APA (7th ed.) Citation

Olsen, E. (2024). Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing. TEWISS - Technik und Wissen GmbH.

Chicago Style (17th ed.) Citation

Olsen, Ejvind. Printing Copper Multilayers with VIAs on 3D Surfaces Using Laser Material Processing. Garbsen: TEWISS - Technik und Wissen GmbH, 2024.

MLA (9th ed.) Citation

Olsen, Ejvind. Printing Copper Multilayers with VIAs on 3D Surfaces Using Laser Material Processing. TEWISS - Technik und Wissen GmbH, 2024.

Warning: These citations may not always be 100% accurate.