Holdings: Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing

Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing:

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Bibliographic Details
Main Author:	Olsen, Ejvind (Author)
Format:	Thesis Electronic eBook
Language:	English
Published:	Garbsen TEWISS - Technik und Wissen GmbH 2024
Subjects:	Kupfer Mehrschichtsystem multilayer printing copper ink vertical interconnect accesses laser material processing multilayer circuit carrier sintering cleaning ablation Hochschulschrift
Online Access:	DE-863 DE-862 DE-523
Physical Description:	1 Online-Ressource (XVI, 175 Seiten)
ISBN:	9783690300124

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physical	1 Online-Ressource (XVI, 175 Seiten)
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record_format	marc
spellingShingle	Olsen, Ejvind Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing 4\p Kupfer (DE-588)4033734-0 gnd 5\p Mehrschichtsystem (DE-588)4244347-7 gnd
subject_GND	(DE-588)4033734-0 (DE-588)4244347-7 (DE-588)4113937-9
title	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing
title_auth	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing
title_exact_search	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing
title_full	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing Ejvind Olsen
title_fullStr	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing Ejvind Olsen
title_full_unstemmed	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing Ejvind Olsen
title_short	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing
title_sort	printing copper multilayers with vias on 3d surfaces using laser material processing
topic	4\p Kupfer (DE-588)4033734-0 gnd 5\p Mehrschichtsystem (DE-588)4244347-7 gnd
topic_facet	Kupfer Mehrschichtsystem Hochschulschrift
work_keys_str_mv	AT olsenejvind printingcoppermultilayerswithviason3dsurfacesusinglasermaterialprocessing AT tewisstechnikundwissengmbh printingcoppermultilayerswithviason3dsurfacesusinglasermaterialprocessing

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