Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction:
Gespeichert in:
Körperschaft: | |
---|---|
Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
New York,NY,United States
Association for Computing Machinery
2022
|
Schriftenreihe: | ACM Conferences
|
Online-Zugang: | UBM01 URL des Erstveröffentlichers |
Beschreibung: | 1 Online-Ressource (758 Seiten) |
ISBN: | 9781450391474 |
Internformat
MARC
LEADER | 00000nmm a2200000 c 4500 | ||
---|---|---|---|
001 | BV048955053 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 230510m2022 |||| o||u| ||||||eng d | ||
020 | |a 9781450391474 |9 978-1-4503-9147-4 | ||
035 | |a (ZDB-15-ACM)10.1145/3490149 | ||
035 | |a (OCoLC)1379412718 | ||
035 | |a (DE-599)BVBBV048955053 | ||
040 | |a DE-604 |b ger | ||
041 | 0 | |a eng | |
049 | |a DE-19 | ||
110 | 2 | |a TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |d 2022 |c Daejeon Republic of Korea |e Verfasser |4 aut | |
245 | 1 | 0 | |a Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
246 | 1 | 0 | |a TEI '22 |
264 | 1 | |a New York,NY,United States |b Association for Computing Machinery |c 2022 | |
300 | |a 1 Online-Ressource (758 Seiten) | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a ACM Conferences | |
856 | 4 | 0 | |u https://dl.acm.org/action/showBook?doi=10.1145%2F3490149 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
912 | |a ZDB-15-ACM | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-034218899 | ||
966 | e | |u https://dl.acm.org/action/showBook?doi=10.1145%2F3490149 |l UBM01 |p ZDB-15-ACM |x Verlag |3 Volltext |
Datensatz im Suchindex
_version_ | 1804185182319673344 |
---|---|
adam_txt | |
any_adam_object | |
any_adam_object_boolean | |
author_corporate | TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
author_corporate_role | aut |
author_facet | TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
author_sort | TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
building | Verbundindex |
bvnumber | BV048955053 |
collection | ZDB-15-ACM |
ctrlnum | (ZDB-15-ACM)10.1145/3490149 (OCoLC)1379412718 (DE-599)BVBBV048955053 |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01262nmm a2200325 c 4500</leader><controlfield tag="001">BV048955053</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">230510m2022 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781450391474</subfield><subfield code="9">978-1-4503-9147-4</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-15-ACM)10.1145/3490149</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1379412718</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV048955053</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-19</subfield></datafield><datafield tag="110" ind1="2" ind2=" "><subfield code="a">TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction</subfield><subfield code="d">2022</subfield><subfield code="c">Daejeon Republic of Korea</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction</subfield></datafield><datafield tag="246" ind1="1" ind2="0"><subfield code="a">TEI '22</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">New York,NY,United States</subfield><subfield code="b">Association for Computing Machinery</subfield><subfield code="c">2022</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (758 Seiten)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">ACM Conferences</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://dl.acm.org/action/showBook?doi=10.1145%2F3490149</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-15-ACM</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-034218899</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://dl.acm.org/action/showBook?doi=10.1145%2F3490149</subfield><subfield code="l">UBM01</subfield><subfield code="p">ZDB-15-ACM</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
id | DE-604.BV048955053 |
illustrated | Not Illustrated |
index_date | 2024-07-03T21:59:00Z |
indexdate | 2024-07-10T09:51:10Z |
institution | BVB |
isbn | 9781450391474 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-034218899 |
oclc_num | 1379412718 |
open_access_boolean | |
owner | DE-19 DE-BY-UBM |
owner_facet | DE-19 DE-BY-UBM |
physical | 1 Online-Ressource (758 Seiten) |
psigel | ZDB-15-ACM |
publishDate | 2022 |
publishDateSearch | 2022 |
publishDateSort | 2022 |
publisher | Association for Computing Machinery |
record_format | marc |
series2 | ACM Conferences |
spelling | TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction 2022 Daejeon Republic of Korea Verfasser aut Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction TEI '22 New York,NY,United States Association for Computing Machinery 2022 1 Online-Ressource (758 Seiten) txt rdacontent c rdamedia cr rdacarrier ACM Conferences https://dl.acm.org/action/showBook?doi=10.1145%2F3490149 Verlag URL des Erstveröffentlichers Volltext |
spellingShingle | Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
title | Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
title_alt | TEI '22 |
title_auth | Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
title_exact_search | Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
title_exact_search_txtP | Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
title_full | Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
title_fullStr | Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
title_full_unstemmed | Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
title_short | Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction |
title_sort | sixteenth international conference on tangible embedded and embodied interaction |
url | https://dl.acm.org/action/showBook?doi=10.1145%2F3490149 |
work_keys_str_mv | AT tei22sixteenthinternationalconferenceontangibleembeddedandembodiedinteraction sixteenthinternationalconferenceontangibleembeddedandembodiedinteraction AT tei22sixteenthinternationalconferenceontangibleembeddedandembodiedinteraction tei22 |