Verfügbarkeit: Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing

Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing:

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Bibliographische Detailangaben
1. Verfasser:	Olsen, Ejvind (VerfasserIn)
Format:	Abschlussarbeit Elektronisch E-Book
Sprache:	English
Veröffentlicht:	Garbsen TEWISS - Technik und Wissen GmbH 2024
Schlagworte:	Kupfer Mehrschichtsystem multilayer printing copper ink vertical interconnect accesses laser material processing multilayer circuit carrier sintering cleaning ablation Hochschulschrift
Online-Zugang:	DE-523
Beschreibung:	1 Online-Ressource (XVI, 175 Seiten)
ISBN:	9783690300124

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spelling	Olsen, Ejvind Verfasser aut Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing Ejvind Olsen Garbsen TEWISS - Technik und Wissen GmbH 2024 1 Online-Ressource (XVI, 175 Seiten) txt rdacontent c rdamedia cr rdacarrier Dissertation Gottfried Wilhelm Leibniz Universität Hannover 2024 4\p Kupfer (DE-588)4033734-0 gnd 5\p Mehrschichtsystem (DE-588)4244347-7 gnd multilayer printing copper ink vertical interconnect accesses laser material processing multilayer circuit carrier sintering cleaning ablation (DE-588)4113937-9 Hochschulschrift gnd-content TEWISS - Technik und Wissen GmbH (DE-588)1067143165 pbl Erscheint auch als Druck-Ausgabe 978-3-69030-012-4 1\p emakn 0,05237 20241217 DE-101 https://d-nb.info/provenance/plan#emakn 2\p emasg 0,40378 20241217 DE-101 https://d-nb.info/provenance/plan#emasg 3\p npi 20241216 DE-101 https://d-nb.info/provenance/plan#npi 4\p emagnd 0,21876 20241217 DE-101 https://d-nb.info/provenance/plan#emagnd 5\p emagnd 0,06305 20241217 DE-101 https://d-nb.info/provenance/plan#emagnd
spellingShingle	Olsen, Ejvind Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing 4\p Kupfer (DE-588)4033734-0 gnd 5\p Mehrschichtsystem (DE-588)4244347-7 gnd
subject_GND	(DE-588)4033734-0 (DE-588)4244347-7 (DE-588)4113937-9
title	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing
title_auth	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing
title_exact_search	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing
title_full	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing Ejvind Olsen
title_fullStr	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing Ejvind Olsen
title_full_unstemmed	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing Ejvind Olsen
title_short	Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing
title_sort	printing copper multilayers with vias on 3d surfaces using laser material processing
topic	4\p Kupfer (DE-588)4033734-0 gnd 5\p Mehrschichtsystem (DE-588)4244347-7 gnd
topic_facet	Kupfer Mehrschichtsystem Hochschulschrift
work_keys_str_mv	AT olsenejvind printingcoppermultilayerswithviason3dsurfacesusinglasermaterialprocessing AT tewisstechnikundwissengmbh printingcoppermultilayerswithviason3dsurfacesusinglasermaterialprocessing

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