Adaptive cooling of integrated circuits using digital microfluidics /:

Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power diss...

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Bibliographische Detailangaben
1. Verfasser: Paik, Philip Y.
Weitere Verfasser: Chakrabarty, Krishnendu, Pamula, Vamsee K.
Format: Elektronisch E-Book
Sprache:English
Veröffentlicht: Norwood, Mass. : Artech House, ©2007.
Schriftenreihe:Artech House integrated microsystems series.
Schlagworte:
Online-Zugang:Volltext
Zusammenfassung:Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling.
Beschreibung:1 online resource (203 pages) : illustrations
Format:Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.
Bibliographie:Includes bibliographical references and index.
ISBN:9781596931398
1596931396

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