Encyclopedia of packaging materials, processes, and mechanics: Set 1: Interconnect and wafer bonding technology (in 4 Volumes) 3 Flexible chip I/O interconnects
Gespeichert in:
| Weitere Verfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Singapore
World Scientific Publishing
2020
|
| Schlagworte: | |
| Beschreibung: | xii, 149 Seiten Illustrationen, Diagramme |
| ISBN: | 9789811201141 9811201145 |
Internformat
MARC
| LEADER | 00000nam a2200000 cc4500 | ||
|---|---|---|---|
| 001 | BV046896182 | ||
| 003 | DE-604 | ||
| 005 | 20201208 | ||
| 007 | t | ||
| 008 | 200911s2020 a||| |||| 00||| eng d | ||
| 020 | |a 9789811201141 |9 978-981-12-0114-1 | ||
| 020 | |a 9811201145 |9 981-12-0114-5 | ||
| 035 | |a (OCoLC)1226699726 | ||
| 035 | |a (DE-599)BVBBV046896182 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-634 | ||
| 100 | 1 | |a Bar-Cohen, Avram |d 1946- |0 (DE-588)1068301791 |4 edt | |
| 245 | 1 | 0 | |a Encyclopedia of packaging materials, processes, and mechanics |b Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |n 3 |p Flexible chip I/O interconnects |c editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay |
| 264 | 1 | |a Singapore |b World Scientific Publishing |c 2020 | |
| 300 | |a xii, 149 Seiten |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 0 | 7 | |a Bonden |0 (DE-588)4232594-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Chip |0 (DE-588)4197163-2 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Chip |0 (DE-588)4197163-2 |D s |
| 689 | 0 | 1 | |a Bonden |0 (DE-588)4232594-8 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Suhling, Jeffrey C. |4 edt | |
| 700 | 1 | |a Tay, Andrew A. O. |4 edt | |
| 773 | 0 | 8 | |w (DE-604)BV046896178 |g 3 |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-032305941 | ||
Datensatz im Suchindex
| _version_ | 1804181764354080768 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author2 | Bar-Cohen, Avram 1946- Suhling, Jeffrey C. Tay, Andrew A. O. |
| author2_role | edt edt edt |
| author2_variant | a b c abc j c s jc jcs a a o t aao aaot |
| author_GND | (DE-588)1068301791 |
| author_facet | Bar-Cohen, Avram 1946- Suhling, Jeffrey C. Tay, Andrew A. O. |
| building | Verbundindex |
| bvnumber | BV046896182 |
| ctrlnum | (OCoLC)1226699726 (DE-599)BVBBV046896182 |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01328nam a2200361 cc4500</leader><controlfield tag="001">BV046896182</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20201208 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">200911s2020 a||| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789811201141</subfield><subfield code="9">978-981-12-0114-1</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9811201145</subfield><subfield code="9">981-12-0114-5</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1226699726</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046896182</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-634</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Bar-Cohen, Avram</subfield><subfield code="d">1946-</subfield><subfield code="0">(DE-588)1068301791</subfield><subfield code="4">edt</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Encyclopedia of packaging materials, processes, and mechanics</subfield><subfield code="b">Set 1: Interconnect and wafer bonding technology (in 4 Volumes)</subfield><subfield code="n">3</subfield><subfield code="p">Flexible chip I/O interconnects</subfield><subfield code="c">editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">World Scientific Publishing</subfield><subfield code="c">2020</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xii, 149 Seiten</subfield><subfield code="b">Illustrationen, Diagramme</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Chip</subfield><subfield code="0">(DE-588)4197163-2</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Chip</subfield><subfield code="0">(DE-588)4197163-2</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Suhling, Jeffrey C.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Tay, Andrew A. O.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="w">(DE-604)BV046896178</subfield><subfield code="g">3</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032305941</subfield></datafield></record></collection> |
| id | DE-604.BV046896182 |
| illustrated | Illustrated |
| index_date | 2024-07-03T15:22:43Z |
| indexdate | 2024-07-10T08:56:50Z |
| institution | BVB |
| isbn | 9789811201141 9811201145 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032305941 |
| oclc_num | 1226699726 |
| open_access_boolean | |
| owner | DE-634 |
| owner_facet | DE-634 |
| physical | xii, 149 Seiten Illustrationen, Diagramme |
| publishDate | 2020 |
| publishDateSearch | 2020 |
| publishDateSort | 2020 |
| publisher | World Scientific Publishing |
| record_format | marc |
| spelling | Bar-Cohen, Avram 1946- (DE-588)1068301791 edt Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) 3 Flexible chip I/O interconnects editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay Singapore World Scientific Publishing 2020 xii, 149 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Bonden (DE-588)4232594-8 gnd rswk-swf Chip (DE-588)4197163-2 gnd rswk-swf Chip (DE-588)4197163-2 s Bonden (DE-588)4232594-8 s DE-604 Suhling, Jeffrey C. edt Tay, Andrew A. O. edt (DE-604)BV046896178 3 |
| spellingShingle | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) Bonden (DE-588)4232594-8 gnd Chip (DE-588)4197163-2 gnd |
| subject_GND | (DE-588)4232594-8 (DE-588)4197163-2 |
| title | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |
| title_auth | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |
| title_exact_search | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |
| title_exact_search_txtP | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |
| title_full | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) 3 Flexible chip I/O interconnects editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay |
| title_fullStr | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) 3 Flexible chip I/O interconnects editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay |
| title_full_unstemmed | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) 3 Flexible chip I/O interconnects editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay |
| title_short | Encyclopedia of packaging materials, processes, and mechanics |
| title_sort | encyclopedia of packaging materials processes and mechanics set 1 interconnect and wafer bonding technology in 4 volumes flexible chip i o interconnects |
| title_sub | Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |
| topic | Bonden (DE-588)4232594-8 gnd Chip (DE-588)4197163-2 gnd |
| topic_facet | Bonden Chip |
| volume_link | (DE-604)BV046896178 |
| work_keys_str_mv | AT barcohenavram encyclopediaofpackagingmaterialsprocessesandmechanicsset1interconnectandwaferbondingtechnologyin4volumes3 AT suhlingjeffreyc encyclopediaofpackagingmaterialsprocessesandmechanicsset1interconnectandwaferbondingtechnologyin4volumes3 AT tayandrewao encyclopediaofpackagingmaterialsprocessesandmechanicsset1interconnectandwaferbondingtechnologyin4volumes3 |