Applied materials and electronics engineering :: selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China /
This two-volume set, comprising 172 peer-reviewed papers, covers the latest advances in applied mechanics and materials, structural and new functional materials, environmental materials, geotechnical and building materials, electronic materials and applications, new materials and composite materials...
Gespeichert in:
| Körperschaft: | |
|---|---|
| Weitere Verfasser: | , , |
| Format: | Elektronisch Tagungsbericht E-Book |
| Sprache: | English |
| Veröffentlicht: |
Durnten-Zurich, Switzerland :
Trans Tech Publications,
©2012.
|
| Schriftenreihe: | Advanced materials research ;
v. 378-379. |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Zusammenfassung: | This two-volume set, comprising 172 peer-reviewed papers, covers the latest advances in applied mechanics and materials, structural and new functional materials, environmental materials, geotechnical and building materials, electronic materials and applications, new materials and composite materials and other related fields. Combined with its wide coverage of applications, this collection will be welcomed by anyone working in these fields. Review from Book News Inc.: From the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), held in January 2012 in Hon. |
| Beschreibung: | 1 online resource (2 volumes) : illustrations |
| Bibliographie: | Includes bibliographical references and indexes. |
| ISBN: | 9783038137566 3038137561 |
Internformat
MARC
| LEADER | 00000cam a2200000 a 4500 | ||
|---|---|---|---|
| 001 | ZDB-4-EBA-ocn812019689 | ||
| 003 | OCoLC | ||
| 005 | 20241004212047.0 | ||
| 006 | m o d | ||
| 007 | cr cnu---unuuu | ||
| 008 | 121005s2012 sz a ob 101 0 eng d | ||
| 040 | |a MUU |b eng |e pn |c MUU |d CUS |d N$T |d OCLCF |d OCLCO |d EBLCP |d DEBSZ |d OCLCO |d OCL |d OCLCO |d OCLCQ |d OCLCO |d OCLCQ |d AGLDB |d OCLCQ |d VTS |d STF |d M8D |d OCLCQ |d AJS |d OCLCO |d OCLCQ |d OCLCO |d OCLCQ | ||
| 019 | |a 897640686 | ||
| 020 | |a 9783038137566 |q (electronic bk.) | ||
| 020 | |a 3038137561 |q (electronic bk.) | ||
| 035 | |a (OCoLC)812019689 |z (OCoLC)897640686 | ||
| 050 | 4 | |a TK7801 | |
| 072 | 7 | |a TEC |x 008060 |2 bisacsh | |
| 072 | 7 | |a TEC |x 008070 |2 bisacsh | |
| 082 | 7 | |a 621.381 |2 23 | |
| 049 | |a MAIN | ||
| 111 | 2 | |a International Conference on Applied Materials and Electronics Engineering |d (2012 : |c Hong Kong, China) | |
| 245 | 1 | 0 | |a Applied materials and electronics engineering : |b selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / |c edited by Brendan Gan, Yu Gan and Y. Yu. |
| 260 | |a Durnten-Zurich, Switzerland : |b Trans Tech Publications, |c ©2012. | ||
| 300 | |a 1 online resource (2 volumes) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Advanced Materials Research ; |v v. 378-379 | |
| 504 | |a Includes bibliographical references and indexes. | ||
| 588 | 0 | |a Print version record. | |
| 505 | 0 | |a Applied Materials and Electronics Engineering; Sponsors and Committees; Table of Contents; Chapter 1: Applied Mechanics and Materials; The Study about Hole Distance Calculating Method of Wide-Space Bench Blasting; Molecular Dynamics Simulation of Crack Initiation of Aluminum under Tensile Deformation; Numerical Simulation of Shock Diffraction on Cartesian Grid; Numerical Simulation of Ring-Shape Rock Failure under Compressive Loading; Numerical Simulation of the Quasi-Static Axial Compression of the Pseudo-Elastic Phase Transformation Cylindrical Shells. | |
| 505 | 8 | |a Discussions on the Principle to Reduce the Sliding Fall Rock Impact Force against Protective StructureA Standing Wave-Duct System for Acoustical Property Prediction of Multi-Layered Noise Control Materials; Numerical Simulation on Combined Deformation of Tip-Loaded Cantilever Beam with Particle Flow Code; Hourglass Control Methods in Numerical Simulation Code RingForm; Acoustic Radiated Calculation of a Finite Cylindrical Shell and Interface Design of the Programs; Acoustic Emission Characteristics of Rock Failure under Uniaxial Loading. | |
| 505 | 8 | |a Microstructure and Properties of WCP/Cu Layered Functionally Graded Materials Prepared by Vacuum Hot-Pressed SinteringInvestigation on Random Parameters of Aircraft Structural Reliability Model; Carbonation of Fly Ash Concrete and Micro-Hardness Analysis; Multi-Phase Explosion Detonation and JWL EOS Parameters Numerical Calculation; SHPB Experimental Investigation used for Concrete; The Patch Test of Numerical Manifold Schemes with Mixed Cover Coupled Velocity and Pressure for Steady N-S Equations; Numerical Simulation of Wave Propagation in Variable Cross-Section Bars. | |
| 505 | 8 | |a Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading II: Results and DiscussionStudy on Anoxic / Anaerobic / Aerobic Process to Treat Rural Domestic Wastewater; Analysis of the Force Characteristics of Stem to the Roots by SM Solver; Symplectic Solutions in Singularity Problems of Anisotropic Beams; Flow Field Analysis and Experiment Study on Air Losing of Hydraulic Retarder; Strain Measurements Based Finite Element Model Updating. | |
| 505 | 8 | |a Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading I: Experiment and Numerical Simulation MethodEffect of Heat Treatment on Al-40Si Alloy Modified by Sr Addition; The Reliability Analysis of Concrete Perforated Brick Wall Shrinkage Cracking; Inversion of Functionally Graded Materials to Improve the Elastic Ultimate Bearing Capacity of Thick-Walled Hollow Cylinder; Applications of Carbon Fiber Composites; Design of Safety Monitoring System for Super-Large Deep Foundation Pit in City Center. | |
| 520 | |a This two-volume set, comprising 172 peer-reviewed papers, covers the latest advances in applied mechanics and materials, structural and new functional materials, environmental materials, geotechnical and building materials, electronic materials and applications, new materials and composite materials and other related fields. Combined with its wide coverage of applications, this collection will be welcomed by anyone working in these fields. Review from Book News Inc.: From the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), held in January 2012 in Hon. | ||
| 650 | 0 | |a Electronics |v Congresses. | |
| 650 | 0 | |a Electronics |x Materials |v Congresses. | |
| 650 | 6 | |a Électronique |v Congrès. | |
| 650 | 6 | |a Électronique |x Matériaux |v Congrès. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Digital. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Microelectronics. |2 bisacsh | |
| 650 | 7 | |a Electronics |2 fast | |
| 650 | 7 | |a Electronics |x Materials |2 fast | |
| 655 | 7 | |a Conference papers and proceedings |2 fast | |
| 700 | 1 | |a Gan, Brendan. | |
| 700 | 1 | |a Gan, Yu. | |
| 700 | 1 | |a Yu, Y. | |
| 776 | 0 | 8 | |i Print version: |a Gan, Brendan. |t Applied Materials and Electronics Engineering : Selected, Peer Reviewed Papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong. |d Zurich : Trans Tech Publishers, ©2011 |z 9783037852880 |
| 830 | 0 | |a Advanced materials research ; |v v. 378-379. |0 http://id.loc.gov/authorities/names/n99255722 | |
| 856 | 4 | 0 | |l FWS01 |p ZDB-4-EBA |q FWS_PDA_EBA |u https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=517067 |3 Volltext |
| 938 | |a ProQuest Ebook Central |b EBLB |n EBL1872736 | ||
| 938 | |a EBSCOhost |b EBSC |n 517067 | ||
| 994 | |a 92 |b GEBAY | ||
| 912 | |a ZDB-4-EBA | ||
| 049 | |a DE-863 | ||
Datensatz im Suchindex
| DE-BY-FWS_katkey | ZDB-4-EBA-ocn812019689 |
|---|---|
| _version_ | 1816882210164178944 |
| adam_text | |
| any_adam_object | |
| author2 | Gan, Brendan Gan, Yu Yu, Y. |
| author2_role | |
| author2_variant | b g bg y g yg y y yy |
| author_corporate | International Conference on Applied Materials and Electronics Engineering Hong Kong, China |
| author_corporate_role | |
| author_facet | Gan, Brendan Gan, Yu Yu, Y. International Conference on Applied Materials and Electronics Engineering Hong Kong, China |
| author_sort | International Conference on Applied Materials and Electronics Engineering Hong Kong, China |
| building | Verbundindex |
| bvnumber | localFWS |
| callnumber-first | T - Technology |
| callnumber-label | TK7801 |
| callnumber-raw | TK7801 |
| callnumber-search | TK7801 |
| callnumber-sort | TK 47801 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| collection | ZDB-4-EBA |
| contents | Applied Materials and Electronics Engineering; Sponsors and Committees; Table of Contents; Chapter 1: Applied Mechanics and Materials; The Study about Hole Distance Calculating Method of Wide-Space Bench Blasting; Molecular Dynamics Simulation of Crack Initiation of Aluminum under Tensile Deformation; Numerical Simulation of Shock Diffraction on Cartesian Grid; Numerical Simulation of Ring-Shape Rock Failure under Compressive Loading; Numerical Simulation of the Quasi-Static Axial Compression of the Pseudo-Elastic Phase Transformation Cylindrical Shells. Discussions on the Principle to Reduce the Sliding Fall Rock Impact Force against Protective StructureA Standing Wave-Duct System for Acoustical Property Prediction of Multi-Layered Noise Control Materials; Numerical Simulation on Combined Deformation of Tip-Loaded Cantilever Beam with Particle Flow Code; Hourglass Control Methods in Numerical Simulation Code RingForm; Acoustic Radiated Calculation of a Finite Cylindrical Shell and Interface Design of the Programs; Acoustic Emission Characteristics of Rock Failure under Uniaxial Loading. Microstructure and Properties of WCP/Cu Layered Functionally Graded Materials Prepared by Vacuum Hot-Pressed SinteringInvestigation on Random Parameters of Aircraft Structural Reliability Model; Carbonation of Fly Ash Concrete and Micro-Hardness Analysis; Multi-Phase Explosion Detonation and JWL EOS Parameters Numerical Calculation; SHPB Experimental Investigation used for Concrete; The Patch Test of Numerical Manifold Schemes with Mixed Cover Coupled Velocity and Pressure for Steady N-S Equations; Numerical Simulation of Wave Propagation in Variable Cross-Section Bars. Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading II: Results and DiscussionStudy on Anoxic / Anaerobic / Aerobic Process to Treat Rural Domestic Wastewater; Analysis of the Force Characteristics of Stem to the Roots by SM Solver; Symplectic Solutions in Singularity Problems of Anisotropic Beams; Flow Field Analysis and Experiment Study on Air Losing of Hydraulic Retarder; Strain Measurements Based Finite Element Model Updating. Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading I: Experiment and Numerical Simulation MethodEffect of Heat Treatment on Al-40Si Alloy Modified by Sr Addition; The Reliability Analysis of Concrete Perforated Brick Wall Shrinkage Cracking; Inversion of Functionally Graded Materials to Improve the Elastic Ultimate Bearing Capacity of Thick-Walled Hollow Cylinder; Applications of Carbon Fiber Composites; Design of Safety Monitoring System for Super-Large Deep Foundation Pit in City Center. |
| ctrlnum | (OCoLC)812019689 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic Conference Proceeding eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>06132cam a2200625 a 4500</leader><controlfield tag="001">ZDB-4-EBA-ocn812019689</controlfield><controlfield tag="003">OCoLC</controlfield><controlfield tag="005">20241004212047.0</controlfield><controlfield tag="006">m o d </controlfield><controlfield tag="007">cr cnu---unuuu</controlfield><controlfield tag="008">121005s2012 sz a ob 101 0 eng d</controlfield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">MUU</subfield><subfield code="b">eng</subfield><subfield code="e">pn</subfield><subfield code="c">MUU</subfield><subfield code="d">CUS</subfield><subfield code="d">N$T</subfield><subfield code="d">OCLCF</subfield><subfield code="d">OCLCO</subfield><subfield code="d">EBLCP</subfield><subfield code="d">DEBSZ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCL</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">AGLDB</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">VTS</subfield><subfield code="d">STF</subfield><subfield code="d">M8D</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">AJS</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield></datafield><datafield tag="019" ind1=" " ind2=" "><subfield code="a">897640686</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038137566</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3038137561</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)812019689</subfield><subfield code="z">(OCoLC)897640686</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">TK7801</subfield></datafield><datafield tag="072" ind1=" " ind2="7"><subfield code="a">TEC</subfield><subfield code="x">008060</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="072" ind1=" " ind2="7"><subfield code="a">TEC</subfield><subfield code="x">008070</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="082" ind1="7" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">MAIN</subfield></datafield><datafield tag="111" ind1="2" ind2=" "><subfield code="a">International Conference on Applied Materials and Electronics Engineering</subfield><subfield code="d">(2012 :</subfield><subfield code="c">Hong Kong, China)</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Applied materials and electronics engineering :</subfield><subfield code="b">selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China /</subfield><subfield code="c">edited by Brendan Gan, Yu Gan and Y. Yu.</subfield></datafield><datafield tag="260" ind1=" " ind2=" "><subfield code="a">Durnten-Zurich, Switzerland :</subfield><subfield code="b">Trans Tech Publications,</subfield><subfield code="c">©2012.</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (2 volumes) :</subfield><subfield code="b">illustrations</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Advanced Materials Research ;</subfield><subfield code="v">v. 378-379</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and indexes.</subfield></datafield><datafield tag="588" ind1="0" ind2=" "><subfield code="a">Print version record.</subfield></datafield><datafield tag="505" ind1="0" ind2=" "><subfield code="a">Applied Materials and Electronics Engineering; Sponsors and Committees; Table of Contents; Chapter 1: Applied Mechanics and Materials; The Study about Hole Distance Calculating Method of Wide-Space Bench Blasting; Molecular Dynamics Simulation of Crack Initiation of Aluminum under Tensile Deformation; Numerical Simulation of Shock Diffraction on Cartesian Grid; Numerical Simulation of Ring-Shape Rock Failure under Compressive Loading; Numerical Simulation of the Quasi-Static Axial Compression of the Pseudo-Elastic Phase Transformation Cylindrical Shells.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Discussions on the Principle to Reduce the Sliding Fall Rock Impact Force against Protective StructureA Standing Wave-Duct System for Acoustical Property Prediction of Multi-Layered Noise Control Materials; Numerical Simulation on Combined Deformation of Tip-Loaded Cantilever Beam with Particle Flow Code; Hourglass Control Methods in Numerical Simulation Code RingForm; Acoustic Radiated Calculation of a Finite Cylindrical Shell and Interface Design of the Programs; Acoustic Emission Characteristics of Rock Failure under Uniaxial Loading.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Microstructure and Properties of WCP/Cu Layered Functionally Graded Materials Prepared by Vacuum Hot-Pressed SinteringInvestigation on Random Parameters of Aircraft Structural Reliability Model; Carbonation of Fly Ash Concrete and Micro-Hardness Analysis; Multi-Phase Explosion Detonation and JWL EOS Parameters Numerical Calculation; SHPB Experimental Investigation used for Concrete; The Patch Test of Numerical Manifold Schemes with Mixed Cover Coupled Velocity and Pressure for Steady N-S Equations; Numerical Simulation of Wave Propagation in Variable Cross-Section Bars.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading II: Results and DiscussionStudy on Anoxic / Anaerobic / Aerobic Process to Treat Rural Domestic Wastewater; Analysis of the Force Characteristics of Stem to the Roots by SM Solver; Symplectic Solutions in Singularity Problems of Anisotropic Beams; Flow Field Analysis and Experiment Study on Air Losing of Hydraulic Retarder; Strain Measurements Based Finite Element Model Updating.</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading I: Experiment and Numerical Simulation MethodEffect of Heat Treatment on Al-40Si Alloy Modified by Sr Addition; The Reliability Analysis of Concrete Perforated Brick Wall Shrinkage Cracking; Inversion of Functionally Graded Materials to Improve the Elastic Ultimate Bearing Capacity of Thick-Walled Hollow Cylinder; Applications of Carbon Fiber Composites; Design of Safety Monitoring System for Super-Large Deep Foundation Pit in City Center.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This two-volume set, comprising 172 peer-reviewed papers, covers the latest advances in applied mechanics and materials, structural and new functional materials, environmental materials, geotechnical and building materials, electronic materials and applications, new materials and composite materials and other related fields. Combined with its wide coverage of applications, this collection will be welcomed by anyone working in these fields. Review from Book News Inc.: From the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), held in January 2012 in Hon.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Electronics</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Electronics</subfield><subfield code="x">Materials</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Électronique</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Électronique</subfield><subfield code="x">Matériaux</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING</subfield><subfield code="x">Electronics</subfield><subfield code="x">Digital.</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING</subfield><subfield code="x">Electronics</subfield><subfield code="x">Microelectronics.</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronics</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronics</subfield><subfield code="x">Materials</subfield><subfield code="2">fast</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="a">Conference papers and proceedings</subfield><subfield code="2">fast</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gan, Brendan.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gan, Yu.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Yu, Y.</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Print version:</subfield><subfield code="a">Gan, Brendan.</subfield><subfield code="t">Applied Materials and Electronics Engineering : Selected, Peer Reviewed Papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong.</subfield><subfield code="d">Zurich : Trans Tech Publishers, ©2011</subfield><subfield code="z">9783037852880</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Advanced materials research ;</subfield><subfield code="v">v. 378-379.</subfield><subfield code="0">http://id.loc.gov/authorities/names/n99255722</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="l">FWS01</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FWS_PDA_EBA</subfield><subfield code="u">https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=517067</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">ProQuest Ebook Central</subfield><subfield code="b">EBLB</subfield><subfield code="n">EBL1872736</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">EBSCOhost</subfield><subfield code="b">EBSC</subfield><subfield code="n">517067</subfield></datafield><datafield tag="994" ind1=" " ind2=" "><subfield code="a">92</subfield><subfield code="b">GEBAY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-EBA</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-863</subfield></datafield></record></collection> |
| genre | Conference papers and proceedings fast |
| genre_facet | Conference papers and proceedings |
| id | ZDB-4-EBA-ocn812019689 |
| illustrated | Illustrated |
| indexdate | 2024-11-27T13:24:59Z |
| institution | BVB |
| isbn | 9783038137566 3038137561 |
| language | English |
| oclc_num | 812019689 |
| open_access_boolean | |
| owner | MAIN DE-863 DE-BY-FWS |
| owner_facet | MAIN DE-863 DE-BY-FWS |
| physical | 1 online resource (2 volumes) : illustrations |
| psigel | ZDB-4-EBA |
| publishDate | 2012 |
| publishDateSearch | 2012 |
| publishDateSort | 2012 |
| publisher | Trans Tech Publications, |
| record_format | marc |
| series | Advanced materials research ; |
| series2 | Advanced Materials Research ; |
| spelling | International Conference on Applied Materials and Electronics Engineering (2012 : Hong Kong, China) Applied materials and electronics engineering : selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / edited by Brendan Gan, Yu Gan and Y. Yu. Durnten-Zurich, Switzerland : Trans Tech Publications, ©2012. 1 online resource (2 volumes) : illustrations text txt rdacontent computer c rdamedia online resource cr rdacarrier Advanced Materials Research ; v. 378-379 Includes bibliographical references and indexes. Print version record. Applied Materials and Electronics Engineering; Sponsors and Committees; Table of Contents; Chapter 1: Applied Mechanics and Materials; The Study about Hole Distance Calculating Method of Wide-Space Bench Blasting; Molecular Dynamics Simulation of Crack Initiation of Aluminum under Tensile Deformation; Numerical Simulation of Shock Diffraction on Cartesian Grid; Numerical Simulation of Ring-Shape Rock Failure under Compressive Loading; Numerical Simulation of the Quasi-Static Axial Compression of the Pseudo-Elastic Phase Transformation Cylindrical Shells. Discussions on the Principle to Reduce the Sliding Fall Rock Impact Force against Protective StructureA Standing Wave-Duct System for Acoustical Property Prediction of Multi-Layered Noise Control Materials; Numerical Simulation on Combined Deformation of Tip-Loaded Cantilever Beam with Particle Flow Code; Hourglass Control Methods in Numerical Simulation Code RingForm; Acoustic Radiated Calculation of a Finite Cylindrical Shell and Interface Design of the Programs; Acoustic Emission Characteristics of Rock Failure under Uniaxial Loading. Microstructure and Properties of WCP/Cu Layered Functionally Graded Materials Prepared by Vacuum Hot-Pressed SinteringInvestigation on Random Parameters of Aircraft Structural Reliability Model; Carbonation of Fly Ash Concrete and Micro-Hardness Analysis; Multi-Phase Explosion Detonation and JWL EOS Parameters Numerical Calculation; SHPB Experimental Investigation used for Concrete; The Patch Test of Numerical Manifold Schemes with Mixed Cover Coupled Velocity and Pressure for Steady N-S Equations; Numerical Simulation of Wave Propagation in Variable Cross-Section Bars. Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading II: Results and DiscussionStudy on Anoxic / Anaerobic / Aerobic Process to Treat Rural Domestic Wastewater; Analysis of the Force Characteristics of Stem to the Roots by SM Solver; Symplectic Solutions in Singularity Problems of Anisotropic Beams; Flow Field Analysis and Experiment Study on Air Losing of Hydraulic Retarder; Strain Measurements Based Finite Element Model Updating. Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading I: Experiment and Numerical Simulation MethodEffect of Heat Treatment on Al-40Si Alloy Modified by Sr Addition; The Reliability Analysis of Concrete Perforated Brick Wall Shrinkage Cracking; Inversion of Functionally Graded Materials to Improve the Elastic Ultimate Bearing Capacity of Thick-Walled Hollow Cylinder; Applications of Carbon Fiber Composites; Design of Safety Monitoring System for Super-Large Deep Foundation Pit in City Center. This two-volume set, comprising 172 peer-reviewed papers, covers the latest advances in applied mechanics and materials, structural and new functional materials, environmental materials, geotechnical and building materials, electronic materials and applications, new materials and composite materials and other related fields. Combined with its wide coverage of applications, this collection will be welcomed by anyone working in these fields. Review from Book News Inc.: From the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), held in January 2012 in Hon. Electronics Congresses. Electronics Materials Congresses. Électronique Congrès. Électronique Matériaux Congrès. TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh Electronics fast Electronics Materials fast Conference papers and proceedings fast Gan, Brendan. Gan, Yu. Yu, Y. Print version: Gan, Brendan. Applied Materials and Electronics Engineering : Selected, Peer Reviewed Papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong. Zurich : Trans Tech Publishers, ©2011 9783037852880 Advanced materials research ; v. 378-379. http://id.loc.gov/authorities/names/n99255722 FWS01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=517067 Volltext |
| spellingShingle | Applied materials and electronics engineering : selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / Advanced materials research ; Applied Materials and Electronics Engineering; Sponsors and Committees; Table of Contents; Chapter 1: Applied Mechanics and Materials; The Study about Hole Distance Calculating Method of Wide-Space Bench Blasting; Molecular Dynamics Simulation of Crack Initiation of Aluminum under Tensile Deformation; Numerical Simulation of Shock Diffraction on Cartesian Grid; Numerical Simulation of Ring-Shape Rock Failure under Compressive Loading; Numerical Simulation of the Quasi-Static Axial Compression of the Pseudo-Elastic Phase Transformation Cylindrical Shells. Discussions on the Principle to Reduce the Sliding Fall Rock Impact Force against Protective StructureA Standing Wave-Duct System for Acoustical Property Prediction of Multi-Layered Noise Control Materials; Numerical Simulation on Combined Deformation of Tip-Loaded Cantilever Beam with Particle Flow Code; Hourglass Control Methods in Numerical Simulation Code RingForm; Acoustic Radiated Calculation of a Finite Cylindrical Shell and Interface Design of the Programs; Acoustic Emission Characteristics of Rock Failure under Uniaxial Loading. Microstructure and Properties of WCP/Cu Layered Functionally Graded Materials Prepared by Vacuum Hot-Pressed SinteringInvestigation on Random Parameters of Aircraft Structural Reliability Model; Carbonation of Fly Ash Concrete and Micro-Hardness Analysis; Multi-Phase Explosion Detonation and JWL EOS Parameters Numerical Calculation; SHPB Experimental Investigation used for Concrete; The Patch Test of Numerical Manifold Schemes with Mixed Cover Coupled Velocity and Pressure for Steady N-S Equations; Numerical Simulation of Wave Propagation in Variable Cross-Section Bars. Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading II: Results and DiscussionStudy on Anoxic / Anaerobic / Aerobic Process to Treat Rural Domestic Wastewater; Analysis of the Force Characteristics of Stem to the Roots by SM Solver; Symplectic Solutions in Singularity Problems of Anisotropic Beams; Flow Field Analysis and Experiment Study on Air Losing of Hydraulic Retarder; Strain Measurements Based Finite Element Model Updating. Behavior of FRP Sandwich Panels under Synergistic Effects of Low Temperature and Cyclic Loading I: Experiment and Numerical Simulation MethodEffect of Heat Treatment on Al-40Si Alloy Modified by Sr Addition; The Reliability Analysis of Concrete Perforated Brick Wall Shrinkage Cracking; Inversion of Functionally Graded Materials to Improve the Elastic Ultimate Bearing Capacity of Thick-Walled Hollow Cylinder; Applications of Carbon Fiber Composites; Design of Safety Monitoring System for Super-Large Deep Foundation Pit in City Center. Electronics Congresses. Electronics Materials Congresses. Électronique Congrès. Électronique Matériaux Congrès. TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh Electronics fast Electronics Materials fast |
| title | Applied materials and electronics engineering : selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / |
| title_auth | Applied materials and electronics engineering : selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / |
| title_exact_search | Applied materials and electronics engineering : selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / |
| title_full | Applied materials and electronics engineering : selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / edited by Brendan Gan, Yu Gan and Y. Yu. |
| title_fullStr | Applied materials and electronics engineering : selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / edited by Brendan Gan, Yu Gan and Y. Yu. |
| title_full_unstemmed | Applied materials and electronics engineering : selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / edited by Brendan Gan, Yu Gan and Y. Yu. |
| title_short | Applied materials and electronics engineering : |
| title_sort | applied materials and electronics engineering selected peer reviewed papers from the 2012 international conference on applied materials and electronics engineering amee 2012 january 18 19 2012 hong kong china |
| title_sub | selected, peer reviewed papers from the 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), January 18-19, 2012, Hong Kong, China / |
| topic | Electronics Congresses. Electronics Materials Congresses. Électronique Congrès. Électronique Matériaux Congrès. TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh Electronics fast Electronics Materials fast |
| topic_facet | Electronics Congresses. Electronics Materials Congresses. Électronique Congrès. Électronique Matériaux Congrès. TECHNOLOGY & ENGINEERING Electronics Digital. TECHNOLOGY & ENGINEERING Electronics Microelectronics. Electronics Electronics Materials Conference papers and proceedings |
| url | https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=517067 |
| work_keys_str_mv | AT internationalconferenceonappliedmaterialsandelectronicsengineeringhongkongchina appliedmaterialsandelectronicsengineeringselectedpeerreviewedpapersfromthe2012internationalconferenceonappliedmaterialsandelectronicsengineeringamee2012january18192012hongkongchina AT ganbrendan appliedmaterialsandelectronicsengineeringselectedpeerreviewedpapersfromthe2012internationalconferenceonappliedmaterialsandelectronicsengineeringamee2012january18192012hongkongchina AT ganyu appliedmaterialsandelectronicsengineeringselectedpeerreviewedpapersfromthe2012internationalconferenceonappliedmaterialsandelectronicsengineeringamee2012january18192012hongkongchina AT yuy appliedmaterialsandelectronicsengineeringselectedpeerreviewedpapersfromthe2012internationalconferenceonappliedmaterialsandelectronicsengineeringamee2012january18192012hongkongchina |