Silicon Wafer Bonding Technology for VLSI and MEMS Applications:
The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process
Gespeichert in:
| Weitere Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Stevenage
IET
2002
|
| Schriftenreihe: | Circuits, Devices and Systems
|
| Schlagworte: | |
| Online-Zugang: | UBY01 Volltext |
| Zusammenfassung: | The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 9781849193702 |
| DOI: | 10.1049/PBEP001E |
Internformat
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Datensatz im Suchindex
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|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author2 | Iyer, Subramanian S. |
| author2_role | edt |
| author2_variant | s s i ss ssi |
| author_facet | Iyer, Subramanian S. |
| building | Verbundindex |
| bvnumber | BV047493586 |
| classification_rvk | UP 7570 ZN 4192 |
| collection | ZDB-100-IET |
| ctrlnum | (ZDB-100-IET)978-1-84919-370-2 (OCoLC)1277019345 (DE-599)BVBBV047493586 |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1049/PBEP001E |
| format | Electronic eBook |
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| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV047493586 |
| illustrated | Not Illustrated |
| index_date | 2024-07-03T18:16:14Z |
| indexdate | 2024-07-10T09:13:38Z |
| institution | BVB |
| isbn | 9781849193702 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032894808 |
| oclc_num | 1277019345 |
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| owner | DE-706 |
| owner_facet | DE-706 |
| physical | 1 Online-Ressource |
| psigel | ZDB-100-IET |
| publishDate | 2002 |
| publishDateSearch | 2002 |
| publishDateSort | 2002 |
| publisher | IET |
| record_format | marc |
| series2 | Circuits, Devices and Systems |
| spelling | Silicon Wafer Bonding Technology for VLSI and MEMS Applications S. Iyer (ed.) Stevenage IET 2002 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Circuits, Devices and Systems The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process Bonden (DE-588)4232594-8 gnd rswk-swf Silicium (DE-588)4077445-4 gnd rswk-swf Satellitenfunk (DE-588)4138349-7 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf Mikromechanik (DE-588)4205811-9 gnd rswk-swf VLSI (DE-588)4117388-0 gnd rswk-swf Bonding Electric resistance Grinding and polishing Integrated circuits--Very large scale integration Micromechanics Semiconductor wafers Silicon Silicon-on-insulator technology elemental semiconductors micromechanical devices polishing silicon silicon-on-insulator VLSI wafer bonding (DE-588)1071861417 Konferenzschrift gnd-content Silicium (DE-588)4077445-4 s Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s VLSI (DE-588)4117388-0 s DE-604 Mikromechanik (DE-588)4205811-9 s Satellitenfunk (DE-588)4138349-7 s Iyer, Subramanian S. edt 9780852960394 Erscheint auch als Druck-Ausgabe 978-1-84919-370-2 https://doi.org/10.1049/PBEP001E Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Silicon Wafer Bonding Technology for VLSI and MEMS Applications Bonden (DE-588)4232594-8 gnd Silicium (DE-588)4077445-4 gnd Satellitenfunk (DE-588)4138349-7 gnd Wafer (DE-588)4294605-0 gnd Mikromechanik (DE-588)4205811-9 gnd VLSI (DE-588)4117388-0 gnd |
| subject_GND | (DE-588)4232594-8 (DE-588)4077445-4 (DE-588)4138349-7 (DE-588)4294605-0 (DE-588)4205811-9 (DE-588)4117388-0 (DE-588)1071861417 |
| title | Silicon Wafer Bonding Technology for VLSI and MEMS Applications |
| title_auth | Silicon Wafer Bonding Technology for VLSI and MEMS Applications |
| title_exact_search | Silicon Wafer Bonding Technology for VLSI and MEMS Applications |
| title_exact_search_txtP | Silicon Wafer Bonding Technology for VLSI and MEMS Applications |
| title_full | Silicon Wafer Bonding Technology for VLSI and MEMS Applications S. Iyer (ed.) |
| title_fullStr | Silicon Wafer Bonding Technology for VLSI and MEMS Applications S. Iyer (ed.) |
| title_full_unstemmed | Silicon Wafer Bonding Technology for VLSI and MEMS Applications S. Iyer (ed.) |
| title_short | Silicon Wafer Bonding Technology for VLSI and MEMS Applications |
| title_sort | silicon wafer bonding technology for vlsi and mems applications |
| topic | Bonden (DE-588)4232594-8 gnd Silicium (DE-588)4077445-4 gnd Satellitenfunk (DE-588)4138349-7 gnd Wafer (DE-588)4294605-0 gnd Mikromechanik (DE-588)4205811-9 gnd VLSI (DE-588)4117388-0 gnd |
| topic_facet | Bonden Silicium Satellitenfunk Wafer Mikromechanik VLSI Konferenzschrift |
| url | https://doi.org/10.1049/PBEP001E |
| work_keys_str_mv | AT iyersubramanians siliconwaferbondingtechnologyforvlsiandmemsapplications |