Thermal and structural electronic packaging analysis for space and extreme environments:
"Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to v...
Gespeichert in:
Hauptverfasser: | , , |
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Format: | Buch |
Sprache: | English |
Veröffentlicht: |
Boca Raton, FL
CRC Press
2022
|
Ausgabe: | First edition |
Schriftenreihe: | Resilience and sustainability in civil, mechanical, aerospace and manufacturing engineering systems
|
Schlagworte: | |
Online-Zugang: | Inhaltsverzeichnis |
Zusammenfassung: | "Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space"-- |
Beschreibung: | Includes bibliographical references and index |
Beschreibung: | xiii, 289 Seiten |
ISBN: | 9781032160818 9781032160856 |
Internformat
MARC
LEADER | 00000nam a2200000 c 4500 | ||
---|---|---|---|
001 | BV048372980 | ||
003 | DE-604 | ||
005 | 20221004 | ||
007 | t | ||
008 | 220721s2022 xxu |||| 00||| eng d | ||
020 | |a 9781032160818 |c hbk |9 978-1-03-216081-8 | ||
020 | |a 9781032160856 |c pbk |9 978-1-03-216085-6 | ||
035 | |a (OCoLC)1346082053 | ||
035 | |a (DE-599)KXP1770677011 | ||
040 | |a DE-604 |b ger |e rda | ||
041 | 0 | |a eng | |
044 | |a xxu |c XD-US |a xxk |c XA-GB | ||
049 | |a DE-83 |a DE-859 | ||
082 | 0 | |a 621.381/046 | |
084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
100 | 1 | |a Cepeda-Rizo, Juan |e Verfasser |4 aut | |
245 | 1 | 0 | |a Thermal and structural electronic packaging analysis for space and extreme environments |c Juan Cepeda-Rizo, Jeremiah Gayle, and Joshua Ravich |
250 | |a First edition | ||
264 | 1 | |a Boca Raton, FL |b CRC Press |c 2022 | |
300 | |a xiii, 289 Seiten | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
490 | 0 | |a Resilience and sustainability in civil, mechanical, aerospace and manufacturing engineering systems | |
500 | |a Includes bibliographical references and index | ||
520 | 3 | |a "Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. | |
520 | 3 | |a This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. | |
520 | 3 | |a Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space"-- | |
650 | 0 | 7 | |a Thermomechanische Eigenschaft |0 (DE-588)4194417-3 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
653 | 0 | |a Electronic packaging | |
653 | 0 | |a Electronic apparatus and appliances / Reliability | |
653 | 0 | |a Space vehicles / Electronic equipment / Design and construction | |
653 | 0 | |a Extreme environments | |
689 | 0 | 0 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
689 | 0 | |5 DE-604 | |
689 | 1 | 0 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
689 | 1 | |5 DE-604 | |
689 | 2 | 0 | |a Thermomechanische Eigenschaft |0 (DE-588)4194417-3 |D s |
689 | 2 | |5 DE-604 | |
700 | 1 | |a Gayle, Jeremiah |e Verfasser |4 aut | |
700 | 1 | |a Ravich, Joshua |e Verfasser |4 aut | |
776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe |z 978-1-003-24700-5 |
856 | 4 | 2 | |m B:DE-89 |m V:DE-601 |q pdf/application |u https://www.gbv.de/dms/tib-ub-hannover/1770677011.pdf |3 Inhaltsverzeichnis |
999 | |a oai:aleph.bib-bvb.de:BVB01-033751998 |
Datensatz im Suchindex
_version_ | 1804184248745197568 |
---|---|
adam_txt | |
any_adam_object | |
any_adam_object_boolean | |
author | Cepeda-Rizo, Juan Gayle, Jeremiah Ravich, Joshua |
author_facet | Cepeda-Rizo, Juan Gayle, Jeremiah Ravich, Joshua |
author_role | aut aut aut |
author_sort | Cepeda-Rizo, Juan |
author_variant | j c r jcr j g jg j r jr |
building | Verbundindex |
bvnumber | BV048372980 |
classification_rvk | ZN 4192 |
ctrlnum | (OCoLC)1346082053 (DE-599)KXP1770677011 |
dewey-full | 621.381/046 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381/046 |
dewey-search | 621.381/046 |
dewey-sort | 3621.381 246 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
edition | First edition |
format | Book |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>04411nam a2200577 c 4500</leader><controlfield tag="001">BV048372980</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20221004 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">220721s2022 xxu |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781032160818</subfield><subfield code="c">hbk</subfield><subfield code="9">978-1-03-216081-8</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781032160856</subfield><subfield code="c">pbk</subfield><subfield code="9">978-1-03-216085-6</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1346082053</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)KXP1770677011</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">xxu</subfield><subfield code="c">XD-US</subfield><subfield code="a">xxk</subfield><subfield code="c">XA-GB</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield><subfield code="a">DE-859</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/046</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Cepeda-Rizo, Juan</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Thermal and structural electronic packaging analysis for space and extreme environments</subfield><subfield code="c">Juan Cepeda-Rizo, Jeremiah Gayle, and Joshua Ravich</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">First edition</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boca Raton, FL</subfield><subfield code="b">CRC Press</subfield><subfield code="c">2022</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xiii, 289 Seiten</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Resilience and sustainability in civil, mechanical, aerospace and manufacturing engineering systems</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="520" ind1="3" ind2=" "><subfield code="a">"Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. </subfield></datafield><datafield tag="520" ind1="3" ind2=" "><subfield code="a">This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. </subfield></datafield><datafield tag="520" ind1="3" ind2=" "><subfield code="a">Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space"--</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Thermomechanische Eigenschaft</subfield><subfield code="0">(DE-588)4194417-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electronic packaging</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electronic apparatus and appliances / Reliability</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Space vehicles / Electronic equipment / Design and construction</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Extreme environments</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="2" ind2="0"><subfield code="a">Thermomechanische Eigenschaft</subfield><subfield code="0">(DE-588)4194417-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gayle, Jeremiah</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ravich, Joshua</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Online-Ausgabe</subfield><subfield code="z">978-1-003-24700-5</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">B:DE-89</subfield><subfield code="m">V:DE-601</subfield><subfield code="q">pdf/application</subfield><subfield code="u">https://www.gbv.de/dms/tib-ub-hannover/1770677011.pdf</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-033751998</subfield></datafield></record></collection> |
id | DE-604.BV048372980 |
illustrated | Not Illustrated |
index_date | 2024-07-03T20:16:34Z |
indexdate | 2024-07-10T09:36:20Z |
institution | BVB |
isbn | 9781032160818 9781032160856 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-033751998 |
oclc_num | 1346082053 |
open_access_boolean | |
owner | DE-83 DE-859 |
owner_facet | DE-83 DE-859 |
physical | xiii, 289 Seiten |
publishDate | 2022 |
publishDateSearch | 2022 |
publishDateSort | 2022 |
publisher | CRC Press |
record_format | marc |
series2 | Resilience and sustainability in civil, mechanical, aerospace and manufacturing engineering systems |
spelling | Cepeda-Rizo, Juan Verfasser aut Thermal and structural electronic packaging analysis for space and extreme environments Juan Cepeda-Rizo, Jeremiah Gayle, and Joshua Ravich First edition Boca Raton, FL CRC Press 2022 xiii, 289 Seiten txt rdacontent n rdamedia nc rdacarrier Resilience and sustainability in civil, mechanical, aerospace and manufacturing engineering systems Includes bibliographical references and index "Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space"-- Thermomechanische Eigenschaft (DE-588)4194417-3 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Electronic packaging Electronic apparatus and appliances / Reliability Space vehicles / Electronic equipment / Design and construction Extreme environments Elektronisches Bauelement (DE-588)4014360-0 s DE-604 Gehäuse (DE-588)4156307-4 s Thermomechanische Eigenschaft (DE-588)4194417-3 s Gayle, Jeremiah Verfasser aut Ravich, Joshua Verfasser aut Erscheint auch als Online-Ausgabe 978-1-003-24700-5 B:DE-89 V:DE-601 pdf/application https://www.gbv.de/dms/tib-ub-hannover/1770677011.pdf Inhaltsverzeichnis |
spellingShingle | Cepeda-Rizo, Juan Gayle, Jeremiah Ravich, Joshua Thermal and structural electronic packaging analysis for space and extreme environments Thermomechanische Eigenschaft (DE-588)4194417-3 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Gehäuse (DE-588)4156307-4 gnd |
subject_GND | (DE-588)4194417-3 (DE-588)4014360-0 (DE-588)4156307-4 |
title | Thermal and structural electronic packaging analysis for space and extreme environments |
title_auth | Thermal and structural electronic packaging analysis for space and extreme environments |
title_exact_search | Thermal and structural electronic packaging analysis for space and extreme environments |
title_exact_search_txtP | Thermal and structural electronic packaging analysis for space and extreme environments |
title_full | Thermal and structural electronic packaging analysis for space and extreme environments Juan Cepeda-Rizo, Jeremiah Gayle, and Joshua Ravich |
title_fullStr | Thermal and structural electronic packaging analysis for space and extreme environments Juan Cepeda-Rizo, Jeremiah Gayle, and Joshua Ravich |
title_full_unstemmed | Thermal and structural electronic packaging analysis for space and extreme environments Juan Cepeda-Rizo, Jeremiah Gayle, and Joshua Ravich |
title_short | Thermal and structural electronic packaging analysis for space and extreme environments |
title_sort | thermal and structural electronic packaging analysis for space and extreme environments |
topic | Thermomechanische Eigenschaft (DE-588)4194417-3 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Gehäuse (DE-588)4156307-4 gnd |
topic_facet | Thermomechanische Eigenschaft Elektronisches Bauelement Gehäuse |
url | https://www.gbv.de/dms/tib-ub-hannover/1770677011.pdf |
work_keys_str_mv | AT cepedarizojuan thermalandstructuralelectronicpackaginganalysisforspaceandextremeenvironments AT gaylejeremiah thermalandstructuralelectronicpackaginganalysisforspaceandextremeenvironments AT ravichjoshua thermalandstructuralelectronicpackaginganalysisforspaceandextremeenvironments |