Reflow soldering processes :: SMT, BGA, CSP and flip chip technologies /
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared towa...
Gespeichert in:
| 1. Verfasser: | |
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston :
Newnes,
©2002.
|
| Schlagworte: | |
| Online-Zugang: | Volltext Volltext |
| Zusammenfassung: | Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process. |
| Beschreibung: | 1 online resource (ix, 270 pages) : illustrations |
| Format: | Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. |
| Bibliographie: | Includes bibliographical references and index. |
| ISBN: | 9780080492247 008049224X |
Internformat
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| 245 | 1 | 0 | |a Reflow soldering processes : |b SMT, BGA, CSP and flip chip technologies / |c Ning-Cheng Lee. |
| 260 | |a Boston : |b Newnes, |c ©2002. | ||
| 300 | |a 1 online resource (ix, 270 pages) : |b illustrations | ||
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| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 505 | 0 | |a Introduction to Surface Mount Electronic Packaging Technology; Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering); Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology); Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing); SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack); SMT Problems During Reflow; SMT Problems After Reflow; BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping; BGA and CSP Board Level Assembly (including ; Problems Occurred at Assembly Stage and Rework); BGA and CSP Rework; Flip Chip Reflow Soldering; Optimizing Reflow Profile via Defect Mechanisms Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or Fluxes; Conclusions; Appendix; References; Index. | |
| 506 | |3 Use copy |f Restrictions unspecified |2 star |5 MiAaHDL | ||
| 520 | |a Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process. | ||
| 533 | |a Electronic reproduction. |b [Place of publication not identified] : |c HathiTrust Digital Library, |d 2010. |5 MiAaHDL | ||
| 538 | |a Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. |u http://purl.oclc.org/DLF/benchrepro0212 |5 MiAaHDL | ||
| 583 | 1 | |a digitized |c 2010 |h HathiTrust Digital Library |l committed to preserve |2 pda |5 MiAaHDL | |
| 650 | 0 | |a Electronic apparatus and appliances |x Design and construction. |0 http://id.loc.gov/authorities/subjects/sh85042256 | |
| 650 | 0 | |a Solder and soldering. |0 http://id.loc.gov/authorities/subjects/sh85124553 | |
| 650 | 0 | |a Electronic packaging. |0 http://id.loc.gov/authorities/subjects/sh85042366 | |
| 650 | 0 | |a Electric connectors. |0 http://id.loc.gov/authorities/subjects/sh85041625 | |
| 650 | 6 | |a Appareils électroniques |x Conception et construction. | |
| 650 | 6 | |a Soudure. | |
| 650 | 6 | |a Mise sous boîtier (Électronique) | |
| 650 | 7 | |a solder. |2 aat | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Microelectronics. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Digital. |2 bisacsh | |
| 650 | 7 | |a Electric connectors |2 fast | |
| 650 | 7 | |a Electronic apparatus and appliances |x Design and construction |2 fast | |
| 650 | 7 | |a Electronic packaging |2 fast | |
| 650 | 7 | |a Solder and soldering |2 fast | |
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| author | Lee, Ning-Cheng |
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| contents | Introduction to Surface Mount Electronic Packaging Technology; Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering); Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology); Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing); SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack); SMT Problems During Reflow; SMT Problems After Reflow; BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping; BGA and CSP Board Level Assembly (including ; Problems Occurred at Assembly Stage and Rework); BGA and CSP Rework; Flip Chip Reflow Soldering; Optimizing Reflow Profile via Defect Mechanisms Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or Fluxes; Conclusions; Appendix; References; Index. |
| ctrlnum | (OCoLC)159936926 |
| dewey-full | 621.381/046 |
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| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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ind2=" "><subfield code="a">Introduction to Surface Mount Electronic Packaging Technology; Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering); Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology); Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing); SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack); SMT Problems During Reflow; SMT Problems After Reflow; BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping; BGA and CSP Board Level Assembly (including ; Problems Occurred at Assembly Stage and Rework); BGA and CSP Rework; Flip Chip Reflow Soldering; Optimizing Reflow Profile via Defect Mechanisms Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or Fluxes; Conclusions; Appendix; References; Index.</subfield></datafield><datafield tag="506" ind1=" " ind2=" "><subfield code="3">Use copy</subfield><subfield code="f">Restrictions unspecified</subfield><subfield code="2">star</subfield><subfield code="5">MiAaHDL</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. 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| id | ZDB-4-EBA-ocn159936926 |
| illustrated | Illustrated |
| indexdate | 2024-11-27T13:16:05Z |
| institution | BVB |
| isbn | 9780080492247 008049224X |
| language | English |
| oclc_num | 159936926 |
| open_access_boolean | |
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| owner_facet | MAIN DE-863 DE-BY-FWS |
| physical | 1 online resource (ix, 270 pages) : illustrations |
| psigel | ZDB-4-EBA |
| publishDate | 2002 |
| publishDateSearch | 2002 |
| publishDateSort | 2002 |
| publisher | Newnes, |
| record_format | marc |
| spelling | Lee, Ning-Cheng. https://id.oclc.org/worldcat/entity/E39PCjtrxKtJRPbtHm8G6dTdV3 http://id.loc.gov/authorities/names/n2001005642 Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee. Boston : Newnes, ©2002. 1 online resource (ix, 270 pages) : illustrations text txt rdacontent computer c rdamedia online resource cr rdacarrier Includes bibliographical references and index. Print version record. Introduction to Surface Mount Electronic Packaging Technology; Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering); Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology); Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing); SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack); SMT Problems During Reflow; SMT Problems After Reflow; BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping; BGA and CSP Board Level Assembly (including ; Problems Occurred at Assembly Stage and Rework); BGA and CSP Rework; Flip Chip Reflow Soldering; Optimizing Reflow Profile via Defect Mechanisms Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or Fluxes; Conclusions; Appendix; References; Index. Use copy Restrictions unspecified star MiAaHDL Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process. Electronic reproduction. [Place of publication not identified] : HathiTrust Digital Library, 2010. MiAaHDL Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. http://purl.oclc.org/DLF/benchrepro0212 MiAaHDL digitized 2010 HathiTrust Digital Library committed to preserve pda MiAaHDL Electronic apparatus and appliances Design and construction. http://id.loc.gov/authorities/subjects/sh85042256 Solder and soldering. http://id.loc.gov/authorities/subjects/sh85124553 Electronic packaging. http://id.loc.gov/authorities/subjects/sh85042366 Electric connectors. http://id.loc.gov/authorities/subjects/sh85041625 Appareils électroniques Conception et construction. Soudure. Mise sous boîtier (Électronique) solder. aat TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh Electric connectors fast Electronic apparatus and appliances Design and construction fast Electronic packaging fast Solder and soldering fast has work: Reflow soldering processes (Text) https://id.oclc.org/worldcat/entity/E39PCFVjQrQgmQxbCkHMf3rPBd https://id.oclc.org/worldcat/ontology/hasWork Print version: Lee, Ning-Cheng. Reflow soldering processes. Boston : Newnes, ©2002 0750672188 9780750672184 (DLC) 2001031713 (OCoLC)46929244 FWS01 ZDB-4-EBA FWS_PDA_EBA https://www.sciencedirect.com/science/book/9780750672184 Volltext FWS01 ZDB-4-EBA FWS_PDA_EBA https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=195116 Volltext |
| spellingShingle | Lee, Ning-Cheng Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Introduction to Surface Mount Electronic Packaging Technology; Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering); Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology); Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing); SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack); SMT Problems During Reflow; SMT Problems After Reflow; BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping; BGA and CSP Board Level Assembly (including ; Problems Occurred at Assembly Stage and Rework); BGA and CSP Rework; Flip Chip Reflow Soldering; Optimizing Reflow Profile via Defect Mechanisms Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or Fluxes; Conclusions; Appendix; References; Index. Electronic apparatus and appliances Design and construction. http://id.loc.gov/authorities/subjects/sh85042256 Solder and soldering. http://id.loc.gov/authorities/subjects/sh85124553 Electronic packaging. http://id.loc.gov/authorities/subjects/sh85042366 Electric connectors. http://id.loc.gov/authorities/subjects/sh85041625 Appareils électroniques Conception et construction. Soudure. Mise sous boîtier (Électronique) solder. aat TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh Electric connectors fast Electronic apparatus and appliances Design and construction fast Electronic packaging fast Solder and soldering fast |
| subject_GND | http://id.loc.gov/authorities/subjects/sh85042256 http://id.loc.gov/authorities/subjects/sh85124553 http://id.loc.gov/authorities/subjects/sh85042366 http://id.loc.gov/authorities/subjects/sh85041625 |
| title | Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / |
| title_auth | Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / |
| title_exact_search | Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / |
| title_full | Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee. |
| title_fullStr | Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee. |
| title_full_unstemmed | Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee. |
| title_short | Reflow soldering processes : |
| title_sort | reflow soldering processes smt bga csp and flip chip technologies |
| title_sub | SMT, BGA, CSP and flip chip technologies / |
| topic | Electronic apparatus and appliances Design and construction. http://id.loc.gov/authorities/subjects/sh85042256 Solder and soldering. http://id.loc.gov/authorities/subjects/sh85124553 Electronic packaging. http://id.loc.gov/authorities/subjects/sh85042366 Electric connectors. http://id.loc.gov/authorities/subjects/sh85041625 Appareils électroniques Conception et construction. Soudure. Mise sous boîtier (Électronique) solder. aat TECHNOLOGY & ENGINEERING Electronics Microelectronics. bisacsh TECHNOLOGY & ENGINEERING Electronics Digital. bisacsh Electric connectors fast Electronic apparatus and appliances Design and construction fast Electronic packaging fast Solder and soldering fast |
| topic_facet | Electronic apparatus and appliances Design and construction. Solder and soldering. Electronic packaging. Electric connectors. Appareils électroniques Conception et construction. Soudure. Mise sous boîtier (Électronique) solder. TECHNOLOGY & ENGINEERING Electronics Microelectronics. TECHNOLOGY & ENGINEERING Electronics Digital. Electric connectors Electronic apparatus and appliances Design and construction Electronic packaging Solder and soldering |
| url | https://www.sciencedirect.com/science/book/9780750672184 https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=195116 |
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