Reliability of semiconductor lasers and optoelectronic devices:

Front Cover -- Reliability of Semiconductor Lasers and Optoelectronic Devices -- Copyright Page -- Dedication -- Contents -- List of contributors -- Preface -- Acknowledgments -- 1 Introduction to optoelectronic devices -- 1.1 Introduction -- 1.2 Optoelectronic applications -- 1.2.1 InGaN-based ligh...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Weitere Verfasser: Herrick, Robert (HerausgeberIn), Ueda, Osamu (MitwirkendeR)
Format: Buch
Sprache:English
Veröffentlicht: San Diego Elsevier [2021]
Schriftenreihe:Woodhead Publishing Series in Electronic and Optical Materials
Schlagworte:
Zusammenfassung:Front Cover -- Reliability of Semiconductor Lasers and Optoelectronic Devices -- Copyright Page -- Dedication -- Contents -- List of contributors -- Preface -- Acknowledgments -- 1 Introduction to optoelectronic devices -- 1.1 Introduction -- 1.2 Optoelectronic applications -- 1.2.1 InGaN-based light-emitting diodes for high-efficiency lighting -- 1.2.2 Lasers for sensing arrays -- 1.2.3 Lasers for data- and telecommunications -- 1.2.4 The history of the laser -- 1.3 Principles of operation for optoelectronic components -- 1.3.1 Light emission -- 1.3.1.1 Light emission in gas plasmas: a review -- 1.3.1.2 Stimulated emission in gas lasers -- 1.3.1.3 Spontaneous and stimulated emission from semiconductors -- 1.3.2 Light-emitting diodes -- 1.3.2.1 Carrier confinement -- 1.3.2.2 Light extraction -- 1.3.2.3 Heat extraction -- 1.3.2.4 "Rollover" or "droop" -- 1.3.2.5 "The green gap" -- 1.3.3 Lasers -- 1.3.3.1 What additional design features exist with lasers that are not present with an light-emitting diode? -- Adding a "population inversion" -- Adding waveguiding -- Adding mirrors -- 1.3.3.2 Vertical-cavity surface-emitting lasers -- 1.3.3.3 Direct modulation -- 1.3.4 Modulators -- 1.3.5 Photodetectors -- 1.3.5.1 Photodiodes -- 1.3.5.2 Avalanche photodiodes -- 1.4 Method of fabrication -- 1.4.1 Epitaxial growth -- 1.4.2 Wafer fabrication -- 1.4.3 Wafer test -- 1.4.4 Singulation and packaging -- 1.4.5 Burn-in -- 1.5 Critical metrics -- 1.5.1 Beam divergence -- 1.5.2 Single mode versus multimode -- 1.5.3 Coherence length -- 1.5.4 Power -- 1.5.5 Modulation rate -- 1.6 Laser and light-emitting diode reliability -- 1.6.1 Reliability qualification -- 1.6.2 Quality control -- 1.7 New technology developments -- 1.7.1 Fiber optics -- 1.7.2 The future of optoelectronic devices -- 1.7.2.1 Photonic integrated circuits -- 1.7.2.2 LiDAR.
Beschreibung:Description based on publisher supplied metadata and other sources
Beschreibung:xvi, 318 Seiten
ISBN:9780128192542

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