Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging:
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Bibliographic Details
Main Author: Wei, Xing-Chang (Author)
Format: Book
Language:English
Published: Boca Raton ; London ; New York CRC Press 2020
Subjects:
Online Access:Inhaltsverzeichnis
Item Description:Includes bibliographical references and index
Physical Description:xviii, 322 Seiten Illustrationen, Diagramme 24 cm
ISBN:9780367573669

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