Integrated circuit digital design methodology: advanced analysis and simulation

Course content reaffirmed: 06/2015--This tutorial will expand the analysis of delay and fanout to include the additional parasitic capacitance load that occurs from layout. A standardized method for converting capacitance to equivalent gate size will be presented, and the examples from Part 1 will b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Sheppard, Doug (VerfasserIn)
Format: Elektronisch Video
Sprache:English
Veröffentlicht: United States IEEE 2009
Schlagworte:
Online-Zugang:FHN01
TUM01
Zusammenfassung:Course content reaffirmed: 06/2015--This tutorial will expand the analysis of delay and fanout to include the additional parasitic capacitance load that occurs from layout. A standardized method for converting capacitance to equivalent gate size will be presented, and the examples from Part 1 will be reworked to include parasitic capacitance. It is imperative that there be a good understanding of how layout causes parasitic capacitance which can greatly affect the performance and functionality of a design. We will evaluate this by first reviewing the basics of layout with substantial focus on the metal interconnect layers and the types of capacitance the various structures create. Finally, a simulation methodology will be presented for incorporating the actual extracted layout into SPICE for an accurate analysis of the design
Beschreibung:Description based on online resource; title from title screen (IEEE Xplore Digital Library, viewed November 10, 2020)
Beschreibung:1 Online-Resource (1 Videodatei, 60 Minuten)
ISBN:9781424430031

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