Chemical vapor deposition /:
Gespeichert in:
Weitere Verfasser: | , |
---|---|
Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Materials Park, Ohio :
ASM International,
2001.
|
Schriftenreihe: | Surface engineering series ;
v. 2. |
Schlagworte: | |
Online-Zugang: | Volltext |
Beschreibung: | 1 online resource (vii, 481 pages :) |
Bibliographie: | Includes bibliographical references. |
ISBN: | 9781615032242 161503224X |
Internformat
MARC
LEADER | 00000cam a2200000Ma 4500 | ||
---|---|---|---|
001 | ZDB-4-EBA-ocn646817910 | ||
003 | OCoLC | ||
005 | 20240705115654.0 | ||
006 | m o d | ||
007 | cr cn||||||||| | ||
008 | 010221s2001 ohua ob 000 0 eng d | ||
040 | |a E7B |b eng |e pn |c E7B |d OCLCQ |d YDXCP |d N$T |d OCLCQ |d OCLCF |d OCLCQ |d AU@ |d EBLCP |d OCLCQ |d AZK |d LOA |d JBG |d AGLDB |d MOR |d PIFAG |d ZCU |d MERUC |d OCLCQ |d U3W |d STF |d WRM |d OCLCQ |d VTS |d NRAMU |d ICG |d INT |d VT2 |d OCLCQ |d DKC |d OCLCQ |d M8D |d HS0 |d OCLCQ |d UKCRE |d OCLCQ |d OCLCO |d OCLCQ |d YDX |d OCLCQ |d OCLCO |d OCLCL | ||
019 | |a 764525408 |a 780535954 |a 842279014 |a 961552499 |a 962606965 |a 966197629 |a 988510180 |a 992106626 |a 1037919722 |a 1038661387 |a 1045505252 |a 1055370405 |a 1058187407 |a 1081220471 |a 1153463670 | ||
020 | |a 9781615032242 |q (electronic bk.) | ||
020 | |a 161503224X |q (electronic bk.) | ||
020 | |z 0871707314 | ||
020 | |z 9780871707314 | ||
020 | |z 087170692X | ||
020 | |z 9780871706928 | ||
035 | |a (OCoLC)646817910 |z (OCoLC)764525408 |z (OCoLC)780535954 |z (OCoLC)842279014 |z (OCoLC)961552499 |z (OCoLC)962606965 |z (OCoLC)966197629 |z (OCoLC)988510180 |z (OCoLC)992106626 |z (OCoLC)1037919722 |z (OCoLC)1038661387 |z (OCoLC)1045505252 |z (OCoLC)1055370405 |z (OCoLC)1058187407 |z (OCoLC)1081220471 |z (OCoLC)1153463670 | ||
050 | 4 | |a TS695 |b .C52 2001eb | |
072 | 7 | |a TEC |x 040000 |2 bisacsh | |
082 | 7 | |a 671.7/35 |2 21 | |
049 | |a MAIN | ||
245 | 0 | 0 | |a Chemical vapor deposition / |c edited by Jong-Hee Park, T.S. Sudarshan. |
260 | |a Materials Park, Ohio : |b ASM International, |c 2001. | ||
300 | |a 1 online resource (vii, 481 pages :) | ||
336 | |a text |b txt |2 rdacontent | ||
337 | |a computer |b c |2 rdamedia | ||
338 | |a online resource |b cr |2 rdacarrier | ||
347 | |a data file | ||
490 | 1 | |a Surface engineering series ; |v v. 2 | |
504 | |a Includes bibliographical references. | ||
588 | 0 | |a Print version record. | |
505 | 0 | 0 | |g Ch. 1. |t Introduction to Chemical Vapor Deposition (CVD) / |r J.R. Creighton and P. Ho -- |g Ch. 2. |t Basic Principles of CVD Thermodynamics and Kinetics / |r A.K. Pattanaik and V.K. Sarin -- |g Ch. 3. |t Stresses and Mechanical Stability of CVD Thin Films / |r M. Ignat -- |g Ch. 4. |t Combustion Chemical Vapor Deposition (CCVD) / |r A.T. Hunt and Matthias Pohl -- |g Ch. 5. |t Polarized Electrochemical Vapor Deposition / |r Eric Z. Tang, Thomas H. Etsell and Douglas G. Ivey -- |g Ch. 6. |t Chemical Vapor Infiltration: Optimization of Processing Conditions / |r S.K. Griffiths and Robert H. Nilson -- |g Ch. 7. |t Metal-Organic Chemical Vapor Deposition of High Dielectric (Ba, Sr) TiO[subscript 3] Thin Films for Dynamic Random Access Memory Applications / |r C.S. Hwang and H.-I. Yoo. |
650 | 0 | |a Vapor-plating. |0 http://id.loc.gov/authorities/subjects/sh85142069 | |
650 | 0 | |a Refractory coating. |0 http://id.loc.gov/authorities/subjects/sh85112268 | |
650 | 6 | |a Revêtement réfractaire. | |
650 | 7 | |a TECHNOLOGY & ENGINEERING |x Technical & Manufacturing Industries & Trades. |2 bisacsh | |
650 | 7 | |a Refractory coating |2 fast | |
650 | 7 | |a Vapor-plating |2 fast | |
700 | 1 | |a Park, Jong-Hee, |d 1951- |1 https://id.oclc.org/worldcat/entity/E39PCjvXWvfDVQDTypWtCMCDG3 |0 http://id.loc.gov/authorities/names/n88621361 | |
700 | 1 | |a Sudarshan, T. S., |d 1955- |1 https://id.oclc.org/worldcat/entity/E39PCjF43j4Q9wVtw4w6gmgRJC |0 http://id.loc.gov/authorities/names/n88199059 | |
758 | |i has work: |a Chemical vapor deposition (Text) |1 https://id.oclc.org/worldcat/entity/E39PCGJRt74g8hRKRyvxcPGT73 |4 https://id.oclc.org/worldcat/ontology/hasWork | ||
776 | 0 | 8 | |i Print version: |t Chemical vapor deposition. |d Materials Park, Ohio : ASM International, 2001 |w (DLC) 2001022339 |
830 | 0 | |a Surface engineering series ; |v v. 2. |0 http://id.loc.gov/authorities/names/no99036709 | |
856 | 1 | |l FWS01 |p ZDB-4-EBA |q FWS_PDA_EBA |u https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395831 |3 Volltext | |
856 | 1 | |l CBO01 |p ZDB-4-EBA |q FWS_PDA_EBA |u https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395831 |3 Volltext | |
938 | |a ebrary |b EBRY |n ebr10323519 | ||
938 | |a EBSCOhost |b EBSC |n 395831 | ||
938 | |a YBP Library Services |b YANK |n 3623593 | ||
994 | |a 92 |b GEBAY | ||
912 | |a ZDB-4-EBA |
Datensatz im Suchindex
DE-BY-FWS_katkey | ZDB-4-EBA-ocn646817910 |
---|---|
_version_ | 1813903370874781696 |
adam_text | |
any_adam_object | |
author2 | Park, Jong-Hee, 1951- Sudarshan, T. S., 1955- |
author2_role | |
author2_variant | j h p jhp t s s ts tss |
author_GND | http://id.loc.gov/authorities/names/n88621361 http://id.loc.gov/authorities/names/n88199059 |
author_additional | J.R. Creighton and P. Ho -- A.K. Pattanaik and V.K. Sarin -- M. Ignat -- A.T. Hunt and Matthias Pohl -- Eric Z. Tang, Thomas H. Etsell and Douglas G. Ivey -- S.K. Griffiths and Robert H. Nilson -- C.S. Hwang and H.-I. Yoo. |
author_facet | Park, Jong-Hee, 1951- Sudarshan, T. S., 1955- |
author_sort | Park, Jong-Hee, 1951- |
building | Verbundindex |
bvnumber | localFWS |
callnumber-first | T - Technology |
callnumber-label | TS695 |
callnumber-raw | TS695 .C52 2001eb |
callnumber-search | TS695 .C52 2001eb |
callnumber-sort | TS 3695 C52 42001EB |
callnumber-subject | TS - Manufactures |
collection | ZDB-4-EBA |
contents | Introduction to Chemical Vapor Deposition (CVD) / Basic Principles of CVD Thermodynamics and Kinetics / Stresses and Mechanical Stability of CVD Thin Films / Combustion Chemical Vapor Deposition (CCVD) / Polarized Electrochemical Vapor Deposition / Chemical Vapor Infiltration: Optimization of Processing Conditions / Metal-Organic Chemical Vapor Deposition of High Dielectric (Ba, Sr) TiO[subscript 3] Thin Films for Dynamic Random Access Memory Applications / |
ctrlnum | (OCoLC)646817910 |
dewey-full | 671.7/35 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 671 - Metalworking & primary metal products |
dewey-raw | 671.7/35 |
dewey-search | 671.7/35 |
dewey-sort | 3671.7 235 |
dewey-tens | 670 - Manufacturing |
discipline | Werkstoffwissenschaften / Fertigungstechnik |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03932cam a2200577Ma 4500</leader><controlfield tag="001">ZDB-4-EBA-ocn646817910</controlfield><controlfield tag="003">OCoLC</controlfield><controlfield tag="005">20240705115654.0</controlfield><controlfield tag="006">m o d </controlfield><controlfield tag="007">cr cn|||||||||</controlfield><controlfield tag="008">010221s2001 ohua ob 000 0 eng d</controlfield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">E7B</subfield><subfield code="b">eng</subfield><subfield code="e">pn</subfield><subfield code="c">E7B</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">YDXCP</subfield><subfield code="d">N$T</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCF</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">AU@</subfield><subfield code="d">EBLCP</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">AZK</subfield><subfield code="d">LOA</subfield><subfield code="d">JBG</subfield><subfield code="d">AGLDB</subfield><subfield code="d">MOR</subfield><subfield code="d">PIFAG</subfield><subfield code="d">ZCU</subfield><subfield code="d">MERUC</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">U3W</subfield><subfield code="d">STF</subfield><subfield code="d">WRM</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">VTS</subfield><subfield code="d">NRAMU</subfield><subfield code="d">ICG</subfield><subfield code="d">INT</subfield><subfield code="d">VT2</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">DKC</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">M8D</subfield><subfield code="d">HS0</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">UKCRE</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">YDX</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCL</subfield></datafield><datafield tag="019" ind1=" " ind2=" "><subfield code="a">764525408</subfield><subfield code="a">780535954</subfield><subfield code="a">842279014</subfield><subfield code="a">961552499</subfield><subfield code="a">962606965</subfield><subfield code="a">966197629</subfield><subfield code="a">988510180</subfield><subfield code="a">992106626</subfield><subfield code="a">1037919722</subfield><subfield code="a">1038661387</subfield><subfield code="a">1045505252</subfield><subfield code="a">1055370405</subfield><subfield code="a">1058187407</subfield><subfield code="a">1081220471</subfield><subfield code="a">1153463670</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781615032242</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">161503224X</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">0871707314</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9780871707314</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">087170692X</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9780871706928</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)646817910</subfield><subfield code="z">(OCoLC)764525408</subfield><subfield code="z">(OCoLC)780535954</subfield><subfield code="z">(OCoLC)842279014</subfield><subfield code="z">(OCoLC)961552499</subfield><subfield code="z">(OCoLC)962606965</subfield><subfield code="z">(OCoLC)966197629</subfield><subfield code="z">(OCoLC)988510180</subfield><subfield code="z">(OCoLC)992106626</subfield><subfield code="z">(OCoLC)1037919722</subfield><subfield code="z">(OCoLC)1038661387</subfield><subfield code="z">(OCoLC)1045505252</subfield><subfield code="z">(OCoLC)1055370405</subfield><subfield code="z">(OCoLC)1058187407</subfield><subfield code="z">(OCoLC)1081220471</subfield><subfield code="z">(OCoLC)1153463670</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">TS695</subfield><subfield code="b">.C52 2001eb</subfield></datafield><datafield tag="072" ind1=" " ind2="7"><subfield code="a">TEC</subfield><subfield code="x">040000</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="082" ind1="7" ind2=" "><subfield code="a">671.7/35</subfield><subfield code="2">21</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">MAIN</subfield></datafield><datafield tag="245" ind1="0" ind2="0"><subfield code="a">Chemical vapor deposition /</subfield><subfield code="c">edited by Jong-Hee Park, T.S. Sudarshan.</subfield></datafield><datafield tag="260" ind1=" " ind2=" "><subfield code="a">Materials Park, Ohio :</subfield><subfield code="b">ASM International,</subfield><subfield code="c">2001.</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (vii, 481 pages :)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="347" ind1=" " ind2=" "><subfield code="a">data file</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Surface engineering series ;</subfield><subfield code="v">v. 2</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references.</subfield></datafield><datafield tag="588" ind1="0" ind2=" "><subfield code="a">Print version record.</subfield></datafield><datafield tag="505" ind1="0" ind2="0"><subfield code="g">Ch. 1.</subfield><subfield code="t">Introduction to Chemical Vapor Deposition (CVD) /</subfield><subfield code="r">J.R. Creighton and P. Ho --</subfield><subfield code="g">Ch. 2.</subfield><subfield code="t">Basic Principles of CVD Thermodynamics and Kinetics /</subfield><subfield code="r">A.K. Pattanaik and V.K. Sarin --</subfield><subfield code="g">Ch. 3.</subfield><subfield code="t">Stresses and Mechanical Stability of CVD Thin Films /</subfield><subfield code="r">M. Ignat --</subfield><subfield code="g">Ch. 4.</subfield><subfield code="t">Combustion Chemical Vapor Deposition (CCVD) /</subfield><subfield code="r">A.T. Hunt and Matthias Pohl --</subfield><subfield code="g">Ch. 5.</subfield><subfield code="t">Polarized Electrochemical Vapor Deposition /</subfield><subfield code="r">Eric Z. Tang, Thomas H. Etsell and Douglas G. Ivey --</subfield><subfield code="g">Ch. 6.</subfield><subfield code="t">Chemical Vapor Infiltration: Optimization of Processing Conditions /</subfield><subfield code="r">S.K. Griffiths and Robert H. Nilson --</subfield><subfield code="g">Ch. 7.</subfield><subfield code="t">Metal-Organic Chemical Vapor Deposition of High Dielectric (Ba, Sr) TiO[subscript 3] Thin Films for Dynamic Random Access Memory Applications /</subfield><subfield code="r">C.S. Hwang and H.-I. Yoo.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Vapor-plating.</subfield><subfield code="0">http://id.loc.gov/authorities/subjects/sh85142069</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Refractory coating.</subfield><subfield code="0">http://id.loc.gov/authorities/subjects/sh85112268</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Revêtement réfractaire.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING</subfield><subfield code="x">Technical & Manufacturing Industries & Trades.</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Refractory coating</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Vapor-plating</subfield><subfield code="2">fast</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Park, Jong-Hee,</subfield><subfield code="d">1951-</subfield><subfield code="1">https://id.oclc.org/worldcat/entity/E39PCjvXWvfDVQDTypWtCMCDG3</subfield><subfield code="0">http://id.loc.gov/authorities/names/n88621361</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Sudarshan, T. S.,</subfield><subfield code="d">1955-</subfield><subfield code="1">https://id.oclc.org/worldcat/entity/E39PCjF43j4Q9wVtw4w6gmgRJC</subfield><subfield code="0">http://id.loc.gov/authorities/names/n88199059</subfield></datafield><datafield tag="758" ind1=" " ind2=" "><subfield code="i">has work:</subfield><subfield code="a">Chemical vapor deposition (Text)</subfield><subfield code="1">https://id.oclc.org/worldcat/entity/E39PCGJRt74g8hRKRyvxcPGT73</subfield><subfield code="4">https://id.oclc.org/worldcat/ontology/hasWork</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Print version:</subfield><subfield code="t">Chemical vapor deposition.</subfield><subfield code="d">Materials Park, Ohio : ASM International, 2001</subfield><subfield code="w">(DLC) 2001022339</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Surface engineering series ;</subfield><subfield code="v">v. 2.</subfield><subfield code="0">http://id.loc.gov/authorities/names/no99036709</subfield></datafield><datafield tag="856" ind1="1" ind2=" "><subfield code="l">FWS01</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FWS_PDA_EBA</subfield><subfield code="u">https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395831</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="856" ind1="1" ind2=" "><subfield code="l">CBO01</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FWS_PDA_EBA</subfield><subfield code="u">https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395831</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">ebrary</subfield><subfield code="b">EBRY</subfield><subfield code="n">ebr10323519</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">EBSCOhost</subfield><subfield code="b">EBSC</subfield><subfield code="n">395831</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">YBP Library Services</subfield><subfield code="b">YANK</subfield><subfield code="n">3623593</subfield></datafield><datafield tag="994" ind1=" " ind2=" "><subfield code="a">92</subfield><subfield code="b">GEBAY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-EBA</subfield></datafield></record></collection> |
id | ZDB-4-EBA-ocn646817910 |
illustrated | Illustrated |
indexdate | 2024-10-25T16:17:37Z |
institution | BVB |
isbn | 9781615032242 161503224X |
language | English |
oclc_num | 646817910 |
open_access_boolean | |
owner | MAIN |
owner_facet | MAIN |
physical | 1 online resource (vii, 481 pages :) |
psigel | ZDB-4-EBA |
publishDate | 2001 |
publishDateSearch | 2001 |
publishDateSort | 2001 |
publisher | ASM International, |
record_format | marc |
series | Surface engineering series ; |
series2 | Surface engineering series ; |
spelling | Chemical vapor deposition / edited by Jong-Hee Park, T.S. Sudarshan. Materials Park, Ohio : ASM International, 2001. 1 online resource (vii, 481 pages :) text txt rdacontent computer c rdamedia online resource cr rdacarrier data file Surface engineering series ; v. 2 Includes bibliographical references. Print version record. Ch. 1. Introduction to Chemical Vapor Deposition (CVD) / J.R. Creighton and P. Ho -- Ch. 2. Basic Principles of CVD Thermodynamics and Kinetics / A.K. Pattanaik and V.K. Sarin -- Ch. 3. Stresses and Mechanical Stability of CVD Thin Films / M. Ignat -- Ch. 4. Combustion Chemical Vapor Deposition (CCVD) / A.T. Hunt and Matthias Pohl -- Ch. 5. Polarized Electrochemical Vapor Deposition / Eric Z. Tang, Thomas H. Etsell and Douglas G. Ivey -- Ch. 6. Chemical Vapor Infiltration: Optimization of Processing Conditions / S.K. Griffiths and Robert H. Nilson -- Ch. 7. Metal-Organic Chemical Vapor Deposition of High Dielectric (Ba, Sr) TiO[subscript 3] Thin Films for Dynamic Random Access Memory Applications / C.S. Hwang and H.-I. Yoo. Vapor-plating. http://id.loc.gov/authorities/subjects/sh85142069 Refractory coating. http://id.loc.gov/authorities/subjects/sh85112268 Revêtement réfractaire. TECHNOLOGY & ENGINEERING Technical & Manufacturing Industries & Trades. bisacsh Refractory coating fast Vapor-plating fast Park, Jong-Hee, 1951- https://id.oclc.org/worldcat/entity/E39PCjvXWvfDVQDTypWtCMCDG3 http://id.loc.gov/authorities/names/n88621361 Sudarshan, T. S., 1955- https://id.oclc.org/worldcat/entity/E39PCjF43j4Q9wVtw4w6gmgRJC http://id.loc.gov/authorities/names/n88199059 has work: Chemical vapor deposition (Text) https://id.oclc.org/worldcat/entity/E39PCGJRt74g8hRKRyvxcPGT73 https://id.oclc.org/worldcat/ontology/hasWork Print version: Chemical vapor deposition. Materials Park, Ohio : ASM International, 2001 (DLC) 2001022339 Surface engineering series ; v. 2. http://id.loc.gov/authorities/names/no99036709 FWS01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395831 Volltext CBO01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395831 Volltext |
spellingShingle | Chemical vapor deposition / Surface engineering series ; Introduction to Chemical Vapor Deposition (CVD) / Basic Principles of CVD Thermodynamics and Kinetics / Stresses and Mechanical Stability of CVD Thin Films / Combustion Chemical Vapor Deposition (CCVD) / Polarized Electrochemical Vapor Deposition / Chemical Vapor Infiltration: Optimization of Processing Conditions / Metal-Organic Chemical Vapor Deposition of High Dielectric (Ba, Sr) TiO[subscript 3] Thin Films for Dynamic Random Access Memory Applications / Vapor-plating. http://id.loc.gov/authorities/subjects/sh85142069 Refractory coating. http://id.loc.gov/authorities/subjects/sh85112268 Revêtement réfractaire. TECHNOLOGY & ENGINEERING Technical & Manufacturing Industries & Trades. bisacsh Refractory coating fast Vapor-plating fast |
subject_GND | http://id.loc.gov/authorities/subjects/sh85142069 http://id.loc.gov/authorities/subjects/sh85112268 |
title | Chemical vapor deposition / |
title_alt | Introduction to Chemical Vapor Deposition (CVD) / Basic Principles of CVD Thermodynamics and Kinetics / Stresses and Mechanical Stability of CVD Thin Films / Combustion Chemical Vapor Deposition (CCVD) / Polarized Electrochemical Vapor Deposition / Chemical Vapor Infiltration: Optimization of Processing Conditions / Metal-Organic Chemical Vapor Deposition of High Dielectric (Ba, Sr) TiO[subscript 3] Thin Films for Dynamic Random Access Memory Applications / |
title_auth | Chemical vapor deposition / |
title_exact_search | Chemical vapor deposition / |
title_full | Chemical vapor deposition / edited by Jong-Hee Park, T.S. Sudarshan. |
title_fullStr | Chemical vapor deposition / edited by Jong-Hee Park, T.S. Sudarshan. |
title_full_unstemmed | Chemical vapor deposition / edited by Jong-Hee Park, T.S. Sudarshan. |
title_short | Chemical vapor deposition / |
title_sort | chemical vapor deposition |
topic | Vapor-plating. http://id.loc.gov/authorities/subjects/sh85142069 Refractory coating. http://id.loc.gov/authorities/subjects/sh85112268 Revêtement réfractaire. TECHNOLOGY & ENGINEERING Technical & Manufacturing Industries & Trades. bisacsh Refractory coating fast Vapor-plating fast |
topic_facet | Vapor-plating. Refractory coating. Revêtement réfractaire. TECHNOLOGY & ENGINEERING Technical & Manufacturing Industries & Trades. Refractory coating Vapor-plating |
url | https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395831 |
work_keys_str_mv | AT parkjonghee chemicalvapordeposition AT sudarshants chemicalvapordeposition |