APA (7th ed.) Citation

Keser, B., & Kroehnert, S. (2022). Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces: High performance compute and system-in-package. Wiley.

Chicago Style (17th ed.) Citation

Keser, Beth, and Steffen Kroehnert. Embedded and Fan-out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-package. Hoboken, New Jersey: Wiley, 2022.

MLA (9th ed.) Citation

Keser, Beth, and Steffen Kroehnert. Embedded and Fan-out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-package. Wiley, 2022.