Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Abschlussarbeit Buch |
| Sprache: | English |
| Veröffentlicht: |
Düren
Shaker
2023
|
| Ausgabe: | 1. Auflage |
| Schriftenreihe: | Schriften des Lehrstuhls für Dynamik und Mechatronik
15 |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | 170 Seiten Illustrationen, Diagramme 21 cm x 14.8 cm, 284 g |
| ISBN: | 9783844089035 3844089039 |
Internformat
MARC
| LEADER | 00000nam a22000008cb4500 | ||
|---|---|---|---|
| 001 | BV049100588 | ||
| 003 | DE-604 | ||
| 005 | 20230829 | ||
| 007 | t | ||
| 008 | 230815s2023 gw a||| m||| 00||| eng d | ||
| 015 | |a 22,N50 |2 dnb | ||
| 016 | 7 | |a 1275236227 |2 DE-101 | |
| 020 | |a 9783844089035 |c : EUR 48.80 (DE), EUR 48.80 (AT), CHF 61.10 (freier Preis) |9 978-3-8440-8903-5 | ||
| 020 | |a 3844089039 |9 3-8440-8903-9 | ||
| 024 | 3 | |a 9783844089035 | |
| 035 | |a (OCoLC)1401213403 | ||
| 035 | |a (DE-599)DNB1275236227 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 044 | |a gw |c XA-DE-NW | ||
| 049 | |a DE-83 | ||
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 084 | |8 1\p |a 620 |2 23sdnb | ||
| 100 | 1 | |a Althoff, Simon |d 1982- |e Verfasser |0 (DE-588)1288608330 |4 aut | |
| 245 | 1 | 0 | |a Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach |c Simon Althoff |
| 250 | |a 1. Auflage | ||
| 263 | |a 202301 | ||
| 264 | 1 | |a Düren |b Shaker |c 2023 | |
| 300 | |a 170 Seiten |b Illustrationen, Diagramme |c 21 cm x 14.8 cm, 284 g | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Schriften des Lehrstuhls für Dynamik und Mechatronik |v 15 | |
| 502 | |b Dissertation |c Universität Paderborn |d 2022 | ||
| 650 | 0 | 7 | |a Ultraschallbonden |0 (DE-588)1045772771 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Leistungshalbleiter |0 (DE-588)4167286-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Steckverbindung |0 (DE-588)4140633-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Bonden |0 (DE-588)4232594-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Kupferdraht |0 (DE-588)4166101-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Anschluss |g Elektrotechnik |0 (DE-588)4295385-6 |2 gnd |9 rswk-swf |
| 653 | |a heavy copper bonding | ||
| 653 | |a point-contact-element | ||
| 653 | |a friction model | ||
| 653 | |a wire bonding | ||
| 653 | |a quality prediction | ||
| 655 | 7 | |0 (DE-588)4113937-9 |a Hochschulschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Bonden |0 (DE-588)4232594-8 |D s |
| 689 | 0 | 1 | |a Leistungshalbleiter |0 (DE-588)4167286-0 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Leistungshalbleiter |0 (DE-588)4167286-0 |D s |
| 689 | 1 | 1 | |a Anschluss |g Elektrotechnik |0 (DE-588)4295385-6 |D s |
| 689 | 1 | 2 | |a Steckverbindung |0 (DE-588)4140633-3 |D s |
| 689 | 1 | 3 | |a Kupferdraht |0 (DE-588)4166101-1 |D s |
| 689 | 1 | 4 | |a Ultraschallbonden |0 (DE-588)1045772771 |D s |
| 689 | 1 | |5 DE-604 | |
| 710 | 2 | |a Shaker Verlag |0 (DE-588)1064118135 |4 pbl | |
| 830 | 0 | |a Schriften des Lehrstuhls für Dynamik und Mechatronik |v 15 |w (DE-604)BV041986754 |9 15 | |
| 856 | 4 | 2 | |m DNB Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=034362128&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-034362128 | ||
| 883 | 1 | |8 1\p |a vlb |d 20221210 |q DE-101 |u https://d-nb.info/provenance/plan#vlb | |
Datensatz im Suchindex
| _version_ | 1804185444683874304 |
|---|---|
| adam_text | CONTENTS
NOMENCLATURE
XI
1
INTRODUCTION
1
1.1
PACKAGING
OF
SEMICONDUCTOR
POWER
MODULES
...........................................
2
1.2
BOND-POSITION-DEPENDING
JOINING
CONDITIONS
AND
CHALLENGES
.....................
5
1.3
CLASSIFICATION
OF
WIRE
BONDING
INTO
JOINING
TECHNOLOGIES
..........................
6
1.3.1
COMMONLY-USED
COLD
WELDING
PROCESSES
........................................
6
1.3.2
ULTRASONIC
BASED
JOINING
TECHNOLOGIES
...........................................
7
1.4
CONTRIBUTION
OF
THIS
THESIS
...........................................................................
9
2
STATE
OF
SCIENTIFIC
KNOWLEDGE
OF
WIRE
BONDING
PROCESSES
11
2.1
FUNCTIONING
OF
ULTRASONIC
WIRE
BONDING
...................................................
11
2.1.1
VIBRATION
SYSTEM
OF
ULTRASONIC
WIRE
BOND
MACHINES
....................
13
2.1.2
FUNCTIONALITY
AND
MATERIALS
OF
WIRE
BONDING
TOOLS
..........................
18
2.1.3
ULTRASONIC
SOFTENING
EFFECT
............................................................
21
2.1.4
MATERIAL
CHARACTERISTICS
OF
COPPER
WIRES
AND
COPPER
SUBSTRATES
.
.
25
2.1.5
DETERMINATION
OF
JOINING
QUALITY
...................................................
27
2.2
FRICTION
MODELING
OF
SOLID
BODIES
...............................................................
31
2.2.1
SURFACE
FRICTION
MODELING
..............................................................
31
2.2.2
ABRASION
MODELING
.......................................................................
35
2.3
CONTRIBUTING
FACTORS
FOR
COLD
WELD
PROCESSES
...........................................
36
2.3.1
CONTAMINANT
AND
OXIDE
LAYERS
......................................................
36
2.3.2
PLASTIC
DEFORMATION
AND
SURFACE
APPROACHING
............................
.
38
2.4
MODELING
APPROACHES
FOR
DIFFERENT
COLD
WELD
PROCESSES
..........................
38
2.4.1
MODELING
OF
THE
BALL/WEDGE
WIRE
BONDING
PROCESS
.......................
40
2.4.2
MODELING
OF
THE
WEDGE/WEDGE
WIRE
BONDING
PROCESS
.................
42
3
FRICTION
APPROACH
FOR
MODELING
THE
JOINING
PROCESS
47
3.1
ESTIMATING
THE
ULTRASONIC
SOFTENING
EFFECT
.................................................
58
3.2
MODELING
THE
PRE-DEFORMATION
OF
WIRE
AND
SUBSTRATE
...............................
59
3.3
ELASTO-PLASTIC
DEFORMATION
DURING
WIRE
BONDING
........................................
62
3.4
PREDICTING
THE
NORMAL
PRESSURE
DISTRIBUTION
IN
THE
CONTACT
AREAS
...........
64
3.4.1
INFLUENCE
OF
THE
TOOL
EXCITATION
ON
THE
PRESSURE
DISTRIBUTIONS
.
...
66
3.4.2
INFLUENCE
OF
THE
ADHESION
ON
THE
PRESSURE
DISTRIBUTIONS
.....
67
3.4.3
INFLUENCE
OF
THE
TOOL
GEOMETRY
ON
THE
NORMAL
PRESSURE
DISTRIBUTION
68
3.5
MODELING
THE
CLAMPING
OF
TOOL
AND
WIRE
............................................
72
3.5.1
MODELING
APPROACH
TO
DETERMINE
TANGENTIAL
FORCE
TRANSMISSION
CHAR
ACTERISTICS
OF
BOND
TOOLS
...............................................................
75
3.5.2
TOOL-SHAPE-DEPENDENT
TRANSMITTABLE
TANGENTIAL
FORCES
.................
77
3.5.3
IMPLEMENTATION
OF
TANGENTIAL-FORCE
DISPLACEMENT
CURVES
INTO
ANA
LYTICAL
MODEL
...................................................................................
80
3.6
MODELING
THE
FRICTION
BETWEEN
WIRE
AND
SUBSTRATE
..................................
80
3.6.1
DETERMINATION
OF
CONTACT
STIFFNESS
BETWEEN
WIRE
AND
SUBSTRATE
.
.
82
3.6.2
MASING
MODEL
................................................................................
84
3.6.3
COUPLED
POINT
CONTACT
ELEMENT
SIMULATION
...................................
86
3.7
METALLIC
JOINT
FORMING
MODEL
FOR
PREDICTING
MICRO
WELDS
.............................
97
3.8
PREDICTING
THE
BONDING
QUALITY
AND
THE
SHEAR
FORCE
VALUE
..........................
102
3.9
EXPERIMENTAL
VALIDATION
OF
THE
WIRE
BOND
MODEL
.........................................
107
3.10
SUMMARY
AND
COMPARISON
OF
THE
FRICTION
MODEL
APPROACH
TO
PUBLISHED
MODELS
...........................................................................................................
115
4
SUBSTRATE
DEFORMATION
AND
SUBSTRATE
VIBRATION
INDUCED
DISTURBANCES
117
4.1
INFLUENCE
OF
STATIC
MECHANICAL
DEFORMATION
ON
THE
BOND
QUALITY
..............
118
4.1.1
MECHANICAL
FIXATION
OF
MOLDED
CONNECTOR
PADS
IN
POWER
SEMICON
DUCTOR
MODULES
.....................................................................
118
4.1.2
MEASURING
AND
MODELING
OF
THE
QUASI-STATIC
MECHANICAL
DEFORMA
TION
OF
POWER
SEMICONDUCTOR
MODULES
..............................................
121
4.1.3
INFLUENCE
DETERMINATION
OF
TILTING
ANGLE
ON
THE
BOND
QUALITY
....
122
4.2
INFLUENCE
OF
SUBSTRATE
VIBRATIONS
ON
THE
BOND
QUALITY
...................................
131
4.3
INFLUENCES
OF
POWER
MODULE
VIBRATIONS
ON
THE
BOND
QUALITY
........................
138
4.3.1
INFLUENCE
OF
CLAMPING
DEVICE
ON
THE
MECHANICAL
BOND
POSITION
PROPERTIES
..........................................................................................
141
4.3.2
MEASURING
AND
MODELING
OF
MODULE
VIBRATIONS
.................................
144
4.3.3
MODEL
TO
PREDICT
SUBSTRATE
VIBRATION
INFLUENCES
ON
THE
BOND
QUALITY
150
5
SUMMARY
AND
CONCLUSIONS
157
BIBLIOGRAPHY
161
|
| adam_txt |
CONTENTS
NOMENCLATURE
XI
1
INTRODUCTION
1
1.1
PACKAGING
OF
SEMICONDUCTOR
POWER
MODULES
.
2
1.2
BOND-POSITION-DEPENDING
JOINING
CONDITIONS
AND
CHALLENGES
.
5
1.3
CLASSIFICATION
OF
WIRE
BONDING
INTO
JOINING
TECHNOLOGIES
.
6
1.3.1
COMMONLY-USED
COLD
WELDING
PROCESSES
.
6
1.3.2
ULTRASONIC
BASED
JOINING
TECHNOLOGIES
.
7
1.4
CONTRIBUTION
OF
THIS
THESIS
.
9
2
STATE
OF
SCIENTIFIC
KNOWLEDGE
OF
WIRE
BONDING
PROCESSES
11
2.1
FUNCTIONING
OF
ULTRASONIC
WIRE
BONDING
.
11
2.1.1
VIBRATION
SYSTEM
OF
ULTRASONIC
WIRE
BOND
MACHINES
.
13
2.1.2
FUNCTIONALITY
AND
MATERIALS
OF
WIRE
BONDING
TOOLS
.
18
2.1.3
ULTRASONIC
SOFTENING
EFFECT
.
21
2.1.4
MATERIAL
CHARACTERISTICS
OF
COPPER
WIRES
AND
COPPER
SUBSTRATES
.
.
25
2.1.5
DETERMINATION
OF
JOINING
QUALITY
.
27
2.2
FRICTION
MODELING
OF
SOLID
BODIES
.
31
2.2.1
SURFACE
FRICTION
MODELING
.
31
2.2.2
ABRASION
MODELING
.
35
2.3
CONTRIBUTING
FACTORS
FOR
COLD
WELD
PROCESSES
.
36
2.3.1
CONTAMINANT
AND
OXIDE
LAYERS
.
36
2.3.2
PLASTIC
DEFORMATION
AND
SURFACE
APPROACHING
.
.
38
2.4
MODELING
APPROACHES
FOR
DIFFERENT
COLD
WELD
PROCESSES
.
38
2.4.1
MODELING
OF
THE
BALL/WEDGE
WIRE
BONDING
PROCESS
.
40
2.4.2
MODELING
OF
THE
WEDGE/WEDGE
WIRE
BONDING
PROCESS
.
42
3
FRICTION
APPROACH
FOR
MODELING
THE
JOINING
PROCESS
47
3.1
ESTIMATING
THE
ULTRASONIC
SOFTENING
EFFECT
.
58
3.2
MODELING
THE
PRE-DEFORMATION
OF
WIRE
AND
SUBSTRATE
.
59
3.3
ELASTO-PLASTIC
DEFORMATION
DURING
WIRE
BONDING
.
62
3.4
PREDICTING
THE
NORMAL
PRESSURE
DISTRIBUTION
IN
THE
CONTACT
AREAS
.
64
3.4.1
INFLUENCE
OF
THE
TOOL
EXCITATION
ON
THE
PRESSURE
DISTRIBUTIONS
.
.
66
3.4.2
INFLUENCE
OF
THE
ADHESION
ON
THE
PRESSURE
DISTRIBUTIONS
.
67
3.4.3
INFLUENCE
OF
THE
TOOL
GEOMETRY
ON
THE
NORMAL
PRESSURE
DISTRIBUTION
68
3.5
MODELING
THE
CLAMPING
OF
TOOL
AND
WIRE
.
72
3.5.1
MODELING
APPROACH
TO
DETERMINE
TANGENTIAL
FORCE
TRANSMISSION
CHAR
ACTERISTICS
OF
BOND
TOOLS
.
75
3.5.2
TOOL-SHAPE-DEPENDENT
TRANSMITTABLE
TANGENTIAL
FORCES
.
77
3.5.3
IMPLEMENTATION
OF
TANGENTIAL-FORCE
DISPLACEMENT
CURVES
INTO
ANA
LYTICAL
MODEL
.
80
3.6
MODELING
THE
FRICTION
BETWEEN
WIRE
AND
SUBSTRATE
.
80
3.6.1
DETERMINATION
OF
CONTACT
STIFFNESS
BETWEEN
WIRE
AND
SUBSTRATE
.
.
82
3.6.2
MASING
MODEL
.
84
3.6.3
COUPLED
POINT
CONTACT
ELEMENT
SIMULATION
.
86
3.7
METALLIC
JOINT
FORMING
MODEL
FOR
PREDICTING
MICRO
WELDS
.
97
3.8
PREDICTING
THE
BONDING
QUALITY
AND
THE
SHEAR
FORCE
VALUE
.
102
3.9
EXPERIMENTAL
VALIDATION
OF
THE
WIRE
BOND
MODEL
.
107
3.10
SUMMARY
AND
COMPARISON
OF
THE
FRICTION
MODEL
APPROACH
TO
PUBLISHED
MODELS
.
115
4
SUBSTRATE
DEFORMATION
AND
SUBSTRATE
VIBRATION
INDUCED
DISTURBANCES
117
4.1
INFLUENCE
OF
STATIC
MECHANICAL
DEFORMATION
ON
THE
BOND
QUALITY
.
118
4.1.1
MECHANICAL
FIXATION
OF
MOLDED
CONNECTOR
PADS
IN
POWER
SEMICON
DUCTOR
MODULES
.
118
4.1.2
MEASURING
AND
MODELING
OF
THE
QUASI-STATIC
MECHANICAL
DEFORMA
TION
OF
POWER
SEMICONDUCTOR
MODULES
.
121
4.1.3
INFLUENCE
DETERMINATION
OF
TILTING
ANGLE
ON
THE
BOND
QUALITY
.
122
4.2
INFLUENCE
OF
SUBSTRATE
VIBRATIONS
ON
THE
BOND
QUALITY
.
131
4.3
INFLUENCES
OF
POWER
MODULE
VIBRATIONS
ON
THE
BOND
QUALITY
.
138
4.3.1
INFLUENCE
OF
CLAMPING
DEVICE
ON
THE
MECHANICAL
BOND
POSITION
PROPERTIES
.
141
4.3.2
MEASURING
AND
MODELING
OF
MODULE
VIBRATIONS
.
144
4.3.3
MODEL
TO
PREDICT
SUBSTRATE
VIBRATION
INFLUENCES
ON
THE
BOND
QUALITY
150
5
SUMMARY
AND
CONCLUSIONS
157
BIBLIOGRAPHY
161 |
| any_adam_object | 1 |
| any_adam_object_boolean | 1 |
| author | Althoff, Simon 1982- |
| author_GND | (DE-588)1288608330 |
| author_facet | Althoff, Simon 1982- |
| author_role | aut |
| author_sort | Althoff, Simon 1982- |
| author_variant | s a sa |
| building | Verbundindex |
| bvnumber | BV049100588 |
| classification_rvk | ZN 4192 |
| ctrlnum | (OCoLC)1401213403 (DE-599)DNB1275236227 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | 1. Auflage |
| format | Thesis Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02846nam a22006858cb4500</leader><controlfield tag="001">BV049100588</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20230829 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">230815s2023 gw a||| m||| 00||| eng d</controlfield><datafield tag="015" ind1=" " ind2=" "><subfield code="a">22,N50</subfield><subfield code="2">dnb</subfield></datafield><datafield tag="016" ind1="7" ind2=" "><subfield code="a">1275236227</subfield><subfield code="2">DE-101</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783844089035</subfield><subfield code="c">: EUR 48.80 (DE), EUR 48.80 (AT), CHF 61.10 (freier Preis)</subfield><subfield code="9">978-3-8440-8903-5</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3844089039</subfield><subfield code="9">3-8440-8903-9</subfield></datafield><datafield tag="024" ind1="3" ind2=" "><subfield code="a">9783844089035</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1401213403</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)DNB1275236227</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">gw</subfield><subfield code="c">XA-DE-NW</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="8">1\p</subfield><subfield code="a">620</subfield><subfield code="2">23sdnb</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Althoff, Simon</subfield><subfield code="d">1982-</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)1288608330</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach</subfield><subfield code="c">Simon Althoff</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">1. Auflage</subfield></datafield><datafield tag="263" ind1=" " ind2=" "><subfield code="a">202301</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Düren</subfield><subfield code="b">Shaker</subfield><subfield code="c">2023</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">170 Seiten</subfield><subfield code="b">Illustrationen, Diagramme</subfield><subfield code="c">21 cm x 14.8 cm, 284 g</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Schriften des Lehrstuhls für Dynamik und Mechatronik</subfield><subfield code="v">15</subfield></datafield><datafield tag="502" ind1=" " ind2=" "><subfield code="b">Dissertation</subfield><subfield code="c">Universität Paderborn</subfield><subfield code="d">2022</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Ultraschallbonden</subfield><subfield code="0">(DE-588)1045772771</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Leistungshalbleiter</subfield><subfield code="0">(DE-588)4167286-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Steckverbindung</subfield><subfield code="0">(DE-588)4140633-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Kupferdraht</subfield><subfield code="0">(DE-588)4166101-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Anschluss</subfield><subfield code="g">Elektrotechnik</subfield><subfield code="0">(DE-588)4295385-6</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">heavy copper bonding</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">point-contact-element</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">friction model</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">wire bonding</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">quality prediction</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)4113937-9</subfield><subfield code="a">Hochschulschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Leistungshalbleiter</subfield><subfield code="0">(DE-588)4167286-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Leistungshalbleiter</subfield><subfield code="0">(DE-588)4167286-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="1"><subfield code="a">Anschluss</subfield><subfield code="g">Elektrotechnik</subfield><subfield code="0">(DE-588)4295385-6</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="2"><subfield code="a">Steckverbindung</subfield><subfield code="0">(DE-588)4140633-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="3"><subfield code="a">Kupferdraht</subfield><subfield code="0">(DE-588)4166101-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="4"><subfield code="a">Ultraschallbonden</subfield><subfield code="0">(DE-588)1045772771</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">Shaker Verlag</subfield><subfield code="0">(DE-588)1064118135</subfield><subfield code="4">pbl</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Schriften des Lehrstuhls für Dynamik und Mechatronik</subfield><subfield code="v">15</subfield><subfield code="w">(DE-604)BV041986754</subfield><subfield code="9">15</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">DNB Datenaustausch</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=034362128&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-034362128</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">vlb</subfield><subfield code="d">20221210</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#vlb</subfield></datafield></record></collection> |
| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV049100588 |
| illustrated | Illustrated |
| index_date | 2024-07-03T22:32:32Z |
| indexdate | 2024-07-10T09:55:20Z |
| institution | BVB |
| institution_GND | (DE-588)1064118135 |
| isbn | 9783844089035 3844089039 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-034362128 |
| oclc_num | 1401213403 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | 170 Seiten Illustrationen, Diagramme 21 cm x 14.8 cm, 284 g |
| publishDate | 2023 |
| publishDateSearch | 2023 |
| publishDateSort | 2023 |
| publisher | Shaker |
| record_format | marc |
| series | Schriften des Lehrstuhls für Dynamik und Mechatronik |
| series2 | Schriften des Lehrstuhls für Dynamik und Mechatronik |
| spelling | Althoff, Simon 1982- Verfasser (DE-588)1288608330 aut Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach Simon Althoff 1. Auflage 202301 Düren Shaker 2023 170 Seiten Illustrationen, Diagramme 21 cm x 14.8 cm, 284 g txt rdacontent n rdamedia nc rdacarrier Schriften des Lehrstuhls für Dynamik und Mechatronik 15 Dissertation Universität Paderborn 2022 Ultraschallbonden (DE-588)1045772771 gnd rswk-swf Leistungshalbleiter (DE-588)4167286-0 gnd rswk-swf Steckverbindung (DE-588)4140633-3 gnd rswk-swf Bonden (DE-588)4232594-8 gnd rswk-swf Kupferdraht (DE-588)4166101-1 gnd rswk-swf Anschluss Elektrotechnik (DE-588)4295385-6 gnd rswk-swf heavy copper bonding point-contact-element friction model wire bonding quality prediction (DE-588)4113937-9 Hochschulschrift gnd-content Bonden (DE-588)4232594-8 s Leistungshalbleiter (DE-588)4167286-0 s DE-604 Anschluss Elektrotechnik (DE-588)4295385-6 s Steckverbindung (DE-588)4140633-3 s Kupferdraht (DE-588)4166101-1 s Ultraschallbonden (DE-588)1045772771 s Shaker Verlag (DE-588)1064118135 pbl Schriften des Lehrstuhls für Dynamik und Mechatronik 15 (DE-604)BV041986754 15 DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=034362128&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis 1\p vlb 20221210 DE-101 https://d-nb.info/provenance/plan#vlb |
| spellingShingle | Althoff, Simon 1982- Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach Schriften des Lehrstuhls für Dynamik und Mechatronik Ultraschallbonden (DE-588)1045772771 gnd Leistungshalbleiter (DE-588)4167286-0 gnd Steckverbindung (DE-588)4140633-3 gnd Bonden (DE-588)4232594-8 gnd Kupferdraht (DE-588)4166101-1 gnd Anschluss Elektrotechnik (DE-588)4295385-6 gnd |
| subject_GND | (DE-588)1045772771 (DE-588)4167286-0 (DE-588)4140633-3 (DE-588)4232594-8 (DE-588)4166101-1 (DE-588)4295385-6 (DE-588)4113937-9 |
| title | Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach |
| title_auth | Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach |
| title_exact_search | Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach |
| title_exact_search_txtP | Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach |
| title_full | Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach Simon Althoff |
| title_fullStr | Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach Simon Althoff |
| title_full_unstemmed | Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach Simon Althoff |
| title_short | Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach |
| title_sort | predicting the bond quality of heavy copper wire bonds using a friction model approach |
| topic | Ultraschallbonden (DE-588)1045772771 gnd Leistungshalbleiter (DE-588)4167286-0 gnd Steckverbindung (DE-588)4140633-3 gnd Bonden (DE-588)4232594-8 gnd Kupferdraht (DE-588)4166101-1 gnd Anschluss Elektrotechnik (DE-588)4295385-6 gnd |
| topic_facet | Ultraschallbonden Leistungshalbleiter Steckverbindung Bonden Kupferdraht Anschluss Elektrotechnik Hochschulschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=034362128&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| volume_link | (DE-604)BV041986754 |
| work_keys_str_mv | AT althoffsimon predictingthebondqualityofheavycopperwirebondsusingafrictionmodelapproach AT shakerverlag predictingthebondqualityofheavycopperwirebondsusingafrictionmodelapproach |