Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement:
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Boca Raton ; London ; New York
CRC Press, Taylor & Francis Group
[2019]
|
| Schlagworte: | |
| Beschreibung: | xiii, 226 Seiten Illustrationen, Diagramme 24 cm |
| ISBN: | 9780367023430 |
Internformat
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| 264 | 1 | |a Boca Raton ; London ; New York |b CRC Press, Taylor & Francis Group |c [2019] | |
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| 999 | |a oai:aleph.bib-bvb.de:BVB01-032341200 | ||
Datensatz im Suchindex
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| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| id | DE-604.BV046932292 |
| illustrated | Illustrated |
| index_date | 2024-07-03T15:34:55Z |
| indexdate | 2024-07-10T08:57:51Z |
| institution | BVB |
| isbn | 9780367023430 |
| language | English |
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| physical | xiii, 226 Seiten Illustrationen, Diagramme 24 cm |
| publishDate | 2019 |
| publishDateSearch | 2019 |
| publishDateSort | 2019 |
| publisher | CRC Press, Taylor & Francis Group |
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| spelling | Ma, Yue Verfasser aut Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand Boca Raton ; London ; New York CRC Press, Taylor & Francis Group [2019] xiii, 226 Seiten Illustrationen, Diagramme 24 cm txt rdacontent n rdamedia nc rdacarrier Three-dimensional integrated circuits Three-dimensional integrated circuits fast Gontrand, Christian Verfasser (DE-588)1185986553 aut |
| spellingShingle | Ma, Yue Gontrand, Christian Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Three-dimensional integrated circuits Three-dimensional integrated circuits fast |
| title | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_auth | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_exact_search | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_exact_search_txtP | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_full | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand |
| title_fullStr | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand |
| title_full_unstemmed | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand |
| title_short | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_sort | power thermal noise and signal integrity issues on substrate interconnects entanglement |
| topic | Three-dimensional integrated circuits Three-dimensional integrated circuits fast |
| topic_facet | Three-dimensional integrated circuits |
| work_keys_str_mv | AT mayue powerthermalnoiseandsignalintegrityissuesonsubstrateinterconnectsentanglement AT gontrandchristian powerthermalnoiseandsignalintegrityissuesonsubstrateinterconnectsentanglement |