3D Microelectronic Packaging: From Architectures to Applications
Gespeichert in:
| Weitere Verfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Singapore
Springer Singapore
2021
Singapore Springer |
| Ausgabe: | 2nd ed. 2021 |
| Schriftenreihe: | Springer Series in Advanced Microelectronics
64 |
| Schlagworte: | |
| Online-Zugang: | BTU01 FAB01 FAW01 FAW02 FCO01 FHA01 FHD01 FHI01 FHM01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 HTW01 TUM01 UBY01 UER01 Volltext |
| Beschreibung: | 1 Online-Ressource (XVII, 622 p. 299 illus., 205 illus. in color) |
| ISBN: | 9789811570902 |
| ISSN: | 1437-0387 |
| DOI: | 10.1007/978-981-15-7090-2 |
Internformat
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Datensatz im Suchindex
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| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| discipline_str_mv | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| doi_str_mv | 10.1007/978-981-15-7090-2 |
| edition | 2nd ed. 2021 |
| format | Electronic eBook |
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| id | DE-604.BV047047554 |
| illustrated | Not Illustrated |
| index_date | 2024-07-03T16:07:22Z |
| indexdate | 2025-02-20T07:01:22Z |
| institution | BVB |
| isbn | 9789811570902 |
| issn | 1437-0387 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032454956 |
| oclc_num | 1226707218 |
| open_access_boolean | |
| owner | DE-859 DE-860 DE-91 DE-BY-TUM DE-1046 DE-1043 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-523 DE-29 DE-863 DE-BY-FWS DE-1050 DE-862 DE-BY-FWS DE-92 DE-573 DE-M347 DE-706 DE-634 DE-1047 DE-858 DE-83 |
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| physical | 1 Online-Ressource (XVII, 622 p. 299 illus., 205 illus. in color) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2021 |
| publishDate | 2021 |
| publishDateSearch | 2021 |
| publishDateSort | 2021 |
| publisher | Springer Singapore Springer |
| record_format | marc |
| series2 | Springer Series in Advanced Microelectronics |
| spellingShingle | 3D Microelectronic Packaging From Architectures to Applications Electronic Circuits and Devices Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Microengineering Nanotechnology and Microengineering Metallic Materials Electronic circuits Electronics Microelectronics Optical materials Electronic materials Biotechnology Nanotechnology Metals |
| title | 3D Microelectronic Packaging From Architectures to Applications |
| title_auth | 3D Microelectronic Packaging From Architectures to Applications |
| title_exact_search | 3D Microelectronic Packaging From Architectures to Applications |
| title_exact_search_txtP | 3D Microelectronic Packaging From Architectures to Applications |
| title_full | 3D Microelectronic Packaging From Architectures to Applications edited by Yan Li, Deepak Goyal |
| title_fullStr | 3D Microelectronic Packaging From Architectures to Applications edited by Yan Li, Deepak Goyal |
| title_full_unstemmed | 3D Microelectronic Packaging From Architectures to Applications edited by Yan Li, Deepak Goyal |
| title_short | 3D Microelectronic Packaging |
| title_sort | 3d microelectronic packaging from architectures to applications |
| title_sub | From Architectures to Applications |
| topic | Electronic Circuits and Devices Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Microengineering Nanotechnology and Microengineering Metallic Materials Electronic circuits Electronics Microelectronics Optical materials Electronic materials Biotechnology Nanotechnology Metals |
| topic_facet | Electronic Circuits and Devices Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Microengineering Nanotechnology and Microengineering Metallic Materials Electronic circuits Electronics Microelectronics Optical materials Electronic materials Biotechnology Nanotechnology Metals |
| url | https://doi.org/10.1007/978-981-15-7090-2 |
| work_keys_str_mv | AT liyan 3dmicroelectronicpackagingfromarchitecturestoapplications AT goyaldeepak 3dmicroelectronicpackagingfromarchitecturestoapplications |