Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Abschlussarbeit Buch |
| Sprache: | English |
| Veröffentlicht: |
Berlin
2020
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| Schlagworte: | |
| Online-Zugang: | Abstract Inhaltsverzeichnis |
| Beschreibung: | xv, 238 Seiten Illustrationen, Diagramme |
Internformat
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Datensatz im Suchindex
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| spelling | Hu, Xiaodong Verfasser (DE-588)1220246611 aut Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS vorgelegt von M.Sc. Xiaodong Hu Berlin 2020 xv, 238 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Dissertation Technische Universität Berlin 2020xv, 238 Seiten (DE-588)4113937-9 Hochschulschrift gnd-content http://verlag.tu-berlin.de/abstracts/diss/hu_xiaodong_abstract.pdf Abstract http://verlag.tu-berlin.de/abstracts/diss/hu_xiaodong_inhalt.pdf Inhaltsverzeichnis |
| spellingShingle | Hu, Xiaodong Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS |
| subject_GND | (DE-588)4113937-9 |
| title | Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS |
| title_auth | Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS |
| title_exact_search | Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS |
| title_exact_search_txtP | Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS |
| title_full | Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS vorgelegt von M.Sc. Xiaodong Hu |
| title_fullStr | Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS vorgelegt von M.Sc. Xiaodong Hu |
| title_full_unstemmed | Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS vorgelegt von M.Sc. Xiaodong Hu |
| title_short | Influence of bonding temperature and material on anodic bonding for stress sensitive MEMS |
| title_sort | influence of bonding temperature and material on anodic bonding for stress sensitive mems |
| topic_facet | Hochschulschrift |
| url | http://verlag.tu-berlin.de/abstracts/diss/hu_xiaodong_abstract.pdf http://verlag.tu-berlin.de/abstracts/diss/hu_xiaodong_inhalt.pdf |
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