 6.4. Pump Selection6.4.1. Materials and construction; 6.4.2. Selection guidelines; References; Chapter 7 Challenges in Implementation; 7.1. Effect of Dissolved Air on System Performance; 7.1.1. Degassing scheme; 7.2. System Instabilities for Boiling in Microchannels; 7.3. Critical Heat Flux; References; Chapter 8 Measurement Techniques; 8.1. Conventional Techniques; 8.2. Microscale Temperature Measurement; 8.3. Optical Flow Measurements; 8.4. Micro-PIV and IR Micro-PIV; 8.5. Laser-Induced Fluorescence Thermometry; References; Author Index; Subject Index; About the Authors. Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic prod. Electronic packaging. http://id.loc.gov/authorities/subjects/sh85042366 Insulation (Heat) http://id.loc.gov/authorities/subjects/sh85066793 Mise sous boîtier (Électronique) TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh Electronic packaging fast Insulation (Heat) fast Bar-Cohen, Avram, 1946- https://id.oclc.org/worldcat/entity/E39PCjJQdpfMQhc6VwQ3DdHpyd http://id.loc.gov/authorities/names/n82130716 Print version: Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques. Singapore : World Scientific, ©2013 9789814313780 FWS01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=525627 Volltext |
| spellingShingle | Encyclopedia of thermal packaging. Foreword to the Encyclopedia of Thermal Packaging by Wataru Nakayama; Preface; Contents; Chapter 1 Introduction; 1.1. Physics and Applications of Microchannels; 1.2. Use of Microchannels in Electronics Cooling; References; Chapter 2 Design and Optimization of Single-Phase Microchannel Heat Sinks; 2.1. Prediction of Heat Transfer Coefficient; 2.1.1. Experiments and comparison to correlations; 2.1.2. Numerical analyses; 2.1.3. Correlations; 2.2. Prediction of Pressure Drop; 2.3. Optimization of Heat Transfer Performance; 2.4. Importance of Inlet Manifold Design; 2.5. Hot-Spot Thermal Management. 2.6. System-Level Design and OptimizationReferences; Chapter 3 Two-Phase Operation of Microchannel Heat Sinks; 3.1. Fundamentals of Two-Phase Transport in Microchannels; 3.2. Macroscale versus Microscale Boiling; 3.3. Flow Regime Maps; References; Chapter 4 Boiling Heat Transfer at Small Scales; 4.1. Saturated Boiling in Microchannels; 4.2. Heat Transfer in Boiling and Two-Phase Flow; 4.3. Effect of Geometrical and Flow Parameters; 4.3.1. Effect of channel dimensions; 4.3.2. Effect of mass flow rate; 4.3.3. Effect of surface roughness; 4.4. Empirical Predictions of Thermal Performance. 4.4.1. Subcooled boiling regime4.4.2. Saturated boiling regime; 4.4.3. Saturated flow boiling correlation; 4.5. Physics-Based Modeling of Boiling Heat Transfer; 4.5.1. Annular flow; 4.5.1.1. Solution procedure; 4.5.1.2. Model assessment; 4.5.2. Annular/Wispy-annular flow; 4.5.3. Slug flow; References; Chapter 5 Pressure Drop in Two-Phase Flow; 5.1. Two-Phase Flow Pressure Drop; 5.2. Empirical Prediction of Two-Phase Pressure Drop; 5.3. Regime-Based Modeling of Two-Phase Pressure Drop; 5.3.1. Confined flow; 5.3.2. Unconfined flow; 5.3.3. Model assessment; References. Chapter 6 Micropumps and Pumping Requirements6.1. Microscale Pumping Technologies; 6.2. Mechanical Displacement Micropumping Techniques; 6.2.1. Diaphragm displacement pumps; 6.2.2. Fluid displacement pumps; 6.2.3. Rotary pumps; 6.3. Electro- and Magneto-Kinetic Micropumping Techniques; 6.3.1. Electrohydrodynamic pumps; 6.3.1.1. Induction-type EHD; 6.3.1.2. Injection-type EHD; 6.3.1.3. Polarization-type EHD; 6.3.1.4. Ion-drag; 6.3.2. Electroosmotic pumps; 6.3.2.1. DC electroosmotic; 6.3.2.2. AC electroosmotic; 6.3.3. Magnetohydrodynamic pumps; 6.3.4. Electrowetting pumps; 6.3.5. Other. 6.4. Pump Selection6.4.1. Materials and construction; 6.4.2. Selection guidelines; References; Chapter 7 Challenges in Implementation; 7.1. Effect of Dissolved Air on System Performance; 7.1.1. Degassing scheme; 7.2. System Instabilities for Boiling in Microchannels; 7.3. Critical Heat Flux; References; Chapter 8 Measurement Techniques; 8.1. Conventional Techniques; 8.2. Microscale Temperature Measurement; 8.3. Optical Flow Measurements; 8.4. Micro-PIV and IR Micro-PIV; 8.5. Laser-Induced Fluorescence Thermometry; References; Author Index; Subject Index; About the Authors. Microchannel heat sinks for electronics cooling / Air- and liquid-cooled cold plates / Dielectric liquid cooling of immersed components / Thermoelectric microcoolers / Energy efficienct solid state lighting / Experimental thermofluid characterization of electronic components / Electronic packaging. http://id.loc.gov/authorities/subjects/sh85042366 Insulation (Heat) http://id.loc.gov/authorities/subjects/sh85066793 Mise sous boîtier (Électronique) TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh Electronic packaging fast Insulation (Heat) fast |
| subject_GND | http://id.loc.gov/authorities/subjects/sh85042366 http://id.loc.gov/authorities/subjects/sh85066793 |
| title | Encyclopedia of thermal packaging. |
| title_alt | Microchannel heat sinks for electronics cooling / Air- and liquid-cooled cold plates / Dielectric liquid cooling of immersed components / Thermoelectric microcoolers / Energy efficienct solid state lighting / Experimental thermofluid characterization of electronic components / |
| title_auth | Encyclopedia of thermal packaging. |
| title_exact_search | Encyclopedia of thermal packaging. |
| title_full | Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques / edited-in-chief, Avram Bar-Cohen. |
| title_fullStr | Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques / edited-in-chief, Avram Bar-Cohen. |
| title_full_unstemmed | Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques / edited-in-chief, Avram Bar-Cohen. |
| title_short | Encyclopedia of thermal packaging. |
| title_sort | encyclopedia of thermal packaging thermal packaging techniques |
| topic | Electronic packaging. http://id.loc.gov/authorities/subjects/sh85042366 Insulation (Heat) http://id.loc.gov/authorities/subjects/sh85066793 Mise sous boîtier (Électronique) TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh Electronic packaging fast Insulation (Heat) fast |
| topic_facet | Electronic packaging. Insulation (Heat) Mise sous boîtier (Électronique) TECHNOLOGY & ENGINEERING Electronics Digital. TECHNOLOGY & ENGINEERING Electronics Microelectronics. Electronic packaging |
| url | https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=525627 |
| work_keys_str_mv | AT barcohenavram encyclopediaofthermalpackagingset1 |