Micromechanical studies of interface properties in on-chip interconnect structures:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Weitere Verfasser: | |
| Format: | Abschlussarbeit Buch |
| Sprache: | English |
| Veröffentlicht: |
Stuttgart
Fraunhofer Verlag
2024
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| Schriftenreihe: | Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics
5 |
| Schlagworte: | |
| Online-Zugang: | Inhaltstext |
| Beschreibung: | 132 Seiten num., mostly col. illus. and tab 21 cm x 14.8 cm |
| ISBN: | 9783839620311 3839620317 |
Internformat
MARC
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| 245 | 1 | 0 | |a Micromechanical studies of interface properties in on-chip interconnect structures |c Wieland Heyn |
| 263 | |a 202411 | ||
| 264 | 1 | |a Stuttgart |b Fraunhofer Verlag |c 2024 | |
| 300 | |a 132 Seiten |b num., mostly col. illus. and tab |c 21 cm x 14.8 cm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics |v 5 | |
| 502 | |b Dissertation |c Technische Universität Dresden |d 2024 | ||
| 653 | |a material science | ||
| 653 | |a microelectronics | ||
| 653 | |a applied sciences | ||
| 653 | |a Elektroingenieure, Mikroelektronikingenieure, Materialwissenschaftler | ||
| 655 | 7 | |0 (DE-588)4113937-9 |a Hochschulschrift |2 gnd-content | |
| 700 | 1 | |a Michaelis, Alexander |4 edt | |
| 710 | 2 | |a Fraunhofer-Institut für Keramische Technologien und Systeme |0 (DE-588)6064165-4 |4 isb | |
| 710 | 2 | |a Fraunhofer IRB-Verlag |0 (DE-588)4786605-6 |4 pbl | |
| 810 | 2 | |a Publication series competencies in ceramics and materials diagnostics |t Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik |v 5 |w (DE-604)BV048394708 |9 5 | |
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Datensatz im Suchindex
| _version_ | 1820693314870968320 |
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| adam_text | |
| any_adam_object | |
| author | Heyn, Wieland |
| author2 | Michaelis, Alexander |
| author2_role | edt |
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| author_facet | Heyn, Wieland Michaelis, Alexander |
| author_role | aut |
| author_sort | Heyn, Wieland |
| author_variant | w h wh |
| building | Verbundindex |
| bvnumber | BV050112670 |
| ctrlnum | (DE-599)DNB1348171251 |
| format | Thesis Book |
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| illustrated | Illustrated |
| indexdate | 2025-01-08T15:00:52Z |
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| isbn | 9783839620311 3839620317 |
| language | English |
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| physical | 132 Seiten num., mostly col. illus. and tab 21 cm x 14.8 cm |
| publishDate | 2024 |
| publishDateSearch | 2024 |
| publishDateSort | 2024 |
| publisher | Fraunhofer Verlag |
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| series2 | Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics |
| spelling | Heyn, Wieland Verfasser aut Micromechanical studies of interface properties in on-chip interconnect structures Wieland Heyn 202411 Stuttgart Fraunhofer Verlag 2024 132 Seiten num., mostly col. illus. and tab 21 cm x 14.8 cm txt rdacontent n rdamedia nc rdacarrier Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics 5 Dissertation Technische Universität Dresden 2024 material science microelectronics applied sciences Elektroingenieure, Mikroelektronikingenieure, Materialwissenschaftler (DE-588)4113937-9 Hochschulschrift gnd-content Michaelis, Alexander edt Fraunhofer-Institut für Keramische Technologien und Systeme (DE-588)6064165-4 isb Fraunhofer IRB-Verlag (DE-588)4786605-6 pbl Publication series competencies in ceramics and materials diagnostics Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik 5 (DE-604)BV048394708 5 X:MVB text/html http://deposit.dnb.de/cgi-bin/dokserv?id=cee76f0720544f8690a40e39a8b91fd7&prov=M&dok_var=1&dok_ext=htm Inhaltstext 1\p vlb 20241113 DE-101 https://d-nb.info/provenance/plan#vlb |
| spellingShingle | Heyn, Wieland Micromechanical studies of interface properties in on-chip interconnect structures |
| subject_GND | (DE-588)4113937-9 |
| title | Micromechanical studies of interface properties in on-chip interconnect structures |
| title_auth | Micromechanical studies of interface properties in on-chip interconnect structures |
| title_exact_search | Micromechanical studies of interface properties in on-chip interconnect structures |
| title_full | Micromechanical studies of interface properties in on-chip interconnect structures Wieland Heyn |
| title_fullStr | Micromechanical studies of interface properties in on-chip interconnect structures Wieland Heyn |
| title_full_unstemmed | Micromechanical studies of interface properties in on-chip interconnect structures Wieland Heyn |
| title_short | Micromechanical studies of interface properties in on-chip interconnect structures |
| title_sort | micromechanical studies of interface properties in on chip interconnect structures |
| topic_facet | Hochschulschrift |
| url | http://deposit.dnb.de/cgi-bin/dokserv?id=cee76f0720544f8690a40e39a8b91fd7&prov=M&dok_var=1&dok_ext=htm |
| volume_link | (DE-604)BV048394708 |
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