Components, packaging and manufacturing technology :: selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 /
Gespeichert in:
| Körperschaft: | |
|---|---|
| Weitere Verfasser: | |
| Format: | Elektronisch Tagungsbericht E-Book |
| Sprache: | English |
| Veröffentlicht: |
Stafa-Zurich, Switzerland ; Enfield, NH :
Trans Tech Publications,
©2011.
|
| Schriftenreihe: | Key engineering materials ;
v. 460/461. |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | 1 online resource (pages). |
| ISBN: | 9783038134800 3038134805 |
| ISSN: | 1662-9795 ; |
Internformat
MARC
| LEADER | 00000cam a22000003a 4500 | ||
|---|---|---|---|
| 001 | ZDB-4-EBA-ocn811963183 | ||
| 003 | OCoLC | ||
| 005 | 20241004212047.0 | ||
| 006 | m o d | ||
| 007 | cr |n||||||||| | ||
| 008 | 121004s2011 sz a ob 101 0 eng d | ||
| 040 | |a YDXCP |b eng |e pn |c YDXCP |d OCLCO |d N$T |d OCLCQ |d OCLCF |d OCLCO |d OCL |d OCLCO |d OCLCQ |d OCLCO |d OCLCQ |d AGLDB |d OCLCQ |d VTS |d STF |d M8D |d OCLCO |d OCLCQ |d OCLCO | ||
| 020 | |a 9783038134800 |q (electronic bk.) | ||
| 020 | |a 3038134805 |q (electronic bk.) | ||
| 020 | |z 9780878492138 | ||
| 020 | |z 0878492135 | ||
| 035 | |a (OCoLC)811963183 | ||
| 050 | 4 | |a TA1 | |
| 072 | 7 | |a TEC |x 009000 |2 bisacsh | |
| 072 | 7 | |a TEC |x 035000 |2 bisacsh | |
| 082 | 7 | |a 620.005 |2 23 | |
| 049 | |a MAIN | ||
| 111 | 2 | |a International Conference on Components, Packaging and Manufacturing Technology |d (2010 : |c Sanya Shi, China) |0 http://id.loc.gov/authorities/names/nb2011006666 | |
| 245 | 1 | 0 | |a Components, packaging and manufacturing technology : |b selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / |c edited by Yanwen Wu. |
| 246 | 3 | 0 | |a ICCPMT 2010 |
| 260 | |a Stafa-Zurich, Switzerland ; |a Enfield, NH : |b Trans Tech Publications, |c ©2011. | ||
| 300 | |a 1 online resource (pages). | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Key engineering materials, |x 1662-9795 ; |v v. 460-461 | |
| 650 | 0 | |a Electronic apparatus and appliances |v Congresses. | |
| 650 | 0 | |a Electronic packaging |v Congresses. | |
| 650 | 0 | |a Microelectronic packaging |v Congresses. | |
| 650 | 0 | |a Manufacturing processes |v Congresses. | |
| 650 | 6 | |a Mise sous boîtier (Électronique) |v Congrès. | |
| 650 | 6 | |a Mise sous boîtier (Microélectronique) |v Congrès. | |
| 650 | 6 | |a Fabrication |v Congrès. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Engineering (General) |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Reference. |2 bisacsh | |
| 650 | 7 | |a Electronic apparatus and appliances |2 fast | |
| 650 | 7 | |a Electronic packaging |2 fast | |
| 650 | 7 | |a Manufacturing processes |2 fast | |
| 650 | 7 | |a Microelectronic packaging |2 fast | |
| 655 | 7 | |a Conference papers and proceedings |2 fast | |
| 700 | 1 | |a Wu, Yanwen. |4 edt | |
| 776 | 0 | 8 | |i Print version: |z 9780878492138 |z 0878492135 |w (DLC) 2011414054 |w (OCoLC)722384684 |
| 830 | 0 | |a Key engineering materials ; |v v. 460/461. |0 http://id.loc.gov/authorities/names/no99072054 | |
| 856 | 4 | 0 | |l FWS01 |p ZDB-4-EBA |q FWS_PDA_EBA |u https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=553046 |3 Volltext |
| 938 | |a EBSCOhost |b EBSC |n 553046 | ||
| 938 | |a YBP Library Services |b YANK |n 9700722 | ||
| 994 | |a 92 |b GEBAY | ||
| 912 | |a ZDB-4-EBA | ||
| 049 | |a DE-863 | ||
Datensatz im Suchindex
| DE-BY-FWS_katkey | ZDB-4-EBA-ocn811963183 |
|---|---|
| _version_ | 1816882210072952832 |
| adam_text | |
| any_adam_object | |
| author2 | Wu, Yanwen |
| author2_role | edt |
| author2_variant | y w yw |
| author_corporate | International Conference on Components, Packaging and Manufacturing Technology Sanya Shi, China |
| author_corporate_role | |
| author_facet | Wu, Yanwen International Conference on Components, Packaging and Manufacturing Technology Sanya Shi, China |
| author_sort | International Conference on Components, Packaging and Manufacturing Technology Sanya Shi, China |
| building | Verbundindex |
| bvnumber | localFWS |
| callnumber-first | T - Technology |
| callnumber-label | TA1 |
| callnumber-raw | TA1 |
| callnumber-search | TA1 |
| callnumber-sort | TA 11 |
| callnumber-subject | TA - General and Civil Engineering |
| collection | ZDB-4-EBA |
| ctrlnum | (OCoLC)811963183 |
| dewey-full | 620.005 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 620 - Engineering and allied operations |
| dewey-raw | 620.005 |
| dewey-search | 620.005 |
| dewey-sort | 3620.005 |
| dewey-tens | 620 - Engineering and allied operations |
| format | Electronic Conference Proceeding eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02700cam a22005893a 4500</leader><controlfield tag="001">ZDB-4-EBA-ocn811963183</controlfield><controlfield tag="003">OCoLC</controlfield><controlfield tag="005">20241004212047.0</controlfield><controlfield tag="006">m o d </controlfield><controlfield tag="007">cr |n|||||||||</controlfield><controlfield tag="008">121004s2011 sz a ob 101 0 eng d</controlfield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">YDXCP</subfield><subfield code="b">eng</subfield><subfield code="e">pn</subfield><subfield code="c">YDXCP</subfield><subfield code="d">OCLCO</subfield><subfield code="d">N$T</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCF</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCL</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">AGLDB</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">VTS</subfield><subfield code="d">STF</subfield><subfield code="d">M8D</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038134800</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3038134805</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9780878492138</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">0878492135</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)811963183</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">TA1</subfield></datafield><datafield tag="072" ind1=" " ind2="7"><subfield code="a">TEC</subfield><subfield code="x">009000</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="072" ind1=" " ind2="7"><subfield code="a">TEC</subfield><subfield code="x">035000</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="082" ind1="7" ind2=" "><subfield code="a">620.005</subfield><subfield code="2">23</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">MAIN</subfield></datafield><datafield tag="111" ind1="2" ind2=" "><subfield code="a">International Conference on Components, Packaging and Manufacturing Technology</subfield><subfield code="d">(2010 :</subfield><subfield code="c">Sanya Shi, China)</subfield><subfield code="0">http://id.loc.gov/authorities/names/nb2011006666</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Components, packaging and manufacturing technology :</subfield><subfield code="b">selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 /</subfield><subfield code="c">edited by Yanwen Wu.</subfield></datafield><datafield tag="246" ind1="3" ind2="0"><subfield code="a">ICCPMT 2010</subfield></datafield><datafield tag="260" ind1=" " ind2=" "><subfield code="a">Stafa-Zurich, Switzerland ;</subfield><subfield code="a">Enfield, NH :</subfield><subfield code="b">Trans Tech Publications,</subfield><subfield code="c">©2011.</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (pages).</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Key engineering materials,</subfield><subfield code="x">1662-9795 ;</subfield><subfield code="v">v. 460-461</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Electronic apparatus and appliances</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Electronic packaging</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Microelectronic packaging</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Manufacturing processes</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Mise sous boîtier (Électronique)</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Mise sous boîtier (Microélectronique)</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Fabrication</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING</subfield><subfield code="x">Engineering (General)</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING</subfield><subfield code="x">Reference.</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronic apparatus and appliances</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronic packaging</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Manufacturing processes</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microelectronic packaging</subfield><subfield code="2">fast</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="a">Conference papers and proceedings</subfield><subfield code="2">fast</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wu, Yanwen.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Print version:</subfield><subfield code="z">9780878492138</subfield><subfield code="z">0878492135</subfield><subfield code="w">(DLC) 2011414054</subfield><subfield code="w">(OCoLC)722384684</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Key engineering materials ;</subfield><subfield code="v">v. 460/461.</subfield><subfield code="0">http://id.loc.gov/authorities/names/no99072054</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="l">FWS01</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FWS_PDA_EBA</subfield><subfield code="u">https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=553046</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">EBSCOhost</subfield><subfield code="b">EBSC</subfield><subfield code="n">553046</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">YBP Library Services</subfield><subfield code="b">YANK</subfield><subfield code="n">9700722</subfield></datafield><datafield tag="994" ind1=" " ind2=" "><subfield code="a">92</subfield><subfield code="b">GEBAY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-EBA</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-863</subfield></datafield></record></collection> |
| genre | Conference papers and proceedings fast |
| genre_facet | Conference papers and proceedings |
| id | ZDB-4-EBA-ocn811963183 |
| illustrated | Illustrated |
| indexdate | 2024-11-27T13:24:59Z |
| institution | BVB |
| institution_GND | http://id.loc.gov/authorities/names/nb2011006666 |
| isbn | 9783038134800 3038134805 |
| issn | 1662-9795 ; |
| language | English |
| oclc_num | 811963183 |
| open_access_boolean | |
| owner | MAIN DE-863 DE-BY-FWS |
| owner_facet | MAIN DE-863 DE-BY-FWS |
| physical | 1 online resource (pages). |
| psigel | ZDB-4-EBA |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | Trans Tech Publications, |
| record_format | marc |
| series | Key engineering materials ; |
| series2 | Key engineering materials, |
| spelling | International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China) http://id.loc.gov/authorities/names/nb2011006666 Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / edited by Yanwen Wu. ICCPMT 2010 Stafa-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2011. 1 online resource (pages). text txt rdacontent computer c rdamedia online resource cr rdacarrier Key engineering materials, 1662-9795 ; v. 460-461 Electronic apparatus and appliances Congresses. Electronic packaging Congresses. Microelectronic packaging Congresses. Manufacturing processes Congresses. Mise sous boîtier (Électronique) Congrès. Mise sous boîtier (Microélectronique) Congrès. Fabrication Congrès. TECHNOLOGY & ENGINEERING Engineering (General) bisacsh TECHNOLOGY & ENGINEERING Reference. bisacsh Electronic apparatus and appliances fast Electronic packaging fast Manufacturing processes fast Microelectronic packaging fast Conference papers and proceedings fast Wu, Yanwen. edt Print version: 9780878492138 0878492135 (DLC) 2011414054 (OCoLC)722384684 Key engineering materials ; v. 460/461. http://id.loc.gov/authorities/names/no99072054 FWS01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=553046 Volltext |
| spellingShingle | Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / Key engineering materials ; Electronic apparatus and appliances Congresses. Electronic packaging Congresses. Microelectronic packaging Congresses. Manufacturing processes Congresses. Mise sous boîtier (Électronique) Congrès. Mise sous boîtier (Microélectronique) Congrès. Fabrication Congrès. TECHNOLOGY & ENGINEERING Engineering (General) bisacsh TECHNOLOGY & ENGINEERING Reference. bisacsh Electronic apparatus and appliances fast Electronic packaging fast Manufacturing processes fast Microelectronic packaging fast |
| title | Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / |
| title_alt | ICCPMT 2010 |
| title_auth | Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / |
| title_exact_search | Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / |
| title_full | Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / edited by Yanwen Wu. |
| title_fullStr | Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / edited by Yanwen Wu. |
| title_full_unstemmed | Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / edited by Yanwen Wu. |
| title_short | Components, packaging and manufacturing technology : |
| title_sort | components packaging and manufacturing technology selected peer reviewed paper from 2010 international conference on components packaging and manufacturing technology sanya china december 9 10 2010 |
| title_sub | selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 / |
| topic | Electronic apparatus and appliances Congresses. Electronic packaging Congresses. Microelectronic packaging Congresses. Manufacturing processes Congresses. Mise sous boîtier (Électronique) Congrès. Mise sous boîtier (Microélectronique) Congrès. Fabrication Congrès. TECHNOLOGY & ENGINEERING Engineering (General) bisacsh TECHNOLOGY & ENGINEERING Reference. bisacsh Electronic apparatus and appliances fast Electronic packaging fast Manufacturing processes fast Microelectronic packaging fast |
| topic_facet | Electronic apparatus and appliances Congresses. Electronic packaging Congresses. Microelectronic packaging Congresses. Manufacturing processes Congresses. Mise sous boîtier (Électronique) Congrès. Mise sous boîtier (Microélectronique) Congrès. Fabrication Congrès. TECHNOLOGY & ENGINEERING Engineering (General) TECHNOLOGY & ENGINEERING Reference. Electronic apparatus and appliances Electronic packaging Manufacturing processes Microelectronic packaging Conference papers and proceedings |
| url | https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=553046 |
| work_keys_str_mv | AT internationalconferenceoncomponentspackagingandmanufacturingtechnologysanyashichina componentspackagingandmanufacturingtechnologyselectedpeerreviewedpaperfrom2010internationalconferenceoncomponentspackagingandmanufacturingtechnologysanyachinadecember9102010 AT wuyanwen componentspackagingandmanufacturingtechnologyselectedpeerreviewedpaperfrom2010internationalconferenceoncomponentspackagingandmanufacturingtechnologysanyachinadecember9102010 AT internationalconferenceoncomponentspackagingandmanufacturingtechnologysanyashichina iccpmt2010 AT wuyanwen iccpmt2010 |