Holdings: 3D Microelectronic Packaging

3D Microelectronic Packaging: From Architectures to Applications

Saved in:

Bibliographic Details
Other Authors:	Li, Yan (Editor), Goyal, Deepak (Editor)
Format:	Electronic eBook
Language:	English
Published:	Singapore Springer Singapore 2021 Singapore Springer
Edition:	2nd ed. 2021
Series:	Springer Series in Advanced Microelectronics 64
Subjects:	Electronic Circuits and Devices Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Microengineering Nanotechnology and Microengineering Metallic Materials Electronic circuits Electronics Microelectronics Optical materials Electronic materials Biotechnology Nanotechnology Metals
Online Access:	BTU01 FAB01 FAW01 FAW02 FCO01 FHA01 FHD01 FHI01 FHM01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 HTW01 TUM01 UBY01 UER01 Volltext
Physical Description:	1 Online-Ressource (XVII, 622 p. 299 illus., 205 illus. in color)
ISBN:	9789811570902
ISSN:	1437-0387
DOI:	10.1007/978-981-15-7090-2

Staff View

MARC


LEADER	00000nmm a2200000zcb4500
001	BV047047554
003	DE-604
005	20240129
007	cr\|uuu---uuuuu
008	201207s2021 \|\|\|\| o\|\|u\| \|\|\|\|\|\|eng d
020			\|a 9789811570902 \|c Online \|9 978-981-157-090-2
024	7		\|a 10.1007/978-981-15-7090-2 \|2 doi
035			\|a (ZDB-2-ENG)9789811570902
035			\|a (OCoLC)1226707218
035			\|a (DE-599)BVBBV047047554
040			\|a DE-604 \|b ger \|e rda
041	0		\|a eng
049			\|a DE-859 \|a DE-860 \|a DE-91 \|a DE-1046 \|a DE-1043 \|a DE-Aug4 \|a DE-898 \|a DE-861 \|a DE-523 \|a DE-29 \|a DE-863 \|a DE-1050 \|a DE-862 \|a DE-92 \|a DE-573 \|a DE-M347 \|a DE-706 \|a DE-634 \|a DE-1047 \|a DE-858 \|a DE-83
082	0		\|a 621.3815 \|2 23
084			\|a ELT 000 \|2 stub
084			\|a MAS 000 \|2 stub
245	1	0	\|a 3D Microelectronic Packaging \|b From Architectures to Applications \|c edited by Yan Li, Deepak Goyal
250			\|a 2nd ed. 2021
264		1	\|a Singapore \|b Springer Singapore \|c 2021
264		1	\|a Singapore \|b Springer
300			\|a 1 Online-Ressource (XVII, 622 p. 299 illus., 205 illus. in color)
336			\|b txt \|2 rdacontent
337			\|b c \|2 rdamedia
338			\|b cr \|2 rdacarrier
490	0		\|a Springer Series in Advanced Microelectronics \|v 64 \|x 1437-0387
650		4	\|a Electronic Circuits and Devices
650		4	\|a Electronics and Microelectronics, Instrumentation
650		4	\|a Optical and Electronic Materials
650		4	\|a Microengineering
650		4	\|a Nanotechnology and Microengineering
650		4	\|a Metallic Materials
650		4	\|a Electronic circuits
650		4	\|a Electronics
650		4	\|a Microelectronics
650		4	\|a Optical materials
650		4	\|a Electronic materials
650		4	\|a Biotechnology
650		4	\|a Nanotechnology
650		4	\|a Metals
700	1		\|a Li, Yan \|4 edt
700	1		\|a Goyal, Deepak \|4 edt
776	0	8	\|i Erscheint auch als \|n Druck-Ausgabe \|z 978-981-157-089-6
776	0	8	\|i Erscheint auch als \|n Druck-Ausgabe \|z 978-981-157-091-9
776	0	8	\|i Erscheint auch als \|n Druck-Ausgabe \|z 978-981-157-092-6
856	4	0	\|u https://doi.org/10.1007/978-981-15-7090-2 \|x Verlag \|z URL des Erstveröffentlichers \|3 Volltext
912			\|a ZDB-2-ENG
940	1		\|q ZDB-2-ENG_2021
999			\|a oai:aleph.bib-bvb.de:BVB01-032454956
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l BTU01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FAB01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FAW01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FAW02 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FCO01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FHA01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FHD01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FHI01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FHM01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FHN01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FHR01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FKE01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FLA01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FRO01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FWS01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l FWS02 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l HTW01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l TUM01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l UBY01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-981-15-7090-2 \|l UER01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext

Record in the Search Index

DE-BY-FWS_katkey	862375
_version_	1824555042242297856
adam_txt
any_adam_object
any_adam_object_boolean
author2	Li, Yan Goyal, Deepak
author2_role	edt edt
author2_variant	y l yl d g dg
author_facet	Li, Yan Goyal, Deepak
building	Verbundindex
bvnumber	BV047047554
classification_tum	ELT 000 MAS 000
collection	ZDB-2-ENG
ctrlnum	(ZDB-2-ENG)9789811570902 (OCoLC)1226707218 (DE-599)BVBBV047047554
dewey-full	621.3815
dewey-hundreds	600 - Technology (Applied sciences)
dewey-ones	621 - Applied physics
dewey-raw	621.3815
dewey-search	621.3815
dewey-sort	3621.3815
dewey-tens	620 - Engineering and allied operations
discipline	Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau
discipline_str_mv	Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau
doi_str_mv	10.1007/978-981-15-7090-2
edition	2nd ed. 2021
format	Electronic eBook
fullrecord	<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>04105nmm a2200841zcb4500</leader><controlfield tag="001">BV047047554</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20240129 </controlfield><controlfield tag="007">cr\|uuu---uuuuu</controlfield><controlfield tag="008">201207s2021 \|\|\|\| o\|\|u\| \|\|\|\|\|\|eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789811570902</subfield><subfield code="c">Online</subfield><subfield code="9">978-981-157-090-2</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-981-15-7090-2</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)9789811570902</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1226707218</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV047047554</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-859</subfield><subfield code="a">DE-860</subfield><subfield code="a">DE-91</subfield><subfield code="a">DE-1046</subfield><subfield code="a">DE-1043</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-861</subfield><subfield code="a">DE-523</subfield><subfield code="a">DE-29</subfield><subfield code="a">DE-863</subfield><subfield code="a">DE-1050</subfield><subfield code="a">DE-862</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-M347</subfield><subfield code="a">DE-706</subfield><subfield code="a">DE-634</subfield><subfield code="a">DE-1047</subfield><subfield code="a">DE-858</subfield><subfield code="a">DE-83</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">MAS 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">3D Microelectronic Packaging</subfield><subfield code="b">From Architectures to Applications</subfield><subfield code="c">edited by Yan Li, Deepak Goyal</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">2nd ed. 2021</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">Springer Singapore</subfield><subfield code="c">2021</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">Springer</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (XVII, 622 p. 299 illus., 205 illus. in color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Springer Series in Advanced Microelectronics</subfield><subfield code="v">64</subfield><subfield code="x">1437-0387</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic Circuits and Devices</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microengineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology and Microengineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metallic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Biotechnology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metals</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Li, Yan</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Goyal, Deepak</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-981-157-089-6</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-981-157-091-9</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-981-157-092-6</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2021</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032454956</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FAB01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FAW02</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FCO01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FHA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FHD01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FHM01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FHR01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FKE01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FLA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FRO01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FWS01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">FWS02</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">HTW01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">TUM01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">UBY01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-15-7090-2</subfield><subfield code="l">UER01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection>
id	DE-604.BV047047554
illustrated	Not Illustrated
index_date	2024-07-03T16:07:22Z
indexdate	2025-02-20T07:01:22Z
institution	BVB
isbn	9789811570902
issn	1437-0387
language	English
oai_aleph_id	oai:aleph.bib-bvb.de:BVB01-032454956
oclc_num	1226707218
open_access_boolean
owner	DE-859 DE-860 DE-91 DE-BY-TUM DE-1046 DE-1043 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-523 DE-29 DE-863 DE-BY-FWS DE-1050 DE-862 DE-BY-FWS DE-92 DE-573 DE-M347 DE-706 DE-634 DE-1047 DE-858 DE-83
owner_facet	DE-859 DE-860 DE-91 DE-BY-TUM DE-1046 DE-1043 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-523 DE-29 DE-863 DE-BY-FWS DE-1050 DE-862 DE-BY-FWS DE-92 DE-573 DE-M347 DE-706 DE-634 DE-1047 DE-858 DE-83
physical	1 Online-Ressource (XVII, 622 p. 299 illus., 205 illus. in color)
psigel	ZDB-2-ENG ZDB-2-ENG_2021
publishDate	2021
publishDateSearch	2021
publishDateSort	2021
publisher	Springer Singapore Springer
record_format	marc
series2	Springer Series in Advanced Microelectronics
spellingShingle	3D Microelectronic Packaging From Architectures to Applications Electronic Circuits and Devices Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Microengineering Nanotechnology and Microengineering Metallic Materials Electronic circuits Electronics Microelectronics Optical materials Electronic materials Biotechnology Nanotechnology Metals
title	3D Microelectronic Packaging From Architectures to Applications
title_auth	3D Microelectronic Packaging From Architectures to Applications
title_exact_search	3D Microelectronic Packaging From Architectures to Applications
title_exact_search_txtP	3D Microelectronic Packaging From Architectures to Applications
title_full	3D Microelectronic Packaging From Architectures to Applications edited by Yan Li, Deepak Goyal
title_fullStr	3D Microelectronic Packaging From Architectures to Applications edited by Yan Li, Deepak Goyal
title_full_unstemmed	3D Microelectronic Packaging From Architectures to Applications edited by Yan Li, Deepak Goyal
title_short	3D Microelectronic Packaging
title_sort	3d microelectronic packaging from architectures to applications
title_sub	From Architectures to Applications
topic	Electronic Circuits and Devices Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Microengineering Nanotechnology and Microengineering Metallic Materials Electronic circuits Electronics Microelectronics Optical materials Electronic materials Biotechnology Nanotechnology Metals
topic_facet	Electronic Circuits and Devices Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Microengineering Nanotechnology and Microengineering Metallic Materials Electronic circuits Electronics Microelectronics Optical materials Electronic materials Biotechnology Nanotechnology Metals
url	https://doi.org/10.1007/978-981-15-7090-2
work_keys_str_mv	AT liyan 3dmicroelectronicpackagingfromarchitecturestoapplications AT goyaldeepak 3dmicroelectronicpackagingfromarchitecturestoapplications

Holdings

Get full text

MARC

Record in the Search Index

Similar Items