Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Abschlussarbeit Buch |
| Sprache: | English |
| Veröffentlicht: |
Erlangen
FAU University Press
2022
|
| Schriftenreihe: | FAU Studien aus dem Maschinenbau
Band 388 |
| Schlagworte: | |
| Online-Zugang: | kostenfrei kostenfrei kostenfrei Inhaltsverzeichnis |
| Beschreibung: | x, 112 Seiten Illustrationen, Diagramme 24 cm x 17 cm, 404 g |
| ISBN: | 9783961475070 3961475075 9783961475087 |
| DOI: | 10.25593/978-3-96147-508-7 |
Internformat
MARC
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| 100 | 1 | |a Stein, Stefan |0 (DE-588)1255654910 |4 aut | |
| 245 | 1 | 0 | |a Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |c Stefan Stein |
| 246 | 1 | 3 | |a Laserstrahlhartlöten mittels Lotformteil als Fügemethode für die Aufbau- und Verbindungstechnik für Hochtemperaturanwendungen |
| 264 | 1 | |a Erlangen |b FAU University Press |c 2022 | |
| 300 | |a x, 112 Seiten |b Illustrationen, Diagramme |c 24 cm x 17 cm, 404 g | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a FAU Studien aus dem Maschinenbau |v Band 388 | |
| 502 | |b Dissertation |c Friedrich-Alexander-Universität Erlangen-Nürnberg |d 2021 | ||
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Bonden |0 (DE-588)4232594-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verbindungstechnik |0 (DE-588)4129183-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Lasertechnologie |0 (DE-588)4166821-2 |2 gnd |9 rswk-swf |
| 653 | |a Actuator | ||
| 653 | |a Löten | ||
| 653 | |a Brazing | ||
| 653 | |a Laser | ||
| 653 | |a Verbindungstechnik | ||
| 653 | |a Soldering | ||
| 653 | |a Droplet | ||
| 653 | |a Joining | ||
| 653 | |a Electronics Packaging | ||
| 653 | |a Smart Structure | ||
| 653 | |a Casting | ||
| 653 | |a Drop on demand | ||
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Datensatz im Suchindex
| _version_ | 1804183592025194496 |
|---|---|
| adam_text | TABLE
OF
CONTENTS
LIST
OF
SYMBOLS
AND
ABBREVIATIONS
.....................................................
VII
1
INTRODUCTION
....................................................................................
I
2
STATE
OF
THE
ART
AND
METHODS
........................................................
3
2.1
AL
DIE
CASTING
....................................................................................4
2.2
HOT-PRESSING
PROCESS
.......................................................................
6
2.3
SYNOPSIS
............................................................................................
8
2.4
CONVENTIONAL
JOINING
METHODS
IN
ELECTRONICS
PACKAGING
...........
8
2.4.1
SOLDERING
.................................................................................
9
2.4.2
MICRO
WELDING
........................................................................
9
2.4.3
WIRE
BONDING
.........................................................................
9
2.4.4
GENERATION
OF
ELECTRICALLY
CONDUCTIVE
DROPLETS
.................
10
3
OBJECTIVES
......................................................................................
13
4
MATERIALS
AND
METHODS
................................................................
15
4.1
FILLER
MATERIAL
..................................................................................
15
4.2
LASER
DROP
ON
DEMAND
JOINING
(LDJ)............................................
18
4.3
PREPARATION
OF
THE
JOINING
INTERFACE
.............................................
19
5
SETUP
..............................................................................................
21
5.1
BEAM
SOURCE
....................................................................................
21
5.2
PROCESS
GAS
ATMOSPHERE
.................................................................
26
5.3
CAPILLARY
..........................................................................................
26
5.4
PROCESS
SEQUENCE
...........................................................................
29
5.5
BRAZE
PREFORMS
...............................................................................
30
6
SYSTEM
QUALIFICATION
.....................................................................
33
6.1
BEAM
GUIDANCE
AND
SHAPING
.........................................................
33
6.2
BRAZE
DETACHMENT
TIME
.................................................................
39
6.3
LONG-TERM
CAPILLARY
BEHAVIOUR
....................................................
43
7
CAPILLARY
TIME-TEMPERATURE
EVOLUTION
......................................
49
7.1
NUMERICAL
MODEL
FOR
THE
EVALUATION
OF
THE
THERMAL
CYCLE
DURING
JOINING
.................................................................................
49
7.2
WETTING
BEHAVIOUR
OF
THE
A1
2
O
3
CAPILLARY
AND
THE
MOLTEN
CUSNI2
BRAZE
...................................................................................
53
7.3
TIME-TEMPERATURE
CYCLE
OF
THE
CAPILLARY
DURING
JOINING
...........
54
7.4
SUMMARY
AND
CONCLUSIONS
............................................................
56
8
IMPACT
OF
CAPILLARY
SHAPE
ON
GAS
VELOCITY
AND
DROPLET
TRAJECTORY
.......................................................................................
57
8.1
SIMULATION
.......................................................................................
57
8.2
MACHINING
.......................................................................................
59
8.3
DROPLET
TRACKING
USING
STEREOSCOPIC
HIGH-SPEED
IMAGING
.......
62
8.3.1
LATERAL
POSITION
DEVIATION
..................................................
66
8.3.2
DROPLET
VELOCITY
....................................................................
69
9
MECHANICAL
STRENGTH
OF
GENERATED
JOINTS
...................................
73
10
ANALYTIC
MODEL
OF
THE
PROCESS
ENERGY
BALANCE
..........................
81
11
SYNOPSIS
.........................................................................................
89
12
SUMMARY
AND
OUTLOOK
.................................................................
93
13
ZUSAMMENFASSUNG
UND
AUSBLICK
...............................................
95
14
BIBLIOGRAPHY
..................................................................................
99
|
| adam_txt |
TABLE
OF
CONTENTS
LIST
OF
SYMBOLS
AND
ABBREVIATIONS
.
VII
1
INTRODUCTION
.
I
2
STATE
OF
THE
ART
AND
METHODS
.
3
2.1
AL
DIE
CASTING
.4
2.2
HOT-PRESSING
PROCESS
.
6
2.3
SYNOPSIS
.
8
2.4
CONVENTIONAL
JOINING
METHODS
IN
ELECTRONICS
PACKAGING
.
8
2.4.1
SOLDERING
.
9
2.4.2
MICRO
WELDING
.
9
2.4.3
WIRE
BONDING
.
9
2.4.4
GENERATION
OF
ELECTRICALLY
CONDUCTIVE
DROPLETS
.
10
3
OBJECTIVES
.
13
4
MATERIALS
AND
METHODS
.
15
4.1
FILLER
MATERIAL
.
15
4.2
LASER
DROP
ON
DEMAND
JOINING
(LDJ).
18
4.3
PREPARATION
OF
THE
JOINING
INTERFACE
.
19
5
SETUP
.
21
5.1
BEAM
SOURCE
.
21
5.2
PROCESS
GAS
ATMOSPHERE
.
26
5.3
CAPILLARY
.
26
5.4
PROCESS
SEQUENCE
.
29
5.5
BRAZE
PREFORMS
.
30
6
SYSTEM
QUALIFICATION
.
33
6.1
BEAM
GUIDANCE
AND
SHAPING
.
33
6.2
BRAZE
DETACHMENT
TIME
.
39
6.3
LONG-TERM
CAPILLARY
BEHAVIOUR
.
43
7
CAPILLARY
TIME-TEMPERATURE
EVOLUTION
.
49
7.1
NUMERICAL
MODEL
FOR
THE
EVALUATION
OF
THE
THERMAL
CYCLE
DURING
JOINING
.
49
7.2
WETTING
BEHAVIOUR
OF
THE
A1
2
O
3
CAPILLARY
AND
THE
MOLTEN
CUSNI2
BRAZE
.
53
7.3
TIME-TEMPERATURE
CYCLE
OF
THE
CAPILLARY
DURING
JOINING
.
54
7.4
SUMMARY
AND
CONCLUSIONS
.
56
8
IMPACT
OF
CAPILLARY
SHAPE
ON
GAS
VELOCITY
AND
DROPLET
TRAJECTORY
.
57
8.1
SIMULATION
.
57
8.2
MACHINING
.
59
8.3
DROPLET
TRACKING
USING
STEREOSCOPIC
HIGH-SPEED
IMAGING
.
62
8.3.1
LATERAL
POSITION
DEVIATION
.
66
8.3.2
DROPLET
VELOCITY
.
69
9
MECHANICAL
STRENGTH
OF
GENERATED
JOINTS
.
73
10
ANALYTIC
MODEL
OF
THE
PROCESS
ENERGY
BALANCE
.
81
11
SYNOPSIS
.
89
12
SUMMARY
AND
OUTLOOK
.
93
13
ZUSAMMENFASSUNG
UND
AUSBLICK
.
95
14
BIBLIOGRAPHY
.
99 |
| any_adam_object | 1 |
| any_adam_object_boolean | 1 |
| author | Stein, Stefan |
| author_GND | (DE-588)1255654910 |
| author_facet | Stein, Stefan |
| author_role | aut |
| author_sort | Stein, Stefan |
| author_variant | s s ss |
| building | Verbundindex |
| bvnumber | BV047944115 |
| classification_rvk | ZN 4192 |
| classification_tum | FER 661 PHY 379 |
| collection | ebook |
| ctrlnum | (OCoLC)1309080234 (DE-599)DNB1254527303 |
| discipline | Physik Fertigungstechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Physik Fertigungstechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.25593/978-3-96147-508-7 |
| format | Thesis Book |
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| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV047944115 |
| illustrated | Illustrated |
| index_date | 2024-07-03T19:35:56Z |
| indexdate | 2024-07-10T09:25:53Z |
| institution | BVB |
| institution_GND | (DE-588)1068111240 |
| isbn | 9783961475070 3961475075 9783961475087 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-033325560 |
| oclc_num | 1309080234 |
| open_access_boolean | 1 |
| owner | DE-29 DE-12 DE-29T DE-91 DE-BY-TUM DE-83 |
| owner_facet | DE-29 DE-12 DE-29T DE-91 DE-BY-TUM DE-83 |
| physical | x, 112 Seiten Illustrationen, Diagramme 24 cm x 17 cm, 404 g |
| psigel | ebook |
| publishDate | 2022 |
| publishDateSearch | 2022 |
| publishDateSort | 2022 |
| publisher | FAU University Press |
| record_format | marc |
| series | FAU Studien aus dem Maschinenbau |
| series2 | FAU Studien aus dem Maschinenbau |
| spelling | Stein, Stefan (DE-588)1255654910 aut Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements Stefan Stein Laserstrahlhartlöten mittels Lotformteil als Fügemethode für die Aufbau- und Verbindungstechnik für Hochtemperaturanwendungen Erlangen FAU University Press 2022 x, 112 Seiten Illustrationen, Diagramme 24 cm x 17 cm, 404 g txt rdacontent n rdamedia nc rdacarrier FAU Studien aus dem Maschinenbau Band 388 Dissertation Friedrich-Alexander-Universität Erlangen-Nürnberg 2021 Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Bonden (DE-588)4232594-8 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf Lasertechnologie (DE-588)4166821-2 gnd rswk-swf Actuator Löten Brazing Laser Verbindungstechnik Soldering Droplet Joining Electronics Packaging Smart Structure Casting Drop on demand (DE-588)4113937-9 Hochschulschrift gnd-content Lasertechnologie (DE-588)4166821-2 s DE-604 Bonden (DE-588)4232594-8 s Verbindungstechnik (DE-588)4129183-9 s Elektronisches Bauelement (DE-588)4014360-0 s FAU University Press ein Imprint der Universität Erlangen-Nürnberg Universitätsbibliothek (DE-588)1068111240 pbl Erscheint auch als Online-Ausgabe 10.25593/978-3-96147-508-7 urn:nbn:de:bvb:29-opus4-189155 FAU Studien aus dem Maschinenbau Band 388 (DE-604)BV045445989 388 https://open.fau.de/handle/openfau/18915 Verlag kostenfrei Volltext https://doi.org/10.25593/978-3-96147-508-7 Resolving-System kostenfrei Volltext https://nbn-resolving.org/urn:nbn:de:bvb:29-opus4-189155 Resolving-System kostenfrei Volltext DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=033325560&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis 1\p vlb 20220330 DE-101 https://d-nb.info/provenance/plan#vlb |
| spellingShingle | Stein, Stefan Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements FAU Studien aus dem Maschinenbau Elektronisches Bauelement (DE-588)4014360-0 gnd Bonden (DE-588)4232594-8 gnd Verbindungstechnik (DE-588)4129183-9 gnd Lasertechnologie (DE-588)4166821-2 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4232594-8 (DE-588)4129183-9 (DE-588)4166821-2 (DE-588)4113937-9 |
| title | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title_alt | Laserstrahlhartlöten mittels Lotformteil als Fügemethode für die Aufbau- und Verbindungstechnik für Hochtemperaturanwendungen |
| title_auth | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title_exact_search | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title_exact_search_txtP | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title_full | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements Stefan Stein |
| title_fullStr | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements Stefan Stein |
| title_full_unstemmed | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements Stefan Stein |
| title_short | Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| title_sort | laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements |
| topic | Elektronisches Bauelement (DE-588)4014360-0 gnd Bonden (DE-588)4232594-8 gnd Verbindungstechnik (DE-588)4129183-9 gnd Lasertechnologie (DE-588)4166821-2 gnd |
| topic_facet | Elektronisches Bauelement Bonden Verbindungstechnik Lasertechnologie Hochschulschrift |
| url | https://open.fau.de/handle/openfau/18915 https://doi.org/10.25593/978-3-96147-508-7 https://nbn-resolving.org/urn:nbn:de:bvb:29-opus4-189155 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=033325560&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| volume_link | (DE-604)BV045445989 |
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