APA (7th ed.) Citation

Cao, Z. (2024). The development and characterization of a Cu-pillar flip-chip package for mm-wave applications. https://doi.org/10.14279/depositonce-20911

Chicago Style (17th ed.) Citation

Cao, Zhibo. The Development and Characterization of a Cu-pillar Flip-chip Package for Mm-wave Applications. Berlin, 2024. https://doi.org/10.14279/depositonce-20911.

MLA (9th ed.) Citation

Cao, Zhibo. The Development and Characterization of a Cu-pillar Flip-chip Package for Mm-wave Applications. 2024. https://doi.org/10.14279/depositonce-20911.