APA (7th ed.) Citation

Kuroda, T., & Yip, W. c. 2. J. (2021). Wireless interface technologies for 3D IC and module integration. Cambridge University Press.

Chicago Style (17th ed.) Citation

Kuroda, Tadahiro, and Wai-Yeung ca. 20./21. Jh Yip. Wireless Interface Technologies for 3D IC and Module Integration. Cambridge: Cambridge University Press, 2021.

MLA (9th ed.) Citation

Kuroda, Tadahiro, and Wai-Yeung ca. 20./21. Jh Yip. Wireless Interface Technologies for 3D IC and Module Integration. Cambridge University Press, 2021.