Encyclopedia of packaging materials, processes, and mechanics: Set 1: Interconnect and wafer bonding technology (in 4 Volumes) 1 Flip-chip and underfill materials and technology
Gespeichert in:
| Weitere Verfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Singapore
World Scientific Publishing
2020
|
| Schlagworte: | |
| Beschreibung: | ix, 158 Seiten Illustrationen, Diagramme |
| ISBN: | 9789811201127 9811201129 |
Internformat
MARC
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| 245 | 1 | 0 | |a Encyclopedia of packaging materials, processes, and mechanics |b Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |n 1 |p Flip-chip and underfill materials and technology |c editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay |
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Datensatz im Suchindex
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| id | DE-604.BV046896180 |
| illustrated | Illustrated |
| index_date | 2024-07-03T15:22:43Z |
| indexdate | 2024-07-10T08:56:50Z |
| institution | BVB |
| isbn | 9789811201127 9811201129 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032305939 |
| oclc_num | 1226703086 |
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| owner_facet | DE-634 |
| physical | ix, 158 Seiten Illustrationen, Diagramme |
| publishDate | 2020 |
| publishDateSearch | 2020 |
| publishDateSort | 2020 |
| publisher | World Scientific Publishing |
| record_format | marc |
| spelling | Bar-Cohen, Avram 1946- (DE-588)1068301791 edt Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) 1 Flip-chip and underfill materials and technology editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay Singapore World Scientific Publishing 2020 ix, 158 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Flip-Chip-Technologie (DE-588)4427284-4 gnd rswk-swf Flip-Chip-Technologie (DE-588)4427284-4 s DE-604 Suhling, Jeffrey C. edt Tay, Andrew A. O. edt (DE-604)BV046896178 1 |
| spellingShingle | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) Flip-Chip-Technologie (DE-588)4427284-4 gnd |
| subject_GND | (DE-588)4427284-4 |
| title | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |
| title_auth | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |
| title_exact_search | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |
| title_exact_search_txtP | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |
| title_full | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) 1 Flip-chip and underfill materials and technology editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay |
| title_fullStr | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) 1 Flip-chip and underfill materials and technology editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay |
| title_full_unstemmed | Encyclopedia of packaging materials, processes, and mechanics Set 1: Interconnect and wafer bonding technology (in 4 Volumes) 1 Flip-chip and underfill materials and technology editor-in-chief, Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay |
| title_short | Encyclopedia of packaging materials, processes, and mechanics |
| title_sort | encyclopedia of packaging materials processes and mechanics set 1 interconnect and wafer bonding technology in 4 volumes flip chip and underfill materials and technology |
| title_sub | Set 1: Interconnect and wafer bonding technology (in 4 Volumes) |
| topic | Flip-Chip-Technologie (DE-588)4427284-4 gnd |
| topic_facet | Flip-Chip-Technologie |
| volume_link | (DE-604)BV046896178 |
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