Thermal management materials for electronic packaging: preparation, characterization, and devices
Gespeichert in:
| Weitere Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Weinheim, Germany
WILEY-VCH GmbH
[2024]
©2024 |
| Ausgabe: | First edition |
| Schlagworte: | |
| Online-Zugang: | DE-91 DE-703 URL des Erstveröffentlichers |
| Beschreibung: | Description based on print version record |
| Beschreibung: | 1 Online-Ressource (186 Seiten) Illustrationen |
| ISBN: | 9783527843121 9783527843114 9783527843107 |
| DOI: | 10.1002/9783527843121 |
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| format | Electronic eBook |
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| illustrated | Illustrated |
| indexdate | 2025-01-16T17:06:01Z |
| institution | BVB |
| isbn | 9783527843121 9783527843114 9783527843107 |
| language | English |
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| physical | 1 Online-Ressource (186 Seiten) Illustrationen |
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| spelling | Thermal management materials for electronic packaging preparation, characterization, and devices edited by Xingyou Tian Weinheim, Germany WILEY-VCH GmbH [2024] ©2024 1 Online-Ressource (186 Seiten) Illustrationen txt rdacontent c rdamedia cr rdacarrier Description based on print version record Materials science Wärmeleitfähigkeit (DE-588)4064191-0 gnd rswk-swf Halbleitergehäuse (DE-588)4143472-9 gnd rswk-swf Halbleitergehäuse (DE-588)4143472-9 s Wärmeleitfähigkeit (DE-588)4064191-0 s DE-604 Tian, Xingyou (DE-588)1318850258 edt Erscheint auch als Druck-Ausgabe 978-3-527-35242-5 https://doi.org/10.1002/9783527843121 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Thermal management materials for electronic packaging preparation, characterization, and devices Materials science Wärmeleitfähigkeit (DE-588)4064191-0 gnd Halbleitergehäuse (DE-588)4143472-9 gnd |
| subject_GND | (DE-588)4064191-0 (DE-588)4143472-9 |
| title | Thermal management materials for electronic packaging preparation, characterization, and devices |
| title_auth | Thermal management materials for electronic packaging preparation, characterization, and devices |
| title_exact_search | Thermal management materials for electronic packaging preparation, characterization, and devices |
| title_full | Thermal management materials for electronic packaging preparation, characterization, and devices edited by Xingyou Tian |
| title_fullStr | Thermal management materials for electronic packaging preparation, characterization, and devices edited by Xingyou Tian |
| title_full_unstemmed | Thermal management materials for electronic packaging preparation, characterization, and devices edited by Xingyou Tian |
| title_short | Thermal management materials for electronic packaging |
| title_sort | thermal management materials for electronic packaging preparation characterization and devices |
| title_sub | preparation, characterization, and devices |
| topic | Materials science Wärmeleitfähigkeit (DE-588)4064191-0 gnd Halbleitergehäuse (DE-588)4143472-9 gnd |
| topic_facet | Materials science Wärmeleitfähigkeit Halbleitergehäuse |
| url | https://doi.org/10.1002/9783527843121 |
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