Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces: high performance compute and system-in-package
Gespeichert in:
| Weitere Verfasser: | , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Hoboken, New Jersey
Wiley
[2022]
|
| Schlagworte: | |
| Beschreibung: | Description based on publisher supplied metadata and other sources |
| Beschreibung: | xv, 296 Seiten Illustrationen, Diagramme |
| ISBN: | 9781119793779 |
Internformat
MARC
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| 245 | 1 | 0 | |a Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces |b high performance compute and system-in-package |c edited by Beth Keser, Steffen Kröhnert |
| 264 | 1 | |a Hoboken, New Jersey |b Wiley |c [2022] | |
| 264 | 4 | |c © 2022 | |
| 300 | |a xv, 296 Seiten |b Illustrationen, Diagramme | ||
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| 337 | |b n |2 rdamedia | ||
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| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Keser, Beth |d 1971- |0 (DE-588)1188486934 |4 edt | |
| 700 | 1 | |a Kroehnert, Steffen |d 1970- |0 (DE-588)1188487035 |4 edt | |
| 776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe |z 978-1-119-79384-7 |
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Datensatz im Suchindex
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| adam_txt | |
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| any_adam_object_boolean | |
| author2 | Keser, Beth 1971- Kroehnert, Steffen 1970- |
| author2_role | edt edt |
| author2_variant | b k bk s k sk |
| author_GND | (DE-588)1188486934 (DE-588)1188487035 |
| author_facet | Keser, Beth 1971- Kroehnert, Steffen 1970- |
| building | Verbundindex |
| bvnumber | BV048514786 |
| classification_rvk | ZN 4192 |
| ctrlnum | (OCoLC)1355307950 (DE-599)BVBBV048514786 |
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| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.395 |
| dewey-search | 621.395 |
| dewey-sort | 3621.395 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV048514786 |
| illustrated | Illustrated |
| index_date | 2024-07-03T20:48:46Z |
| indexdate | 2024-07-10T09:40:14Z |
| institution | BVB |
| isbn | 9781119793779 |
| language | English |
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| owner_facet | DE-83 |
| physical | xv, 296 Seiten Illustrationen, Diagramme |
| publishDate | 2022 |
| publishDateSearch | 2022 |
| publishDateSort | 2022 |
| publisher | Wiley |
| record_format | marc |
| spelling | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package edited by Beth Keser, Steffen Kröhnert Hoboken, New Jersey Wiley [2022] © 2022 xv, 296 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Description based on publisher supplied metadata and other sources Wafer level packaging (DE-588)1058582143 gnd rswk-swf Wafer level packaging (DE-588)1058582143 s DE-604 Keser, Beth 1971- (DE-588)1188486934 edt Kroehnert, Steffen 1970- (DE-588)1188487035 edt Erscheint auch als Online-Ausgabe 978-1-119-79384-7 |
| spellingShingle | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package Wafer level packaging (DE-588)1058582143 gnd |
| subject_GND | (DE-588)1058582143 |
| title | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package |
| title_auth | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package |
| title_exact_search | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package |
| title_exact_search_txtP | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package |
| title_full | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package edited by Beth Keser, Steffen Kröhnert |
| title_fullStr | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package edited by Beth Keser, Steffen Kröhnert |
| title_full_unstemmed | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces high performance compute and system-in-package edited by Beth Keser, Steffen Kröhnert |
| title_short | Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces |
| title_sort | embedded and fan out wafer and panel level packaging technologies for advanced application spaces high performance compute and system in package |
| title_sub | high performance compute and system-in-package |
| topic | Wafer level packaging (DE-588)1058582143 gnd |
| topic_facet | Wafer level packaging |
| work_keys_str_mv | AT keserbeth embeddedandfanoutwaferandpanellevelpackagingtechnologiesforadvancedapplicationspaceshighperformancecomputeandsysteminpackage AT kroehnertsteffen embeddedandfanoutwaferandpanellevelpackagingtechnologiesforadvancedapplicationspaceshighperformancecomputeandsysteminpackage |