Silicon semiconductor technology: processing and integration of microelectronic devices
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Buch |
Sprache: | English |
Veröffentlicht: |
Wiesbaden, Germany
Springer Vieweg
[2023]
|
Schlagworte: | |
Online-Zugang: | Inhaltstext Auszug |
Beschreibung: | XI, 264 Seiten Illustrationen, Diagramme 24 cm x 16.8 cm |
ISBN: | 365841040X 9783658410407 |
Internformat
MARC
LEADER | 00000nam a22000008c 4500 | ||
---|---|---|---|
001 | BV049306474 | ||
003 | DE-604 | ||
005 | 20231017 | ||
007 | t | ||
008 | 230830s2023 gw a||| |||| 00||| eng d | ||
015 | |a 23,N09 |2 dnb | ||
016 | 7 | |a 1281747718 |2 DE-101 | |
020 | |a 365841040X |9 3-658-41040-X | ||
020 | |a 9783658410407 |c pbk: circa EUR 69.54 (DE) (freier Preis), circa EUR 71.49 (AT) (freier Preis), circa CHF 77.00 (freier Preis), circa EUR 64.99 |9 978-3-658-41040-7 | ||
024 | 3 | |a 9783658410407 | |
028 | 5 | 2 | |a Bestellnummer: 89211642 |
028 | 5 | 2 | |a Bestellnummer: 978-3-658-41040-7 |
035 | |a (OCoLC)1371419110 | ||
035 | |a (DE-599)DNB1281747718 | ||
040 | |a DE-604 |b ger |e rda | ||
041 | 0 | |a eng | |
044 | |a gw |c XA-DE-HE | ||
049 | |a DE-29T | ||
084 | |8 1\p |a 621.3 |2 23sdnb | ||
100 | 1 | |a Hilleringmann, Ulrich |e Verfasser |4 aut | |
245 | 1 | 0 | |a Silicon semiconductor technology |b processing and integration of microelectronic devices |c Ulrich Hilleringmann |
264 | 1 | |a Wiesbaden, Germany |b Springer Vieweg |c [2023] | |
300 | |a XI, 264 Seiten |b Illustrationen, Diagramme |c 24 cm x 16.8 cm | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
650 | 0 | 7 | |a Silicium |0 (DE-588)4077445-4 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Halbleitertechnologie |0 (DE-588)4158814-9 |2 gnd |9 rswk-swf |
653 | |a CMOS | ||
653 | |a CMOS Circuit Integration | ||
653 | |a Chemical Vapor Deposition | ||
653 | |a Dry Etching | ||
653 | |a Ion Implantation | ||
653 | |a Local Oxidation of Silicon | ||
653 | |a Nano Technology | ||
653 | |a Oxidation | ||
653 | |a Packaging | ||
653 | |a Processing of Silicon | ||
653 | |a Semiconductor | ||
653 | |a Silicon | ||
653 | |a Silicon on Insulator | ||
653 | |a Technology | ||
655 | 7 | |0 (DE-588)4123623-3 |a Lehrbuch |2 gnd-content | |
689 | 0 | 0 | |a Silicium |0 (DE-588)4077445-4 |D s |
689 | 0 | 1 | |a Halbleitertechnologie |0 (DE-588)4158814-9 |D s |
689 | 0 | |5 DE-604 | |
710 | 2 | |a Springer Fachmedien Wiesbaden |0 (DE-588)1043386068 |4 pbl | |
775 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe, Hardcover |z 978-3-658-41042-1 |
776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe |z 978-3-658-41041-4 |
856 | 4 | 2 | |m X:MVB |q text/html |u http://deposit.dnb.de/cgi-bin/dokserv?id=9022ecacb6824ac4b43c2830c328046f&prov=M&dok_var=1&dok_ext=htm |3 Inhaltstext |
856 | 4 | 2 | |m X:MVB |u https://link.springer.com/978-3-658-41040-7 |3 Auszug |
999 | |a oai:aleph.bib-bvb.de:BVB01-034567654 | ||
883 | 1 | |8 1\p |a vlb |d 20230223 |q DE-101 |u https://d-nb.info/provenance/plan#vlb |
Datensatz im Suchindex
_version_ | 1804185806770798592 |
---|---|
adam_txt | |
any_adam_object | |
any_adam_object_boolean | |
author | Hilleringmann, Ulrich |
author_facet | Hilleringmann, Ulrich |
author_role | aut |
author_sort | Hilleringmann, Ulrich |
author_variant | u h uh |
building | Verbundindex |
bvnumber | BV049306474 |
ctrlnum | (OCoLC)1371419110 (DE-599)DNB1281747718 |
format | Book |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02531nam a22006618c 4500</leader><controlfield tag="001">BV049306474</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20231017 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">230830s2023 gw a||| |||| 00||| eng d</controlfield><datafield tag="015" ind1=" " ind2=" "><subfield code="a">23,N09</subfield><subfield code="2">dnb</subfield></datafield><datafield tag="016" ind1="7" ind2=" "><subfield code="a">1281747718</subfield><subfield code="2">DE-101</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">365841040X</subfield><subfield code="9">3-658-41040-X</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783658410407</subfield><subfield code="c">pbk: circa EUR 69.54 (DE) (freier Preis), circa EUR 71.49 (AT) (freier Preis), circa CHF 77.00 (freier Preis), circa EUR 64.99</subfield><subfield code="9">978-3-658-41040-7</subfield></datafield><datafield tag="024" ind1="3" ind2=" "><subfield code="a">9783658410407</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">Bestellnummer: 89211642</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">Bestellnummer: 978-3-658-41040-7</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1371419110</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)DNB1281747718</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">gw</subfield><subfield code="c">XA-DE-HE</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-29T</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="8">1\p</subfield><subfield code="a">621.3</subfield><subfield code="2">23sdnb</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Hilleringmann, Ulrich</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Silicon semiconductor technology</subfield><subfield code="b">processing and integration of microelectronic devices</subfield><subfield code="c">Ulrich Hilleringmann</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Wiesbaden, Germany</subfield><subfield code="b">Springer Vieweg</subfield><subfield code="c">[2023]</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XI, 264 Seiten</subfield><subfield code="b">Illustrationen, Diagramme</subfield><subfield code="c">24 cm x 16.8 cm</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Silicium</subfield><subfield code="0">(DE-588)4077445-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Halbleitertechnologie</subfield><subfield code="0">(DE-588)4158814-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">CMOS</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">CMOS Circuit Integration</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Chemical Vapor Deposition</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Dry Etching</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Ion Implantation</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Local Oxidation of Silicon</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Nano Technology</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Oxidation</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Packaging</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Processing of Silicon</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Semiconductor</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Silicon</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Silicon on Insulator</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Technology</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)4123623-3</subfield><subfield code="a">Lehrbuch</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Silicium</subfield><subfield code="0">(DE-588)4077445-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Halbleitertechnologie</subfield><subfield code="0">(DE-588)4158814-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">Springer Fachmedien Wiesbaden</subfield><subfield code="0">(DE-588)1043386068</subfield><subfield code="4">pbl</subfield></datafield><datafield tag="775" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe, Hardcover</subfield><subfield code="z">978-3-658-41042-1</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Online-Ausgabe</subfield><subfield code="z">978-3-658-41041-4</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">X:MVB</subfield><subfield code="q">text/html</subfield><subfield code="u">http://deposit.dnb.de/cgi-bin/dokserv?id=9022ecacb6824ac4b43c2830c328046f&prov=M&dok_var=1&dok_ext=htm</subfield><subfield code="3">Inhaltstext</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">X:MVB</subfield><subfield code="u">https://link.springer.com/978-3-658-41040-7</subfield><subfield code="3">Auszug</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-034567654</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">vlb</subfield><subfield code="d">20230223</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#vlb</subfield></datafield></record></collection> |
genre | (DE-588)4123623-3 Lehrbuch gnd-content |
genre_facet | Lehrbuch |
id | DE-604.BV049306474 |
illustrated | Illustrated |
index_date | 2024-07-03T22:39:58Z |
indexdate | 2024-07-10T10:01:05Z |
institution | BVB |
institution_GND | (DE-588)1043386068 |
isbn | 365841040X 9783658410407 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-034567654 |
oclc_num | 1371419110 |
open_access_boolean | |
owner | DE-29T |
owner_facet | DE-29T |
physical | XI, 264 Seiten Illustrationen, Diagramme 24 cm x 16.8 cm |
publishDate | 2023 |
publishDateSearch | 2023 |
publishDateSort | 2023 |
publisher | Springer Vieweg |
record_format | marc |
spelling | Hilleringmann, Ulrich Verfasser aut Silicon semiconductor technology processing and integration of microelectronic devices Ulrich Hilleringmann Wiesbaden, Germany Springer Vieweg [2023] XI, 264 Seiten Illustrationen, Diagramme 24 cm x 16.8 cm txt rdacontent n rdamedia nc rdacarrier Silicium (DE-588)4077445-4 gnd rswk-swf Halbleitertechnologie (DE-588)4158814-9 gnd rswk-swf CMOS CMOS Circuit Integration Chemical Vapor Deposition Dry Etching Ion Implantation Local Oxidation of Silicon Nano Technology Oxidation Packaging Processing of Silicon Semiconductor Silicon Silicon on Insulator Technology (DE-588)4123623-3 Lehrbuch gnd-content Silicium (DE-588)4077445-4 s Halbleitertechnologie (DE-588)4158814-9 s DE-604 Springer Fachmedien Wiesbaden (DE-588)1043386068 pbl Erscheint auch als Druck-Ausgabe, Hardcover 978-3-658-41042-1 Erscheint auch als Online-Ausgabe 978-3-658-41041-4 X:MVB text/html http://deposit.dnb.de/cgi-bin/dokserv?id=9022ecacb6824ac4b43c2830c328046f&prov=M&dok_var=1&dok_ext=htm Inhaltstext X:MVB https://link.springer.com/978-3-658-41040-7 Auszug 1\p vlb 20230223 DE-101 https://d-nb.info/provenance/plan#vlb |
spellingShingle | Hilleringmann, Ulrich Silicon semiconductor technology processing and integration of microelectronic devices Silicium (DE-588)4077445-4 gnd Halbleitertechnologie (DE-588)4158814-9 gnd |
subject_GND | (DE-588)4077445-4 (DE-588)4158814-9 (DE-588)4123623-3 |
title | Silicon semiconductor technology processing and integration of microelectronic devices |
title_auth | Silicon semiconductor technology processing and integration of microelectronic devices |
title_exact_search | Silicon semiconductor technology processing and integration of microelectronic devices |
title_exact_search_txtP | Silicon semiconductor technology processing and integration of microelectronic devices |
title_full | Silicon semiconductor technology processing and integration of microelectronic devices Ulrich Hilleringmann |
title_fullStr | Silicon semiconductor technology processing and integration of microelectronic devices Ulrich Hilleringmann |
title_full_unstemmed | Silicon semiconductor technology processing and integration of microelectronic devices Ulrich Hilleringmann |
title_short | Silicon semiconductor technology |
title_sort | silicon semiconductor technology processing and integration of microelectronic devices |
title_sub | processing and integration of microelectronic devices |
topic | Silicium (DE-588)4077445-4 gnd Halbleitertechnologie (DE-588)4158814-9 gnd |
topic_facet | Silicium Halbleitertechnologie Lehrbuch |
url | http://deposit.dnb.de/cgi-bin/dokserv?id=9022ecacb6824ac4b43c2830c328046f&prov=M&dok_var=1&dok_ext=htm https://link.springer.com/978-3-658-41040-7 |
work_keys_str_mv | AT hilleringmannulrich siliconsemiconductortechnologyprocessingandintegrationofmicroelectronicdevices AT springerfachmedienwiesbaden siliconsemiconductortechnologyprocessingandintegrationofmicroelectronicdevices |