Silicon Wafer Bonding Technology for VLSI and MEMS Applications:
The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process
Saved in:
| Other Authors: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Stevenage
IET
2002
|
| Series: | Circuits, Devices and Systems
|
| Subjects: | |
| Online Access: | UBY01 Volltext |
| Summary: | The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process |
| Physical Description: | 1 Online-Ressource |
| ISBN: | 9781849193702 |
| DOI: | 10.1049/PBEP001E |
Staff View
MARC
| LEADER | 00000nmm a22000001c 4500 | ||
|---|---|---|---|
| 001 | BV047493586 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 211004s2002 xxk|||| o||u| ||||||eng d | ||
| 020 | |a 9781849193702 |9 978-1-84919-370-2 | ||
| 035 | |a (ZDB-100-IET)978-1-84919-370-2 | ||
| 035 | |a (OCoLC)1277019345 | ||
| 035 | |a (DE-599)BVBBV047493586 | ||
| 040 | |a DE-604 |b ger | ||
| 041 | 0 | |a eng | |
| 044 | |a xxk |c XA-GB | ||
| 049 | |a DE-706 | ||
| 084 | |a UP 7570 |0 (DE-625)146436: |2 rvk | ||
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 245 | 1 | 0 | |a Silicon Wafer Bonding Technology for VLSI and MEMS Applications |c S. Iyer (ed.) |
| 264 | 1 | |a Stevenage |b IET |c 2002 | |
| 300 | |a 1 Online-Ressource | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Circuits, Devices and Systems | |
| 520 | 3 | |a The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process | |
| 650 | 0 | 7 | |a Bonden |0 (DE-588)4232594-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Silicium |0 (DE-588)4077445-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Satellitenfunk |0 (DE-588)4138349-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Wafer |0 (DE-588)4294605-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikromechanik |0 (DE-588)4205811-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a VLSI |0 (DE-588)4117388-0 |2 gnd |9 rswk-swf |
| 653 | 0 | |a Bonding | |
| 653 | 0 | |a Electric resistance | |
| 653 | 0 | |a Grinding and polishing | |
| 653 | 0 | |a Integrated circuits--Very large scale integration | |
| 653 | 0 | |a Micromechanics | |
| 653 | 0 | |a Semiconductor wafers | |
| 653 | 0 | |a Silicon | |
| 653 | 0 | |a Silicon-on-insulator technology | |
| 653 | 0 | |a elemental semiconductors | |
| 653 | 0 | |a micromechanical devices | |
| 653 | 0 | |a polishing | |
| 653 | 0 | |a silicon | |
| 653 | 0 | |a silicon-on-insulator | |
| 653 | 0 | |a VLSI | |
| 653 | 0 | |a wafer bonding | |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Silicium |0 (DE-588)4077445-4 |D s |
| 689 | 0 | 1 | |a Wafer |0 (DE-588)4294605-0 |D s |
| 689 | 0 | 2 | |a Bonden |0 (DE-588)4232594-8 |D s |
| 689 | 0 | 3 | |a VLSI |0 (DE-588)4117388-0 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Silicium |0 (DE-588)4077445-4 |D s |
| 689 | 1 | 1 | |a Wafer |0 (DE-588)4294605-0 |D s |
| 689 | 1 | 2 | |a Bonden |0 (DE-588)4232594-8 |D s |
| 689 | 1 | 3 | |a Mikromechanik |0 (DE-588)4205811-9 |D s |
| 689 | 1 | |5 DE-604 | |
| 689 | 2 | 0 | |a Satellitenfunk |0 (DE-588)4138349-7 |D s |
| 689 | 2 | |5 DE-604 | |
| 700 | 1 | |a Iyer, Subramanian S. |4 edt | |
| 776 | 0 | |z 9780852960394 | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-1-84919-370-2 |
| 856 | 4 | 0 | |u https://doi.org/10.1049/PBEP001E |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-100-IET | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-032894808 | ||
| 966 | e | |u https://doi.org/10.1049/PBEP001E |l UBY01 |p ZDB-100-IET |x Verlag |3 Volltext | |
Record in the Search Index
| _version_ | 1804182820599365632 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author2 | Iyer, Subramanian S. |
| author2_role | edt |
| author2_variant | s s i ss ssi |
| author_facet | Iyer, Subramanian S. |
| building | Verbundindex |
| bvnumber | BV047493586 |
| classification_rvk | UP 7570 ZN 4192 |
| collection | ZDB-100-IET |
| ctrlnum | (ZDB-100-IET)978-1-84919-370-2 (OCoLC)1277019345 (DE-599)BVBBV047493586 |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1049/PBEP001E |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02913nmm a22007931c 4500</leader><controlfield tag="001">BV047493586</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">211004s2002 xxk|||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781849193702</subfield><subfield code="9">978-1-84919-370-2</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-100-IET)978-1-84919-370-2</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1277019345</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV047493586</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">xxk</subfield><subfield code="c">XA-GB</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-706</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">UP 7570</subfield><subfield code="0">(DE-625)146436:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Silicon Wafer Bonding Technology for VLSI and MEMS Applications</subfield><subfield code="c">S. Iyer (ed.)</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Stevenage</subfield><subfield code="b">IET</subfield><subfield code="c">2002</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Circuits, Devices and Systems</subfield></datafield><datafield tag="520" ind1="3" ind2=" "><subfield code="a">The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Silicium</subfield><subfield code="0">(DE-588)4077445-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Satellitenfunk</subfield><subfield code="0">(DE-588)4138349-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wafer</subfield><subfield code="0">(DE-588)4294605-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikromechanik</subfield><subfield code="0">(DE-588)4205811-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Bonding</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electric resistance</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Grinding and polishing</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Integrated circuits--Very large scale integration</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Micromechanics</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Semiconductor wafers</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Silicon</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Silicon-on-insulator technology</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">elemental semiconductors</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">micromechanical devices</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">polishing</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">silicon</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">silicon-on-insulator</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">VLSI</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">wafer bonding</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Silicium</subfield><subfield code="0">(DE-588)4077445-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Wafer</subfield><subfield code="0">(DE-588)4294605-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Silicium</subfield><subfield code="0">(DE-588)4077445-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="1"><subfield code="a">Wafer</subfield><subfield code="0">(DE-588)4294605-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="2"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="3"><subfield code="a">Mikromechanik</subfield><subfield code="0">(DE-588)4205811-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="2" ind2="0"><subfield code="a">Satellitenfunk</subfield><subfield code="0">(DE-588)4138349-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Iyer, Subramanian S.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2=" "><subfield code="z">9780852960394</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-1-84919-370-2</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1049/PBEP001E</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-100-IET</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032894808</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1049/PBEP001E</subfield><subfield code="l">UBY01</subfield><subfield code="p">ZDB-100-IET</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV047493586 |
| illustrated | Not Illustrated |
| index_date | 2024-07-03T18:16:14Z |
| indexdate | 2024-07-10T09:13:38Z |
| institution | BVB |
| isbn | 9781849193702 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032894808 |
| oclc_num | 1277019345 |
| open_access_boolean | |
| owner | DE-706 |
| owner_facet | DE-706 |
| physical | 1 Online-Ressource |
| psigel | ZDB-100-IET |
| publishDate | 2002 |
| publishDateSearch | 2002 |
| publishDateSort | 2002 |
| publisher | IET |
| record_format | marc |
| series2 | Circuits, Devices and Systems |
| spelling | Silicon Wafer Bonding Technology for VLSI and MEMS Applications S. Iyer (ed.) Stevenage IET 2002 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Circuits, Devices and Systems The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process Bonden (DE-588)4232594-8 gnd rswk-swf Silicium (DE-588)4077445-4 gnd rswk-swf Satellitenfunk (DE-588)4138349-7 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf Mikromechanik (DE-588)4205811-9 gnd rswk-swf VLSI (DE-588)4117388-0 gnd rswk-swf Bonding Electric resistance Grinding and polishing Integrated circuits--Very large scale integration Micromechanics Semiconductor wafers Silicon Silicon-on-insulator technology elemental semiconductors micromechanical devices polishing silicon silicon-on-insulator VLSI wafer bonding (DE-588)1071861417 Konferenzschrift gnd-content Silicium (DE-588)4077445-4 s Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s VLSI (DE-588)4117388-0 s DE-604 Mikromechanik (DE-588)4205811-9 s Satellitenfunk (DE-588)4138349-7 s Iyer, Subramanian S. edt 9780852960394 Erscheint auch als Druck-Ausgabe 978-1-84919-370-2 https://doi.org/10.1049/PBEP001E Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Silicon Wafer Bonding Technology for VLSI and MEMS Applications Bonden (DE-588)4232594-8 gnd Silicium (DE-588)4077445-4 gnd Satellitenfunk (DE-588)4138349-7 gnd Wafer (DE-588)4294605-0 gnd Mikromechanik (DE-588)4205811-9 gnd VLSI (DE-588)4117388-0 gnd |
| subject_GND | (DE-588)4232594-8 (DE-588)4077445-4 (DE-588)4138349-7 (DE-588)4294605-0 (DE-588)4205811-9 (DE-588)4117388-0 (DE-588)1071861417 |
| title | Silicon Wafer Bonding Technology for VLSI and MEMS Applications |
| title_auth | Silicon Wafer Bonding Technology for VLSI and MEMS Applications |
| title_exact_search | Silicon Wafer Bonding Technology for VLSI and MEMS Applications |
| title_exact_search_txtP | Silicon Wafer Bonding Technology for VLSI and MEMS Applications |
| title_full | Silicon Wafer Bonding Technology for VLSI and MEMS Applications S. Iyer (ed.) |
| title_fullStr | Silicon Wafer Bonding Technology for VLSI and MEMS Applications S. Iyer (ed.) |
| title_full_unstemmed | Silicon Wafer Bonding Technology for VLSI and MEMS Applications S. Iyer (ed.) |
| title_short | Silicon Wafer Bonding Technology for VLSI and MEMS Applications |
| title_sort | silicon wafer bonding technology for vlsi and mems applications |
| topic | Bonden (DE-588)4232594-8 gnd Silicium (DE-588)4077445-4 gnd Satellitenfunk (DE-588)4138349-7 gnd Wafer (DE-588)4294605-0 gnd Mikromechanik (DE-588)4205811-9 gnd VLSI (DE-588)4117388-0 gnd |
| topic_facet | Bonden Silicium Satellitenfunk Wafer Mikromechanik VLSI Konferenzschrift |
| url | https://doi.org/10.1049/PBEP001E |
| work_keys_str_mv | AT iyersubramanians siliconwaferbondingtechnologyforvlsiandmemsapplications |