Wei, X. (2020). Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging. CRC Press.
Chicago-Zitierstil (17. Ausg.)Wei, Xing-Chang. Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging. Boca Raton ; London ; New York: CRC Press, 2020.
MLA-Zitierstil (9. Ausg.)Wei, Xing-Chang. Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging. CRC Press, 2020.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.