Advanced materials for printed flexible electronics:
This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed f...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Cham, Switzerland
Springer
[2022]
|
| Schriftenreihe: | Springer series in materials science
Volume 317 |
| Schlagworte: | |
| Zusammenfassung: | This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics |
| Beschreibung: | xvii, 632 Seiten Illustrationen, Diagramme 235 mm |
| ISBN: | 9783030798031 |
Internformat
MARC
| LEADER | 00000nam a2200000 cb4500 | ||
|---|---|---|---|
| 001 | BV047447774 | ||
| 003 | DE-604 | ||
| 005 | 20211118 | ||
| 007 | t | ||
| 008 | 210831s2022 a||| |||| 00||| eng d | ||
| 020 | |a 9783030798031 |c hbk |9 978-3-030-79803-1 | ||
| 024 | 3 | |a 9783030798031 | |
| 035 | |a (OCoLC)1284788130 | ||
| 035 | |a (DE-599)BVBBV047447774 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-29T |a DE-92 | ||
| 084 | |a ZN 3400 |0 (DE-625)157307: |2 rvk | ||
| 100 | 1 | |a Tong, Xingcun Colin |e Verfasser |0 (DE-588)1144915996 |4 aut | |
| 245 | 1 | 0 | |a Advanced materials for printed flexible electronics |c Colin Tong |
| 264 | 1 | |a Cham, Switzerland |b Springer |c [2022] | |
| 300 | |a xvii, 632 Seiten |b Illustrationen, Diagramme |c 235 mm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Springer series in materials science |v Volume 317 | |
| 520 | |a This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics | ||
| 650 | 4 | |a Materials science | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Microelectronics | |
| 650 | 4 | |a Electronic circuits | |
| 650 | 4 | |a Manufactures | |
| 650 | 4 | |a Materials science | |
| 650 | 0 | 7 | |a Elektronik |0 (DE-588)4014346-6 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Folienisolierter Flachleiter |0 (DE-588)7525641-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Werkstoff |0 (DE-588)4065579-9 |2 gnd |9 rswk-swf |
| 653 | |a Hardcover, Softcover / Technik/Maschinenbau, Fertigungstechnik | ||
| 689 | 0 | 0 | |a Elektronik |0 (DE-588)4014346-6 |D s |
| 689 | 0 | 1 | |a Werkstoff |0 (DE-588)4065579-9 |D s |
| 689 | 0 | 2 | |a Folienisolierter Flachleiter |0 (DE-588)7525641-1 |D s |
| 689 | 0 | |5 DE-604 | |
| 776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe |z 978-3-030-79804-8 |
| 830 | 0 | |a Springer series in materials science |v Volume 317 |w (DE-604)BV000683335 |9 317 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-032849812 | ||
Datensatz im Suchindex
| _version_ | 1804182743293100032 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author | Tong, Xingcun Colin |
| author_GND | (DE-588)1144915996 |
| author_facet | Tong, Xingcun Colin |
| author_role | aut |
| author_sort | Tong, Xingcun Colin |
| author_variant | x c t xc xct |
| building | Verbundindex |
| bvnumber | BV047447774 |
| classification_rvk | ZN 3400 |
| ctrlnum | (OCoLC)1284788130 (DE-599)BVBBV047447774 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02991nam a2200493 cb4500</leader><controlfield tag="001">BV047447774</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20211118 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">210831s2022 a||| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783030798031</subfield><subfield code="c">hbk</subfield><subfield code="9">978-3-030-79803-1</subfield></datafield><datafield tag="024" ind1="3" ind2=" "><subfield code="a">9783030798031</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1284788130</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV047447774</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-29T</subfield><subfield code="a">DE-92</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 3400</subfield><subfield code="0">(DE-625)157307:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Tong, Xingcun Colin</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)1144915996</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advanced materials for printed flexible electronics</subfield><subfield code="c">Colin Tong</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cham, Switzerland</subfield><subfield code="b">Springer</subfield><subfield code="c">[2022]</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xvii, 632 Seiten</subfield><subfield code="b">Illustrationen, Diagramme</subfield><subfield code="c">235 mm</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Springer series in materials science</subfield><subfield code="v">Volume 317</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials science</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufactures</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials science</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektronik</subfield><subfield code="0">(DE-588)4014346-6</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Folienisolierter Flachleiter</subfield><subfield code="0">(DE-588)7525641-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Werkstoff</subfield><subfield code="0">(DE-588)4065579-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Hardcover, Softcover / Technik/Maschinenbau, Fertigungstechnik</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Elektronik</subfield><subfield code="0">(DE-588)4014346-6</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Werkstoff</subfield><subfield code="0">(DE-588)4065579-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Folienisolierter Flachleiter</subfield><subfield code="0">(DE-588)7525641-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Online-Ausgabe</subfield><subfield code="z">978-3-030-79804-8</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Springer series in materials science</subfield><subfield code="v">Volume 317</subfield><subfield code="w">(DE-604)BV000683335</subfield><subfield code="9">317</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032849812</subfield></datafield></record></collection> |
| id | DE-604.BV047447774 |
| illustrated | Illustrated |
| index_date | 2024-07-03T18:02:48Z |
| indexdate | 2024-07-10T09:12:24Z |
| institution | BVB |
| isbn | 9783030798031 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032849812 |
| oclc_num | 1284788130 |
| open_access_boolean | |
| owner | DE-29T DE-92 |
| owner_facet | DE-29T DE-92 |
| physical | xvii, 632 Seiten Illustrationen, Diagramme 235 mm |
| publishDate | 2022 |
| publishDateSearch | 2022 |
| publishDateSort | 2022 |
| publisher | Springer |
| record_format | marc |
| series | Springer series in materials science |
| series2 | Springer series in materials science |
| spelling | Tong, Xingcun Colin Verfasser (DE-588)1144915996 aut Advanced materials for printed flexible electronics Colin Tong Cham, Switzerland Springer [2022] xvii, 632 Seiten Illustrationen, Diagramme 235 mm txt rdacontent n rdamedia nc rdacarrier Springer series in materials science Volume 317 This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics Materials science Electronics Microelectronics Electronic circuits Manufactures Elektronik (DE-588)4014346-6 gnd rswk-swf Folienisolierter Flachleiter (DE-588)7525641-1 gnd rswk-swf Werkstoff (DE-588)4065579-9 gnd rswk-swf Hardcover, Softcover / Technik/Maschinenbau, Fertigungstechnik Elektronik (DE-588)4014346-6 s Werkstoff (DE-588)4065579-9 s Folienisolierter Flachleiter (DE-588)7525641-1 s DE-604 Erscheint auch als Online-Ausgabe 978-3-030-79804-8 Springer series in materials science Volume 317 (DE-604)BV000683335 317 |
| spellingShingle | Tong, Xingcun Colin Advanced materials for printed flexible electronics Springer series in materials science Materials science Electronics Microelectronics Electronic circuits Manufactures Elektronik (DE-588)4014346-6 gnd Folienisolierter Flachleiter (DE-588)7525641-1 gnd Werkstoff (DE-588)4065579-9 gnd |
| subject_GND | (DE-588)4014346-6 (DE-588)7525641-1 (DE-588)4065579-9 |
| title | Advanced materials for printed flexible electronics |
| title_auth | Advanced materials for printed flexible electronics |
| title_exact_search | Advanced materials for printed flexible electronics |
| title_exact_search_txtP | Advanced materials for printed flexible electronics |
| title_full | Advanced materials for printed flexible electronics Colin Tong |
| title_fullStr | Advanced materials for printed flexible electronics Colin Tong |
| title_full_unstemmed | Advanced materials for printed flexible electronics Colin Tong |
| title_short | Advanced materials for printed flexible electronics |
| title_sort | advanced materials for printed flexible electronics |
| topic | Materials science Electronics Microelectronics Electronic circuits Manufactures Elektronik (DE-588)4014346-6 gnd Folienisolierter Flachleiter (DE-588)7525641-1 gnd Werkstoff (DE-588)4065579-9 gnd |
| topic_facet | Materials science Electronics Microelectronics Electronic circuits Manufactures Elektronik Folienisolierter Flachleiter Werkstoff |
| volume_link | (DE-604)BV000683335 |
| work_keys_str_mv | AT tongxingcuncolin advancedmaterialsforprintedflexibleelectronics |