Rapid thermal processing for future semiconductor devices :: proceedings of the 2001 International Conference on Rapid Thermal Processing for Future Semiconductor Devices (RTP 2001), held at Ise-Shima, Mie, Japan, November 14-16, 2001 /

This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokk...

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Bibliographic Details
Corporate Author: International Conference on Rapid Thermal Processing for Future Semiconductor Devices Ise-Shima, Mie, Japan
Other Authors: Fukuda, Hisashi
Format: Electronic Conference Proceeding eBook
Language:English
Published: Amsterdam ; London : Elsevier, 2003.
Subjects:
Online Access:DE-862
DE-863
DE-862
DE-863
Summary:This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices. This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.
Physical Description:1 online resource (x, 150 pages :)
Bibliography:Includes bibliographical references.
ISBN:9780444513397
0444513396
9780080540269
0080540260

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