High temperature polymer dielectrics: fundamentals and applications in power equipment
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Weitere Verfasser: | , |
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Format: | Buch |
Sprache: | English |
Veröffentlicht: |
Weinheim, Germany
Wiley-VCH
[2024]
|
Schlagworte: | |
Online-Zugang: | http://www.wiley-vch.de/publish/dt/books/ISBN978-3-527-35182-4/ Inhaltsverzeichnis Inhaltsverzeichnis |
Beschreibung: | xiv, 382 Seiten Illustrationen, Diagramme 25 cm, 898 g |
ISBN: | 9783527351824 3527351825 |
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245 | 1 | 0 | |a High temperature polymer dielectrics |b fundamentals and applications in power equipment |c edited by Jun-Wei Zha and Zhi-Min Dang |
264 | 1 | |a Weinheim, Germany |b Wiley-VCH |c [2024] | |
300 | |a xiv, 382 Seiten |b Illustrationen, Diagramme |c 25 cm, 898 g | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
650 | 0 | 7 | |a Hochtemperaturverhalten |0 (DE-588)4160294-8 |2 gnd |9 rswk-swf |
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653 | |a Energie | ||
653 | |a Energietechnik | ||
653 | |a Energy | ||
653 | |a Materialien f. Energiesysteme | ||
653 | |a Materials for Energy Systems | ||
653 | |a Materials Science | ||
653 | |a Materialwissenschaften | ||
653 | |a Polymer processing | ||
653 | |a Polymer Science & Technology | ||
653 | |a Polymerverarbeitung | ||
653 | |a Polymerwissenschaft u. -technologie | ||
653 | |a Power Technology & Power Engineering | ||
653 | |a EG40: Energietechnik | ||
653 | |a MSL0: Materialien f. Energiesysteme | ||
653 | |a PY10: Polymerverarbeitung | ||
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700 | 1 | |a Zha, Jun-Wei |0 (DE-588)1321856148 |4 edt | |
700 | 1 | |a Dang, Zhi-Min |4 edt | |
710 | 2 | |a Wiley-VCH |0 (DE-588)16179388-5 |4 pbl | |
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Datensatz im Suchindex
_version_ | 1805083862503522304 |
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adam_text |
CONTENTS
PREFACE
XIII
1
OVERVIEW
OF
HIGH-TEMPERATURE
POLYMERS
1
XUE-JIE
LIU,
MENGYU
XIAO,
WENJIE
HUANG,
XING
YANG,
AND
JUN-WEI
ZHA
1.1
INTRODUCTION
1
1.2
DEVELOPMENT
OF
HIGH-TEMPERATURE
POLYMERS
2
1.3
PARAMETERS
OF
POLYMERS
WITH
HIGH
TEMPERATURE
RESISTANCE
3
1.4
THERMAL
ANALYSIS
TECHNOLOGY
5
1.4.1
DIFFERENTIAL
SCANNING
CALORIMETRY
(DSC)
5
1.4.2
DYNAMIC
THERMOMECHANICAL
ANALYSIS
(DMA)
5
1.4.3
THERMOGRAVIMETRIC
ANALYSIS
(TGA)
6
1.4.4
STATIC
THERMOMECHANICAL
ANALYSIS
(TMA)
7
1.4.5
THERMAL
CONDUCTIVITY
8
1.4.6
DYNAMIC
DIELECTRIC
ANALYSIS
(DEA)
9
1.5
HIGH-TEMPERATURE
POLYMER
MATERIALS
9
1.5.1
COMMERCIAL
HIGH-TEMPERATURE
POLYMER
9
1.5.2
MOLECULAR
STRUCTURE
MODIFICATION
OF
HIGH-TEMPERATURE
POLYMER
11
1.5.3
HIGH-TEMPERATURE
POLYMER-BASED
COMPOSITE
MATERIALS
13
1.6
SUMMARY
AND
OUTLOOK
14
REFERENCES
15
2
BASIC
PRINCIPLES
OF
DIELECTRICS
21
ANASTASIOS
CHR.
PATSIDIS
AND
GEORGIOS
CHR.
PSARROS
2.1
INTRODUCTION
21
2.2
DEFINITION
OF
DIELECTRICS
21
2.3
DIPOLE
MOMENT
AND
TYPES
OF
DIELECTRIC
MATERIALS
22
2.4
POLARIZATION
AND
DIELECTRIC
PERMITTIVITY
23
2.5
POLARIZATION
UNDER
STATIC
ELECTRIC
FIELD
24
2.5.1
DIELECTRIC
PERMITTIVITY
AND
POLARIZABILITY
24
2.5.2
DIPOLE
'
S
LOCAL
ELECTRIC
FIELD
27
VI
CONTENTS
2.5.3
MODELS
FOR
STATIC
DIELECTRIC
PERMITTIVITY:
DEBYE,
ONSAGER,
KIRKWOOD,
AND
FROHLICH
29
2.6
2.6.1
2.6.2
2.6.3
2.7
2.8
2.9
2.9.1
2.9.2
2.10
2.10.1
2.10.2
2.11
POLARIZATION
UNDER
TIME
VARYING
ELECTRIC
FIELD
32
FREQUENCY
DEPENDENT
DIELECTRIC
PERMITTIVITY
-
DEBYE
'
S
EQUATIONS
33
MODELS
OF
DIELECTRIC
RELAXATIONS
34
EFFECT
OF
TEMPERATURE
36
CONDUCTION
PHENOMENA
IN
DIELECTRICS
38
ACTIVE
DIELECTRICS
40
POLYMERS
AS
DIELECTRIC
MATERIALS
43
DIELECTRIC
RELAXATIONS
IN
POLYMERS
43
HETEROGENOUS
SYSTEMS
-
POLYMER
MATRIX
COMPOSITES
45
THERMAL
PROPERTIES
OF
DIELECTRICS
47
HEAT
CAPACITY
47
THERMAL
CONDUCTION
OF
DIELECTRICS
50
CONCLUDING
REMARKS
51
ACKNOWLEDGEMENTS
51
REFERENCES
52
3
HIGH-TEMPERATURE
ENERGY
STORAGE
POLYMER
DIELECTRICS
FOR
CAPACITORS
57
ZONGLIANG
XIE,
HE
LI,
ZONGREN
PENG,
AND
YI
LIU
3.1
3.2
3.2.1
3.2.1.1
3.2.1.2
3.2.1.3
3.2.1.4
3.2.2
3.2.3
3.3
3.3.1
3.3.1.1
3.3.1.2
3.3.2
3.3.3
INTRODUCTION
57
BASIC
PARAMETERS
OF
HIGH-TEMPERATURE
CAPACITOR
MATERIALS
60
ELECTRICAL
CHARACTERISTICS
OF
HIGH-TEMPERATURE
CAPACITOR
MATERIALS
60
ENERGY
STORAGE
PARAMETERS
60
DIELECTRIC
CONSTANT
AND
DIELECTRIC
LOSS
61
DIELECTRIC
BREAKDOWN
STRENGTH
63
ELECTRICAL
CONDUCTION
AND
CHARGE
INJECTION
64
THERMAL
CHARACTERISTICS
OF
HIGH-TEMPERATURE
CAPACITOR
MATERIALS
65
SELF-CLEARING
ABILITIES
OF
HIGH-TEMPERATURE
CAPACITOR
MATERIALS
67
RANDOMLY
DISPERSED
POLYMER/INORGANIC
NANOFILLER
COMPOSITES
69
COMPOSITES
FILLED
WITH
INSULATING
FILLERS
70
COMPOSITES
FILLED
WITH
METAL
OXIDES
70
COMPOSITES
FILLED
WITH
NITRIDES
AND
FLUORIDES
71
COMPOSITES
FILLED
WITH
CONDUCTIVE
OR
SEMI-CONDUCTIVE
FILLERS
74
COMPOSITES
CO-FILLED
WITH
BOTH
INSULATING
AND
SEMI-CONDUCTIVE
FILLERS
76
3.4
3.4.1
3.4.2
3.5
3.5.1
3.5.2
3.6
3.6.1
CORE@SHELL-STRUCTURED
NANOFILLERS
FOR
POLYMER
COMPOSITES
76
ORGANIC
SHELLS
FOR
INORGANIC
NANOPARTICLES
77
INORGANIC
SHELLS
FOR
INORGANIC
NANOPARTICLES
79
LAYERED
POLYMER
COMPOSITES
80
POLYMER
FILMS
WITH
INORGANIC
LAYERS
80
SANDWICH-STRUCTURED
NANOCOMPOSITES
83
NOVEL
POLYMERS
AND
ALL-ORGANIC
POLYMER
COMPOSITES
85
NOVEL
POLYMERS
86
CONTENTS
VII
3.6.1.1
3.6.1.2
3.6.1.3
3.6.1.4
3.6.2
3.6.2.1
3.6.2.2
3.6.2.3
3.7
STRUCTURAL
MODIFICATION
OF
COMMERCIAL
HIGH-T
G
POLYMERS
86
CROSS-LINKED
POLYMERS
87
WIDE
BANDGAP
POLYMERS
88
POLYMERS
WITH
POLAR
GROUPS
89
ALL-ORGANIC
POLYMER
COMPOSITES
90
POLYMER
BLENDS
90
POLYMER
DOPED
WITH
ORGANIC
FILLERS
92
ALL-ORGANIC
LAYERED
POLYMER
COMPOSITES
92
CONCLUSION
AND
PERSPECTIVE
94
REFERENCES
95
4
REVIEW
ON
HIGH-TEMPERATURE
POLYMERS
FOR
CABLE
INSULATION:
STATE-OF-THE-ART
AND
FUTURE
DEVELOPMENTS
103
YOUCEF
KEMORI,
GUILLAUME
BELIJAR,
ZAREL
VALDEZ-NAVA,
FREDERIC
FORGET,
AND
SOMBEL
DIAHAM
4.1
4.2
4.2.1
4.2.1.1
4.2.1.2
4.2.1.3
BRIEF
HISTORY
OF
CABLES
DEVELOPMENT
AND
INSULATING
MATERIALS
103
TECHNOLOGIES
OF
MODERN
POWER
CABLES
106
DESIGNS
AND
MANUFACTURING
PROCESSES
106
WRAPPING
TECHNOLOGY
106
EXTRUSION
TECHNOLOGY
110
MICRO-MULTILAYER
MULTIFUNCTIONAL
ELECTRICAL
INSULATION
(MMEI)
SYSTEM
112
4.2.2
INSULATING
MATERIAL
CONSIDERATIONS
FOR
HIGH-TEMPERATURE
CABLES
113
4.2.2.1
4.2.2.2
4.2.2.3
4.2.2.4
4.2.2.5
4.2.2.6
4.2.2.7
4.2.2.8
4.2.2.9
4.2.2.10
4.2.2.11
4.2.2.12
4.3
ELECTRICAL
REQUIREMENTS
116
THERMAL
REQUIREMENTS
117
MECHANICAL
REQUIREMENTS
118
ENVIRONMENTAL
AND
FUNCTIONAL
CONSIDERATIONS
119
FLAME
RESISTANCE
120
SMOKE
EVOLUTION
121
TOXICITY
121
CORROSIVITY
121
HEAT
RELEASE
121
RADIATION
RESISTANCE
122
CHEMICAL
RESISTANCE
122
RECAPITULATION
OF
IMPORTANT
STANDARDS
FOR
CABLES
TESTING
125
REVIEW
OF
THE
MOST
RELEVANT
ELECTRICAL
CHARACTERISTICS
OF
HIGH
TEMPERATURE
INSULATING
MATERIALS
125
4.3.1
4.3.2
4.3.3
4.3.4
4.4
DIELECTRIC
SPECTROSCOPY
125
PARTIAL
DISCHARGES
130
SPACE
CHARGE
AND
DC
CONDUCTIVITY
133
AGING
AND
DEGRADATION
137
TRENDS
AND
OUTLOOKS
140
AUTHOR
'
S
NOTE
142
REFERENCES
142
VIII
CONTENTS
5
HIGH-TEMPERATURE
POLYMER-BASED
DIELECTRICS
FOR
ADVANCED
ELECTRONIC
PACKAGING
149
JIE
LIU,
PENG
LI,
JIANWEI
ZHAO,
AND
SHUHUI
YU
5.1
5.1.1
5.1.2
INTRODUCTION
149
DEVELOPMENT
OF
ELECTRONIC
PACKAGING
TECHNOLOGY
150
REQUIREMENT
OF
POLYMER-BASED
DIELECTRICS
FOR
ADVANCED
ELECTRONIC
PACKAGING
APPLICATION
152
5.1.2.1
5.1.2.2
5.1.2.3
5.1.2.4
5.1.2.5
5.1.2.6
5.2
5.2.1
5.2.1.1
5.2.1.2
5.2.1.3
5.2.1.4
5.2.1.5
5.2.1.6
5.2.2
5.2.2.1
5.2.2.2
5.2.2.3
5.3
DIELECTRIC
PROPERTIES
155
THERMAL
AND
THERMAL-MECHANICAL
PROPERTIES
157
DYNAMIC
THERMOMECHANICAL
PROPERTIES
157
THERMAL
EXPANSION
COEFFICIENT
157
THERMAL
CONDUCTIVITY
158
OTHER
REQUIREMENTS
159
HIGH-TEMPERATURE
POLYMER
AND
POLYMER-BASED
DIELECTRICS
160
HIGH-TEMPERATURE
POLYMER
DIELECTRICS
160
POLYIMIDE
160
EPOXY
RESINS
163
BENZOCYCLOBUTENE
RESINS
165
BENZOXAZINE
RESINS
167
POLYARYL
ETHER
167
ORGANIC
POROUS
MATERIALS
168
HIGH-TEMPERATURE
POLYMER-BASED
COMPOSITE
DIELECTRICS
169
INORGANIC
FILLERS
169
INORGANIC
POROUS
FILLERS
171
ORGANIC
POROUS
FILLERS
171
SUMMARY
AND
PERSPECTIVES
172
REFERENCES
173
6
HIGH-TEMPERATURE
POLYMER
DIELECTRICS
FOR
PRINTED
CIRCUIT
BOARD
181
XU
WANG,
XINYU
CHEN,
JUNHUI
LUO,
XIN
WANG,
YAN
CHEN,
AND
XIANGYANG
LIU
6.1
6.1.1
6.1.2
6.1.3
6.2
6.2.1
6.2.2
6.2.2.1
6.2.2.2
6.2.3
6.2.3.1
6.2.3.2
6.2.3.3
6.2.3.4
EPOXY
RESIN
USED
FOR
PCB
182
STRUCTURE
OF
EPOXY
RESINS
182
PROPERTIES
AND
APPLICATION
OF
EPOXY
184
EPOXY
RESIN
USED
FOR
CCL
IN
PCB
185
PHENOLIC
RESINS
USED
FOR
PCB
188
STRUCTURE
OF
PHENOLIC
RESINS
188
SYNTHESIS
OF
PHENOLIC
RESINS
188
SYNTHESIS
OF
THERMOPLASTIC
PHENOLIC
RESINS
189
THERMOSETTING
PHENOLIC
RESINS
190
PROPERTIES
OF
PHENOLIC
RESINS
AND
THEIR
APPLICATION
IN
PCBS
191
APPLICATION
OF
PHENOLIC
RESINS
IN
COPPER-CLAD
LAMINATES
192
TUNG
OIL-MODIFIED
PHENOLIC
RESIN
192
LINEAR
PHENOLIC
RESINS
193
NITROGEN-CONTAINING
PHENOLIC
RESINS
194
CONTENTS
IX
6.2.3.5
POLYBENZOXAZINE
USED
FOR
PCB
195
6.2.4
PROSPECT
196
6.3
POLYIMIDE
USED
FOR
PCB
197
6.3.1
INTRODUCTION
TO
POLYIMIDE
AND
ITS
PERFORMANCE
CHARACTERISTICS
197
6.3.2
SYNTHESIS
METHOD
OF
PI
197
6.3.2.1
ONE-STEP
METHOD
197
6.3.2.2
TWO-STEP
METHOD
198
6.3.2.3
THREE-STEP
METHOD
199
6.3.3
CLASSIFICATION
OF
PI
199
6.3.3.1
NON-FUSIBLE
AND
INSOLUBLE
PI
199
6.3.3.2
FUSIBLE
PI,
THERMOPLASTIC
PI
200
6.3.4
PERFORMANCE
CHARACTERISTICS
OF
PI
201
6.3.5
APPLICATION
OF
PI
IN
CCLS
201
6.3.5.1
APPLICATION
OF
PI
IN
RIGID
CCLS
201
6.3.5.2
APPLICATION
OF
PI
IN
FLEXIBLE
COPPER-CLAD
LAMINATE
202
6.3.5.3
APPLICATION
OF
THERMOPLASTIC
POLYIMIDE
IN
DOUBLE-SIDED
COPPER
LAMINATES
203
6.3.6
PROSPECT
206
6.4
POLYMER
MATERIALS
USED
FOR
PCB
AT
HIGH
FREQUENCY
206
6.4.1
POLYTETRAFLUOROETHYLENE
(PTFE)
USED
FOR
PCB
207
6.4.1.1
STRUCTURE
AND
PROPERTIES
OF
PTFE
207
6.4.1.2
PTFE
USED
FOR
PCB
209
6.4.2
LIQUID
CRYSTAL
POLYMER
(LCP)
USED
FOR
PCB
211
6.4.2.1
STRUCTURE
AND
PROPERTIES
OF
LCP
211
6.4.2.2
LCP
USED
FOR
PCB
213
6.4.3
OTHER
RESINS
WITH
POTENTIAL
IN
THE
FIELD
OF
HIGH-FREQUENCY
COMMUNICATIONS
215
6.4.3.1
CYANATE
ESTER
(CE)
USED
FOR
PCB
215
6.4.3.2
POLYPHENYLENE
OXIDE
(PPO)
USED
FOR
PCB
218
6.4.4
PROSPECT
OF
POLYMER
RESIN
FOR
PBC
AT
HIGH
FREQUENCY
220
REFERENCES
221
7
HIGH-TEMPERATURE
POLYMER
DIELECTRICS
FOR
NEW
ENERGY
POWER
EQUIPMENT
227
MENG
XIAO,
ZHIYUAN
ZHANG,
YUYAN
CHEN,
XIAODAN
DU,
AND
BOXUE
DU
7.1
INTRODUCTION
227
7.2
HIGH-FREQUENCY
POWER
TRANSFORMER
AND
DRY-TYPE
BUSHING
228
7.2.1
MODIFICATION
OF
EPOXY
RESIN
228
7.2.1.1
CHANGE
THE
MOLECULAR
CHAIN
229
7.2.1.2
DEVELOP
THE
CURING
AGENT
WITH
BETTER
THERMAL
STABILITY
232
7.2.1.3
FILLING
MODIFICATION
232
7.3
MODIFICATION
OF
POLYIMIDE
233
7.3.1
FILLING
MODIFICATION
234
7.3.2
INTRODUCE
RIGID
GROUPS
235
7.3.3
FORM
THE
CROSS-LINKED
STRUCTURE
237
X|
CONTENTS
7.4
HIGH-TEMPERATURE
RESISTANT
DIELECTRIC
MATERIAL
FOR
CAPACITOR
239
7.4.1
HIGH-TEMPERATURE
DIELECTRIC
POLYMER
240
7.4.1.1
POLYTETRAFLUOROETHYLENE
240
7.4.1.2
POLYVINYLIDENE
FLUORIDE
242
7.4.1.3
OTHER
MATERIALS
243
7.4.2
NANOCOMPOSITE
MATERIAL
245
7.4.3
CROSSLINKED
POLYMER
248
7.5
HIGH-TEMPERATURE
RESISTANT
DIELECTRIC
MATERIAL
FOR
IGBT
250
7.5.1
SILICONE
GELS
251
7.5.2
ENGINEERING
PLASTICS
252
7.5.2.1
POLYPHENYLENE
SULFIDE
253
7.5.2.2
POLYETHERETHERKETONE
254
7.6
CONCLUDING
REMARKS
256
REFERENCES
257
8
HIGH-TEMPERATURE
POLYMER
DIELECTRICS
FOR
AEROSPACE
ELECTRICAL
EQUIPMENT
269
DAOMIN
MIN,
XIAOFAN
SONG,
LINGYU
YANG,
YUANSHUO
ZHANG,
SHIHANG
WANG,
AND
SHENGTAO
LI
8.1
INTRODUCTION
269
8.2
CHALLENGES
OF
INSULATING
MATERIALS
UNDER
HIGH
TEMPERATURES
272
8.2.1
SUBSTANTIAL
DROP
IN
RESISTIVITY
UNDER
HIGH
TEMPERATURES
AND
STRONG
ELECTRIC
FIELDS
272
8.2.2
GREATLY
INCREASED
DIELECTRIC
LOSS
FACTOR
AT
HIGH
TEMPERATURES
275
8.2.3
SPACE
CHARGE
ACCUMULATION
AND
ELECTRIC
FIELD
DISTORTION
UNDER
HIGH
TEMPERATURES
AND
HIGH-DC
ELECTRIC
FIELDS
276
8.2.4
REDUCTION
IN
BREAKDOWN
STRENGTH
UNDER
HIGH
TEMPERATURES
AND
HIGH-FREQUENCY
VOLTAGES
277
8.2.5
MORE
SEVERE
PARTIAL
DISCHARGE
AND
ACCELERATED
AGING
AT
HIGH
TEMPERATURES
AND
HIGH
FREQUENCIES
278
8.2.6
REDUCTION
IN
SURFACE
FLASHOVER
VOLTAGE
UNDER
ELECTRON
IRRADIATIONS
AND
VOLTAGES
279
8.3
HIGH
TEMPERATURE
RESISTANT
AND
STRONG
DC
INSULATING
POLYMER
DIELECTRICS
280
8.3.1
POLYIMIDE
NANOCOMPOSITES
280
8.3.2
POLYETHERIMIDE
NANOCOMPOSITES
282
8.3.3
EPOXY
RESIN
NANOCOMPOSITES
284
8.3.4
POLYTETRAFLUOROETHYLENE
COMPOSITES
285
8.4
HIGH-TEMPERATURE-RESIST
ANT
POLYMER
DIELECTRICS
WITH
STRONG
NONLINEAR
CONDUCTIVITY
288
8.4.1
CHARGE
ACCUMULATION
AND
ELECTRIC
FIELD
DISTORTION
IN
POLYMERS
UNDER
HIGH
ELECTRIC
FIELDS
288
8.4.2
CHARGE
ACCUMULATION
INDUCED
BY
HIGH-ENERGY
ELECTRON
IRRADIATION
AND
WORKING
VOLTAGE
290
CONTENTS
XI
8.4.3
8.5
NONLINEAR
CONDUCTIVITY
292
HIGH-TEMPERATURE-RESISTANT
POLYMER
DIELECTRICS
UNDER
THE
COUPLING
OF
ELECTRON
IRRADIATION
AND
HIGH
VOLTAGE
295
8.5.1
MECHANISM
OF
VACUUM
DC
SURFACE
DISCHARGE
UNDER
THE
COUPLING
OF
ELECTRON
BEAM
IRRADIATION
AND
HIGH
VOLTAGE
296
8.5.2
EFFECT
OF
ELECTRON
BEAM
IRRADIATION
ON
VACUUM
DC
SURFACE
DISCHARGE
296
8.5.3
INFLUENCE
OF
INCIDENT
ELECTRON
BEAM
CHARACTERISTICS
ON
VACUUM
DC
SURFACE
DISCHARGE
297
8.5.4
INFLUENCE
OF
INSULATION
DISTANCE
AND
ELECTRODE
HEIGHT
ON
SURFACE
DISCHARGE
298
8.6
HIGH
TEMPERATURE
RESISTANT
AND
HIGH-FREQUENCY
STRONG
INSULATING
POLYMER
DIELECTRICS
300
8.6.1
ELECTRICAL
TREE
CHARACTERISTICS
OF
EPOXY
RESIN
UNDER
BIPOLAR
SQUARE
WAVE
VOLTAGE
301
8.6.2
8.6.3
MICRO/NANO-DOPED
EPOXY
RESIN
COMPOSITES
302
CORONA
RESISTANCE
LIFE
OF
POLYIMIDE
MODIFIED
BY
NANO-DOPED
MULTILAYER
STRUCTURE
304
8.6.4
CHARACTERISTICS
OF
POLYIMIDE
MODIFIED
BY
MOLECULAR
STRUCTURE
305
REFERENCES
307
9
SMART
POLYMER
DIELECTRICS
313
XIAOYAN
HUANG,
LU
HAN,
ZHI
WEN
HUANG,
AND
QI
LI
9.1
9.2
9.3
9.3.1
9.3.2
9.3.3
9.3.4
9.4
9.4.1
INTRODUCTION
313
SELF-ADAPTIVE
DIELECTRICS
315
SELF-REPORTING
DIELECTRICS
324
SELF-REPORTING
MATERIALS
BASED
ON
PHOTOCHROMIC
COMPOUNDS
325
SELF-REPORTING
MATERIALS
BASED
ON
CONJUGATED
POLYMERS
330
SELF-REPORTING
MATERIALS
BASED
ON ENCAPSULATED
SYSTEMS
333
OUTLOOK
FOR
SRDS
335
SELF-HEALING
DIELECTRICS
336
EXPECTATIONS
AND
CHALLENGES
IN
DEVELOPING
SELF-HEALING
DIELECTRICS
336
9.4.2
MELTING
INTERDIFFUSION
BY
MAGNETIC/MICROWAVE
HEATING
OF
NANOPARTICLES
337
9.4.3
9.4.3.1
9.4.3.2
9.4.4
MICROCAPSULE-BASED
SELF-HEALING
DIELECTRICS
342
POLYMERIZATION
TRIGGERED
BY
ENVIRONMENTAL
STIMULI
342
POLYMERIZATION
BY
LATENT
FUNCTIONALITY
346
INTRINSIC
SELF-HEALING
DIELECTRICS
BY
REVERSIBLE
BONDS
OR
INTERACTIONS
348
9.4.5
9.5
SUMMARY
OF
SELF-HEALING
DIELECTRICS
351
OUTLOOK
352
REFERENCES
353
XII
CONTENTS
10
THE
FUTURE
DEVELOPMENT
OF
HIGH-TEMPERATURE
POLYMER
DIELECTRICS
365
QI-KUN
FENG,
YONG-XIN
ZHANG,
XIN-JIE
WANG,
AND
ZHI-MIN
DANG
10.1
10.2
10.2.1
10.2.2
10.2.3
10.3
10.3.1
10.3.2
10.3.3
10.4
INTRODUCTION
365
PRESENT
DEVELOPMENT
AND
CHALLENGES
365
TEMPERATURE
STABILITY
365
POLYMER-BASED
HIGH-TEMPERATURE
COMPOSITES
367
COST
AND
SCALE-UP
PRODUCTION
367
FUTURE
PERSPECTIVES
AND
TRENDS
368
INTRINSIC
HIGH-TEMPERATURE
POLYMERS
368
POLYMER-BASED
HIGH-TEMPERATURE
COMPOSITES
369
LARGE-SCALE
INDUSTRIAL
PRODUCTION
370
SUMMARY
370
ACKNOWLEDGMENTS
371
REFERENCES
371
INDEX
375 |
any_adam_object | 1 |
author2 | Zha, Jun-Wei Dang, Zhi-Min |
author2_role | edt edt |
author2_variant | j w z jwz z m d zmd |
author_GND | (DE-588)1321856148 |
author_facet | Zha, Jun-Wei Dang, Zhi-Min |
building | Verbundindex |
bvnumber | BV049697705 |
ctrlnum | (OCoLC)1426039898 (DE-599)DNB1293019194 |
dewey-full | 621.3 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.3 |
dewey-search | 621.3 |
dewey-sort | 3621.3 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Book |
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id | DE-604.BV049697705 |
illustrated | Illustrated |
indexdate | 2024-07-20T07:55:18Z |
institution | BVB |
institution_GND | (DE-588)16179388-5 |
isbn | 9783527351824 3527351825 |
language | English |
oclc_num | 1426039898 |
open_access_boolean | |
owner | DE-703 |
owner_facet | DE-703 |
physical | xiv, 382 Seiten Illustrationen, Diagramme 25 cm, 898 g |
publishDate | 2024 |
publishDateSearch | 2024 |
publishDateSort | 2024 |
publisher | Wiley-VCH |
record_format | marc |
spelling | High temperature polymer dielectrics fundamentals and applications in power equipment edited by Jun-Wei Zha and Zhi-Min Dang Weinheim, Germany Wiley-VCH [2024] xiv, 382 Seiten Illustrationen, Diagramme 25 cm, 898 g txt rdacontent n rdamedia nc rdacarrier Hochtemperaturverhalten (DE-588)4160294-8 gnd rswk-swf Elektrotechnik (DE-588)4014390-9 gnd rswk-swf Polymere (DE-588)4046699-1 gnd rswk-swf Dielektrikum (DE-588)4149716-8 gnd rswk-swf Energie Energietechnik Energy Materialien f. Energiesysteme Materials for Energy Systems Materials Science Materialwissenschaften Polymer processing Polymer Science & Technology Polymerverarbeitung Polymerwissenschaft u. -technologie Power Technology & Power Engineering EG40: Energietechnik MSL0: Materialien f. Energiesysteme PY10: Polymerverarbeitung Dielektrikum Elektrotechnik (DE-588)4014390-9 s Dielektrikum (DE-588)4149716-8 s Polymere (DE-588)4046699-1 s Hochtemperaturverhalten (DE-588)4160294-8 s DE-604 Zha, Jun-Wei (DE-588)1321856148 edt Dang, Zhi-Min edt Wiley-VCH (DE-588)16179388-5 pbl Erscheint auch als Online-Ausgabe, PDF 978-3-527-84103-5 Erscheint auch als Online-Ausgabe, EPUB 978-3-527-84104-2 Erscheint auch als Online-Ausgabe 978-3-527-84105-9 X:MVB http://www.wiley-vch.de/publish/dt/books/ISBN978-3-527-35182-4/ B:DE-101 application/pdf https://d-nb.info/1293019194/04 Inhaltsverzeichnis DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=035040183&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis 1\p dnb 20240305 DE-101 https://d-nb.info/provenance/plan#dnb 2\p dnb 20240305 DE-101 https://d-nb.info/provenance/plan#dnb |
spellingShingle | High temperature polymer dielectrics fundamentals and applications in power equipment Hochtemperaturverhalten (DE-588)4160294-8 gnd Elektrotechnik (DE-588)4014390-9 gnd Polymere (DE-588)4046699-1 gnd Dielektrikum (DE-588)4149716-8 gnd |
subject_GND | (DE-588)4160294-8 (DE-588)4014390-9 (DE-588)4046699-1 (DE-588)4149716-8 |
title | High temperature polymer dielectrics fundamentals and applications in power equipment |
title_auth | High temperature polymer dielectrics fundamentals and applications in power equipment |
title_exact_search | High temperature polymer dielectrics fundamentals and applications in power equipment |
title_full | High temperature polymer dielectrics fundamentals and applications in power equipment edited by Jun-Wei Zha and Zhi-Min Dang |
title_fullStr | High temperature polymer dielectrics fundamentals and applications in power equipment edited by Jun-Wei Zha and Zhi-Min Dang |
title_full_unstemmed | High temperature polymer dielectrics fundamentals and applications in power equipment edited by Jun-Wei Zha and Zhi-Min Dang |
title_short | High temperature polymer dielectrics |
title_sort | high temperature polymer dielectrics fundamentals and applications in power equipment |
title_sub | fundamentals and applications in power equipment |
topic | Hochtemperaturverhalten (DE-588)4160294-8 gnd Elektrotechnik (DE-588)4014390-9 gnd Polymere (DE-588)4046699-1 gnd Dielektrikum (DE-588)4149716-8 gnd |
topic_facet | Hochtemperaturverhalten Elektrotechnik Polymere Dielektrikum |
url | http://www.wiley-vch.de/publish/dt/books/ISBN978-3-527-35182-4/ https://d-nb.info/1293019194/04 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=035040183&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
work_keys_str_mv | AT zhajunwei hightemperaturepolymerdielectricsfundamentalsandapplicationsinpowerequipment AT dangzhimin hightemperaturepolymerdielectricsfundamentalsandapplicationsinpowerequipment AT wileyvch hightemperaturepolymerdielectricsfundamentalsandapplicationsinpowerequipment |
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