Lead-free soldering process development and reliability:
Gespeichert in:
Weitere Verfasser: | |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Hoboken, New Jersey
Wiley
2020
|
Schriftenreihe: | Wiley Series in Quality & Reliability Engineering
|
Schlagworte: | |
Online-Zugang: | FHA01 |
Beschreibung: | Includes bibliographical references and index |
Beschreibung: | 1 Online-Ressource (515 Seiten) |
ISBN: | 9781119482048 |
Internformat
MARC
LEADER | 00000nmm a2200000zc 4500 | ||
---|---|---|---|
001 | BV047004504 | ||
003 | DE-604 | ||
005 | 20210331 | ||
007 | cr|uuu---uuuuu | ||
008 | 201118s2020 |||| o||u| ||||||eng d | ||
020 | |a 9781119482048 |9 978-1-119-48204-8 | ||
024 | 7 | |a 10.1002/9781119482093 |2 doi | |
035 | |a (ZDB-30-PQE)EBC6229588 | ||
035 | |a (OCoLC)1224016698 | ||
035 | |a (DE-599)BVBBV047004504 | ||
040 | |a DE-604 |b ger |e rda | ||
041 | 0 | |a eng | |
049 | |a DE-Aug4 | ||
082 | 0 | |a 621.381/046 | |
245 | 1 | 0 | |a Lead-free soldering process development and reliability |c edited by Jasbir Bath |
264 | 1 | |a Hoboken, New Jersey |b Wiley |c 2020 | |
300 | |a 1 Online-Ressource (515 Seiten) | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a Wiley Series in Quality & Reliability Engineering | |
500 | |a Includes bibliographical references and index | ||
650 | 4 | |a Electronic packaging | |
650 | 4 | |a Solder and soldering | |
700 | 1 | |a Bath, Jasbir |4 edt | |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9781119482031 |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9781119482031 |
912 | |a ZDB-30-PQE |a ZDB-35-WIC | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-032412042 | ||
966 | e | |u https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093 |l FHA01 |p ZDB-35-WIC |q FHA_PDA_WIC_Kauf |x Verlag |3 Volltext |
Datensatz im Suchindex
_version_ | 1804181955389947904 |
---|---|
adam_txt | |
any_adam_object | |
any_adam_object_boolean | |
author2 | Bath, Jasbir |
author2_role | edt |
author2_variant | j b jb |
author_facet | Bath, Jasbir |
building | Verbundindex |
bvnumber | BV047004504 |
collection | ZDB-30-PQE ZDB-35-WIC |
ctrlnum | (ZDB-30-PQE)EBC6229588 (OCoLC)1224016698 (DE-599)BVBBV047004504 |
dewey-full | 621.381/046 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381/046 |
dewey-search | 621.381/046 |
dewey-sort | 3621.381 246 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01362nmm a2200385zc 4500</leader><controlfield tag="001">BV047004504</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20210331 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">201118s2020 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119482048</subfield><subfield code="9">978-1-119-48204-8</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1002/9781119482093</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-30-PQE)EBC6229588</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1224016698</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV047004504</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-Aug4</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/046</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Lead-free soldering process development and reliability</subfield><subfield code="c">edited by Jasbir Bath</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Hoboken, New Jersey</subfield><subfield code="b">Wiley</subfield><subfield code="c">2020</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (515 Seiten)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Wiley Series in Quality & Reliability Engineering</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Solder and soldering</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Bath, Jasbir</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9781119482031</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9781119482031</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-30-PQE</subfield><subfield code="a">ZDB-35-WIC</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032412042</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093</subfield><subfield code="l">FHA01</subfield><subfield code="p">ZDB-35-WIC</subfield><subfield code="q">FHA_PDA_WIC_Kauf</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
id | DE-604.BV047004504 |
illustrated | Not Illustrated |
index_date | 2024-07-03T15:57:58Z |
indexdate | 2024-07-10T08:59:52Z |
institution | BVB |
isbn | 9781119482048 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032412042 |
oclc_num | 1224016698 |
open_access_boolean | |
owner | DE-Aug4 |
owner_facet | DE-Aug4 |
physical | 1 Online-Ressource (515 Seiten) |
psigel | ZDB-30-PQE ZDB-35-WIC ZDB-35-WIC FHA_PDA_WIC_Kauf |
publishDate | 2020 |
publishDateSearch | 2020 |
publishDateSort | 2020 |
publisher | Wiley |
record_format | marc |
series2 | Wiley Series in Quality & Reliability Engineering |
spelling | Lead-free soldering process development and reliability edited by Jasbir Bath Hoboken, New Jersey Wiley 2020 1 Online-Ressource (515 Seiten) txt rdacontent c rdamedia cr rdacarrier Wiley Series in Quality & Reliability Engineering Includes bibliographical references and index Electronic packaging Solder and soldering Bath, Jasbir edt Erscheint auch als Druck-Ausgabe 9781119482031 |
spellingShingle | Lead-free soldering process development and reliability Electronic packaging Solder and soldering |
title | Lead-free soldering process development and reliability |
title_auth | Lead-free soldering process development and reliability |
title_exact_search | Lead-free soldering process development and reliability |
title_exact_search_txtP | Lead-free soldering process development and reliability |
title_full | Lead-free soldering process development and reliability edited by Jasbir Bath |
title_fullStr | Lead-free soldering process development and reliability edited by Jasbir Bath |
title_full_unstemmed | Lead-free soldering process development and reliability edited by Jasbir Bath |
title_short | Lead-free soldering process development and reliability |
title_sort | lead free soldering process development and reliability |
topic | Electronic packaging Solder and soldering |
topic_facet | Electronic packaging Solder and soldering |
work_keys_str_mv | AT bathjasbir leadfreesolderingprocessdevelopmentandreliability |