Integrated interconnect technologies for 3D nanoelectronic systems /:
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.
Gespeichert in:
| Weitere Verfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, Mass. ; London :
Artech House,
©2009.
|
| Schriftenreihe: | Artech House integrated microsystems series.
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Zusammenfassung: | This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. |
| Beschreibung: | 1 online resource (xx, 528 pages) : illustrations |
| Bibliographie: | Includes bibliographical references and index. |
| ISBN: | 9781596932470 1596932473 |
Internformat
MARC
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| 245 | 0 | 0 | |a Integrated interconnect technologies for 3D nanoelectronic systems / |c Muhannad S. Bakir, James D. Meindl, editors. |
| 260 | |a Boston, Mass. ; |a London : |b Artech House, |c ©2009. | ||
| 300 | |a 1 online resource (xx, 528 pages) : |b illustrations | ||
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| 505 | 0 | |a Integrated Interconnect Technologies for 3D Nanoelectronic Systems; Contents; Foreword; Preface; Chapter 1: Revolutionary Silicon AncillaryTechnologies for the Next Era of Gigascale Integration; Chapter 2: Chip-Package Interaction and Reliability Impact on Cu/Low-k Interconnects; Chapter 3: Mechanically Compliant I/O Interconnects and Packaging; Chapter 4: Power Delivery to Silicon; Chapter 5: On-Chip Power Supply Noise Modeling for Gigascale 2D and 3D Systems; Chapter 6: Off-Chip Signaling; Chapter 7: Optical Interconnects for Chip-to-Chip Signaling. | |
| 520 | |a This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. | ||
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| 650 | 7 | |a Nanoelectronics |2 fast | |
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Datensatz im Suchindex
| DE-BY-FWS_katkey | ZDB-4-EBA-ocn434509565 |
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| _version_ | 1816881696878886912 |
| adam_text | |
| any_adam_object | |
| author2 | Bakir, Muhannad S. Meindl, James D., 1933-2020 |
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| author_GND | http://id.loc.gov/authorities/names/nb2009002692 http://id.loc.gov/authorities/names/n92042806 |
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| author_sort | Bakir, Muhannad S. |
| building | Verbundindex |
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| callnumber-first | T - Technology |
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| callnumber-raw | TK7874.53 .I56 2009eb |
| callnumber-search | TK7874.53 .I56 2009eb |
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| callnumber-subject | TK - Electrical and Nuclear Engineering |
| collection | ZDB-4-EBA |
| contents | Integrated Interconnect Technologies for 3D Nanoelectronic Systems; Contents; Foreword; Preface; Chapter 1: Revolutionary Silicon AncillaryTechnologies for the Next Era of Gigascale Integration; Chapter 2: Chip-Package Interaction and Reliability Impact on Cu/Low-k Interconnects; Chapter 3: Mechanically Compliant I/O Interconnects and Packaging; Chapter 4: Power Delivery to Silicon; Chapter 5: On-Chip Power Supply Noise Modeling for Gigascale 2D and 3D Systems; Chapter 6: Off-Chip Signaling; Chapter 7: Optical Interconnects for Chip-to-Chip Signaling. |
| ctrlnum | (OCoLC)434509565 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | ZDB-4-EBA-ocn434509565 |
| illustrated | Illustrated |
| indexdate | 2024-11-27T13:16:50Z |
| institution | BVB |
| isbn | 9781596932470 1596932473 |
| language | English |
| oclc_num | 434509565 |
| open_access_boolean | |
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| physical | 1 online resource (xx, 528 pages) : illustrations |
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| publishDateSearch | 2009 |
| publishDateSort | 2009 |
| publisher | Artech House, |
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| series | Artech House integrated microsystems series. |
| series2 | Artech House integrated microsystems series |
| spelling | Integrated interconnect technologies for 3D nanoelectronic systems / Muhannad S. Bakir, James D. Meindl, editors. Boston, Mass. ; London : Artech House, ©2009. 1 online resource (xx, 528 pages) : illustrations text txt rdacontent computer c rdamedia online resource cr rdacarrier Artech House integrated microsystems series Includes bibliographical references and index. Print version record. Integrated Interconnect Technologies for 3D Nanoelectronic Systems; Contents; Foreword; Preface; Chapter 1: Revolutionary Silicon AncillaryTechnologies for the Next Era of Gigascale Integration; Chapter 2: Chip-Package Interaction and Reliability Impact on Cu/Low-k Interconnects; Chapter 3: Mechanically Compliant I/O Interconnects and Packaging; Chapter 4: Power Delivery to Silicon; Chapter 5: On-Chip Power Supply Noise Modeling for Gigascale 2D and 3D Systems; Chapter 6: Off-Chip Signaling; Chapter 7: Optical Interconnects for Chip-to-Chip Signaling. This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. Interconnects (Integrated circuit technology) http://id.loc.gov/authorities/subjects/sh2002000566 Telecommunication systems. http://id.loc.gov/authorities/subjects/sh85133301 Nanoelectronics. http://id.loc.gov/authorities/subjects/sh2006009047 Interconnexions (Technologie des circuits intégrés) Systèmes de télécommunications. Nanoélectronique. telecommunication systems. aat TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh Interconnects (Integrated circuit technology) fast Nanoelectronics fast Telecommunication systems fast Bakir, Muhannad S. http://id.loc.gov/authorities/names/nb2009002692 Meindl, James D., 1933-2020. https://id.oclc.org/worldcat/entity/E39PBJmDhdKghPwBg6Xrj44H4q http://id.loc.gov/authorities/names/n92042806 has work: Integrated interconnect technologies for 3D nanoelectronic systems (Text) https://id.oclc.org/worldcat/entity/E39PCFrwYbw3PjQQVPpYc6vQG3 https://id.oclc.org/worldcat/ontology/hasWork Print version: Integrated interconnect technologies for 3D nanoelectronic systems. Boston, Mass. ; London : Artech House, ©2009 9781596932463 1596932465 (OCoLC)302063121 Artech House integrated microsystems series. http://id.loc.gov/authorities/names/nr2006021495 FWS01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=284231 Volltext |
| spellingShingle | Integrated interconnect technologies for 3D nanoelectronic systems / Artech House integrated microsystems series. Integrated Interconnect Technologies for 3D Nanoelectronic Systems; Contents; Foreword; Preface; Chapter 1: Revolutionary Silicon AncillaryTechnologies for the Next Era of Gigascale Integration; Chapter 2: Chip-Package Interaction and Reliability Impact on Cu/Low-k Interconnects; Chapter 3: Mechanically Compliant I/O Interconnects and Packaging; Chapter 4: Power Delivery to Silicon; Chapter 5: On-Chip Power Supply Noise Modeling for Gigascale 2D and 3D Systems; Chapter 6: Off-Chip Signaling; Chapter 7: Optical Interconnects for Chip-to-Chip Signaling. Interconnects (Integrated circuit technology) http://id.loc.gov/authorities/subjects/sh2002000566 Telecommunication systems. http://id.loc.gov/authorities/subjects/sh85133301 Nanoelectronics. http://id.loc.gov/authorities/subjects/sh2006009047 Interconnexions (Technologie des circuits intégrés) Systèmes de télécommunications. Nanoélectronique. telecommunication systems. aat TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh Interconnects (Integrated circuit technology) fast Nanoelectronics fast Telecommunication systems fast |
| subject_GND | http://id.loc.gov/authorities/subjects/sh2002000566 http://id.loc.gov/authorities/subjects/sh85133301 http://id.loc.gov/authorities/subjects/sh2006009047 |
| title | Integrated interconnect technologies for 3D nanoelectronic systems / |
| title_auth | Integrated interconnect technologies for 3D nanoelectronic systems / |
| title_exact_search | Integrated interconnect technologies for 3D nanoelectronic systems / |
| title_full | Integrated interconnect technologies for 3D nanoelectronic systems / Muhannad S. Bakir, James D. Meindl, editors. |
| title_fullStr | Integrated interconnect technologies for 3D nanoelectronic systems / Muhannad S. Bakir, James D. Meindl, editors. |
| title_full_unstemmed | Integrated interconnect technologies for 3D nanoelectronic systems / Muhannad S. Bakir, James D. Meindl, editors. |
| title_short | Integrated interconnect technologies for 3D nanoelectronic systems / |
| title_sort | integrated interconnect technologies for 3d nanoelectronic systems |
| topic | Interconnects (Integrated circuit technology) http://id.loc.gov/authorities/subjects/sh2002000566 Telecommunication systems. http://id.loc.gov/authorities/subjects/sh85133301 Nanoelectronics. http://id.loc.gov/authorities/subjects/sh2006009047 Interconnexions (Technologie des circuits intégrés) Systèmes de télécommunications. Nanoélectronique. telecommunication systems. aat TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh Interconnects (Integrated circuit technology) fast Nanoelectronics fast Telecommunication systems fast |
| topic_facet | Interconnects (Integrated circuit technology) Telecommunication systems. Nanoelectronics. Interconnexions (Technologie des circuits intégrés) Systèmes de télécommunications. Nanoélectronique. telecommunication systems. TECHNOLOGY & ENGINEERING Electronics Microelectronics. TECHNOLOGY & ENGINEERING Electronics Digital. Nanoelectronics Telecommunication systems |
| url | https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=284231 |
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